公开(公告)号：WO03045124A3

公开(公告)日：2003-08-28

申请号：PCT/EP0212410

申请日：2002-11-07

Applicant: ERICSSON TELEFON AB L M ,  SANDEVI TOMMY ,  MEYNERT HANS ,  FAGRENIUS GUSTAV ,  PALMQVIST FREDRIK ,  WAHLUND JESPER ,  ROSENGREN PETER

Inventor： SANDEVI TOMMY ,  MEYNERT HANS ,  FAGRENIUS GUSTAV ,  PALMQVIST FREDRIK ,  WAHLUND JESPER ,  ROSENGREN PETER

IPC: H05K9/00

CPC classification number: H05K9/0032

Abstract: An electronic unit 10 has a shield can 20, which comprises a conductive housing 30 and a first connecting device 40. The shield can 20 is detachably attached to a printed circuit board unit 50, which comprises a printed circuit board 51 and a second connecting device 60. The shield can 20 is attached to the printed circuit board unit 50 by means of its first connecting device 40 being detachably connected to the second connecting device 60 on the printed circuit board 51.

Abstract translation: 电子单元10具有屏蔽罐20，其包括导电壳体30和第一连接装置40.屏蔽罩20可拆卸地附接到印刷电路板单元50，印刷电路板单元50包括印刷电路板51和第二连接装置 屏蔽罩20借助于其第一连接装置40可拆卸地连接到印刷电路板51上的第二连接装置60而附接到印刷电路板单元50。

公开(公告)号：AU2002361956A1

公开(公告)日：2003-06-10

申请号：AU2002361956

申请日：2002-11-07

Applicant: ERICSSON TELEFON AB L M

Inventor： SANDEVI TOMMY ,  MEYNERT HANS ,  FAGRENIUS GUSTAV ,  PALMQVIST FREDRIK ,  WAHLUND JESPER ,  ROSENGREN PETER

IPC: H05K9/00

公开(公告)号：SE9704894L

公开(公告)日：1999-06-30

申请号：SE9704894

申请日：1997-12-29

Applicant: ERICSSON TELEFON AB L M

Inventor： HOLMBERG PER ,  SANDEVI TOMMY ,  FRIMAN DANIEL

IPC: H05K3/34 ,  H05K3/32 ,  H05K9/00 ,  H05K3/10

Abstract: In a method of producing a printed board assembly from a printed board, components are furnace soldered to the printed board. A string of heat curing, electrically conductive material, elastic after curing, is deposited around the site where the components to be shielded, are to be furnace soldered. That string is cured into a shielding gasket in the furnace soldering step, i.e. in the same production step as the components are furnace soldered to the printed board. The shielding gasket is adapted to cooperate with a shielding housing to shield the components.

公开(公告)号：HU0100628A2

公开(公告)日：2001-07-30

申请号：HU0100628

申请日：1998-12-18

Applicant: ERICSSON TELEFON AB L M

Inventor： FRIMAN DANIEL ,  HOLMBERG PER ,  SANDEVI TOMMY

IPC: H05K3/34 ,  H05K3/32 ,  H05K9/00

Abstract: In a method of producing a printed board assembly from a printed board, components are furnace soldered to the printed board. A string of heat curing, electrically conductive material, elastic after curing, is deposited around the site where the components to be shielded, are to be furnace soldered. That string is cured into a shielding gasket in the furnace soldering step, i.e. in the same production step as the components are furnace soldered to the printed board. The shielding gasket is adapted to cooperate with a shielding housing to shield the components.

公开(公告)号：SE9704894D0

公开(公告)日：1997-12-29

申请号：SE9704894

申请日：1997-12-29

Applicant: ERICSSON TELEFON AB L M

Inventor： HOLMBERG PER ,  SANDEVI TOMMY ,  FRIMAN DANIEL

IPC: H05K3/34 ,  H05K3/32 ,  H05K9/00 ,  H05K

Abstract: In a method of producing a printed board assembly from a printed board, components are furnace soldered to the printed board. A string of heat curing, electrically conductive material, elastic after curing, is deposited around the site where the components to be shielded, are to be furnace soldered. That string is cured into a shielding gasket in the furnace soldering step, i.e. in the same production step as the components are furnace soldered to the printed board. The shielding gasket is adapted to cooperate with a shielding housing to shield the components.

