1.
    发明专利
    未知

    公开(公告)号:AT396048T

    公开(公告)日:2008-06-15

    申请号:AT04292954

    申请日:2004-12-10

    Applicant: ESSILOR INT IBM

    Abstract: A stamp for patterning onto a receiving surface (103) of an object (101) according to a defined pattern (P) comprises a stamping surface (21) of a resilient diaphragm (20). The stamping surface (21) is planar at rest. The pattern (P) is reproduced on the stamping surface (21) and the diaphragm (20) is affixed to a rigid body (13) along a peripheral edge, so that a middle part of the diaphragm (20) can move along a direction perpendicular to the stamping surface (21). The diaphragm (20) is more flexible near the peripheral edge than in the middle part. Then, the pattern (P) printed on a pseudo-spherical receiving surface (103) using the stamp exhibits few distortion.

    2.
    发明专利
    未知

    公开(公告)号:DE602004014002D1

    公开(公告)日:2008-07-03

    申请号:DE602004014002

    申请日:2004-12-10

    Applicant: ESSILOR INT IBM

    Abstract: A stamp for patterning onto a receiving surface (103) of an object (101) according to a defined pattern (P) comprises a stamping surface (21) of a resilient diaphragm (20). The stamping surface (21) is planar at rest. The pattern (P) is reproduced on the stamping surface (21) and the diaphragm (20) is affixed to a rigid body (13) along a peripheral edge, so that a middle part of the diaphragm (20) can move along a direction perpendicular to the stamping surface (21). The diaphragm (20) is more flexible near the peripheral edge than in the middle part. Then, the pattern (P) printed on a pseudo-spherical receiving surface (103) using the stamp exhibits few distortion.

    Cooling device, cooling system and heat conduction method
    3.
    发明专利
    Cooling device, cooling system and heat conduction method 有权
    冷却装置,冷却系统和热传导方法

    公开(公告)号:JP2007142390A

    公开(公告)日:2007-06-07

    申请号:JP2006294961

    申请日:2006-10-30

    CPC classification number: H01L23/4735 H01L2924/0002 H01L2924/00

    Abstract: PROBLEM TO BE SOLVED: To provide a collision cooling device which is in contact with a microprocessor.
    SOLUTION: This invention includes a cooling device comprising parallel return paths and having a lot of collision injection ports closely arranged with spaces adjacent to a collision gap 42. This invention also includes a method for, by using branching hierarchy manifolds alternatively engaged, supplying a cooling agent flow to the collision injection ports with less pressure drop as much as possible. Further, a surface extension structure extending to the collision gap 42 forms a U-shaped micro channel between a single collision injection port and a single exit.
    COPYRIGHT: (C)2007,JPO&INPIT

    Abstract translation: 要解决的问题:提供与微处理器接触的碰撞冷却装置。 解决方案:本发明包括一种冷却装置,该冷却装置包括平行返回路径,并且具有大量碰撞注入口,其紧密地布置有与碰撞间隙42相邻的空间。本发明还包括一种通过使用交替接合的分支层级歧管的方法, 尽可能地以较少的压降将冷却剂流提供给碰撞注入口。 此外,延伸到碰撞间隙42的表面延伸结构在单个碰撞注入口和单个出口之间形成U形微通道。 版权所有(C)2007,JPO&INPIT

Patent Agency Ranking