公开(公告)号：SE520529C2

公开(公告)日：2003-07-22

申请号：SE0004850

申请日：2000-12-27

Applicant: ERICSSON TELEFON AB L M

Inventor： SANDEVI TOMMY ,  FAGRENIUS GUSTAV

IPC: B29C45/16 ,  H05K20060101 ,  H05K9/00

Abstract: The cans are comprised of plastic housing, conductive inlay and conductive gasket, respectively. The can is formed in single mold by using a multi-k mold procedure. An Independent claim is included for shield can.

公开(公告)号：SE0004850L

公开(公告)日：2002-06-28

申请号：SE0004850

申请日：2000-12-27

Applicant: ERICSSON TELEFON AB L M

Inventor： SANDEVI TOMMY ,  FAGRENIUS GUSTAV

IPC: B29C45/16 ,  H05K20060101 ,  H05K9/00

公开(公告)号：AU743764B2

公开(公告)日：2002-02-07

申请号：AU2193399

申请日：1998-12-18

Applicant: ERICSSON TELEFON AB L M

Inventor： HOLMBERG PER ,  SANDEVI TOMMY ,  FRIMAN DANIEL

IPC: H05K3/34 ,  H05K3/32 ,  H05K9/00

Abstract: In a method of producing a printed board assembly from a printed board, components are furnace soldered to the printed board. A string of heat curing, electrically conductive material, elastic after curing, is deposited around the site where the components to be shielded, are to be furnace soldered. That string is cured into a shielding gasket in the furnace soldering step, i.e. in the same production step as the components are furnace soldered to the printed board. The shielding gasket is adapted to cooperate with a shielding housing to shield the components.

公开(公告)号：AU2193399A

公开(公告)日：1999-07-19

申请号：AU2193399

申请日：1998-12-18

Applicant: ERICSSON TELEFON AB L M

Inventor： HOLMBERG PER ,  SANDEVI TOMMY ,  FRIMAN DANIEL

IPC: H05K3/34 ,  H05K3/32 ,  H05K9/00

Abstract: In a method of producing a printed board assembly from a printed board, components are furnace soldered to the printed board. A string of heat curing, electrically conductive material, elastic after curing, is deposited around the site where the components to be shielded, are to be furnace soldered. That string is cured into a shielding gasket in the furnace soldering step, i.e. in the same production step as the components are furnace soldered to the printed board. The shielding gasket is adapted to cooperate with a shielding housing to shield the components.

公开(公告)号：MY120468A

公开(公告)日：2005-10-31

申请号：MYPI9805682

申请日：1998-12-16

Applicant: ERICSSON TELEFON AB L M

Inventor： HOLMBERG PER ,  SANDEVI TOMMY ,  FRIMAN DANIEL

IPC: H05K3/34 ,  H05K9/00 ,  H05K3/32

Abstract: IN A METHOD OF PRODUCING A PRINTED BOARD (1) ASSEMBLY FROM A PRINTED BOARD (1), COMPONENTS ARE FURNACE SOLDERED TO THE PRINTED BOARD. A STRING (6) OF HEAT CURING, ELECTRICALLY CONDUCTIVE MATERIAL, ELASTIC AFTER CURING, IS DEPOSITED AROUND THE SITE WHERE THE COMPONENTS (7) TO BE SHIELDED, ARE TO BE FURNACE SOLDERED. THAT STRING (6) IS CURED INTO A SHIELDING GASKET IN THE FURNACE SOLDERING STEP, I.E. IN THE SAME PRODUCTION STEP AS THE COMPONENTS (7) ARE FURNACE SOLDERED TO THE PRINTED BOARD (1). THE SHIELDING GASKET IS ADAPTED TO COOPERATE WITH A SHIELDING HOUSING TO SHIELD THE COMPONENTS (7).