公开(公告)号：AT396048T

公开(公告)日：2008-06-15

申请号：AT04292954

申请日：2004-12-10

Applicant: ESSILOR INT ,  IBM

Inventor： SCHMID HEINZ ,  MICHEL BRUNO ,  KLOTER URS ,  KELLER GERHARD ,  CANO JEAN-PAUL

IPC: B41F17/00 ,  B29C33/30 ,  B29C33/42 ,  B29C39/02 ,  B29C39/10 ,  B41F17/30

Abstract: A stamp for patterning onto a receiving surface (103) of an object (101) according to a defined pattern (P) comprises a stamping surface (21) of a resilient diaphragm (20). The stamping surface (21) is planar at rest. The pattern (P) is reproduced on the stamping surface (21) and the diaphragm (20) is affixed to a rigid body (13) along a peripheral edge, so that a middle part of the diaphragm (20) can move along a direction perpendicular to the stamping surface (21). The diaphragm (20) is more flexible near the peripheral edge than in the middle part. Then, the pattern (P) printed on a pseudo-spherical receiving surface (103) using the stamp exhibits few distortion.

公开(公告)号：DE602004014002D1

公开(公告)日：2008-07-03

申请号：DE602004014002

申请日：2004-12-10

Applicant: ESSILOR INT ,  IBM

Inventor： SCHMID HEINZ ,  MICHEL BRUNO ,  KLOTER URS ,  KELLER GERHARD ,  CANO JEAN-PAUL

IPC: B41F17/00 ,  B29C33/30 ,  B29C33/42 ,  B29C39/02 ,  B29C39/10 ,  B41F17/30

Abstract: A stamp for patterning onto a receiving surface (103) of an object (101) according to a defined pattern (P) comprises a stamping surface (21) of a resilient diaphragm (20). The stamping surface (21) is planar at rest. The pattern (P) is reproduced on the stamping surface (21) and the diaphragm (20) is affixed to a rigid body (13) along a peripheral edge, so that a middle part of the diaphragm (20) can move along a direction perpendicular to the stamping surface (21). The diaphragm (20) is more flexible near the peripheral edge than in the middle part. Then, the pattern (P) printed on a pseudo-spherical receiving surface (103) using the stamp exhibits few distortion.

公开(公告)号：WO2014191872A3

公开(公告)日：2015-04-16

申请号：PCT/IB2014061592

申请日：2014-05-21

Applicant: IBM ,  IBM CHINA INVEST CO LTD ,  IBM RES GMBH

Inventor： GUSAT MIRCEA ,  MICHEL BRUNO ,  MORF THOMAS E ,  RAGOT SEBASTIEN ,  SOIMU MARIA

IPC: G02B6/43 ,  H04B10/272 ,  H04B10/275

CPC classification number: H05K7/20772 ,  H04B10/25

Abstract: An electronic circuit device is provided, comprising a combined optical transmission and cooling fluid conduit network (100), wherein the network comprises at least one cooling conduit (101-103) that comprises an optical transmission medium (60), the network configured to convey a cooling fluid (50) via said at least one cooling conduit and an electromagnetic signal (70) via said optical transmission medium, such that the network is arranged in thermal communication with a first set of one or more components (11-15) of the electronic circuit device and in signal communication with a second set of one or more components (10-12a) of the electronic circuit device, and the first set and second set of component are at least partly overlapping. The corresponding method for conveying optical signal in such an electronic circuit device is also provided.

Abstract translation: 提供了一种电子电路装置，其包括组合的光传输和冷却流体导管网络（100），其中该网络包括至少一个包括光传输介质（60）的冷却导管（101-103），所述网络被配置为传送 经由所述至少一个冷却导管的冷却流体（50）和经由所述光传输介质的电磁信号（70），使得所述网络布置成与第一组一个或多个部件（11-15）热连通 所述电子电路装置和与所述电子电路装置的第二组一个或多个组件（10-12a）信号通信，以及所述第一组和第二组件至少部分重叠。 还提供了用于在这种电子电路装置中传送光信号的相应方法。

公开(公告)号：WO2013144751A9

公开(公告)日：2014-03-13

申请号：PCT/IB2013051852

申请日：2013-03-08

Applicant: IBM ,  EGYPT NANOTECHNOLOGY CT EGNC ,  IBM RES GMBH

Inventor： ESCHER WERNER ,  GHANNAM RAMI ,  MICHEL BRUNO ,  PAREDES STEPHAN

IPC: H01L31/052

CPC classification number: H01L31/056 ,  F24J2/07 ,  F24J2/10 ,  F24J2/202 ,  F24J2/22 ,  F24J2002/0092 ,  H01L31/0547 ,  H02S40/44 ,  Y02E10/41 ,  Y02E10/44 ,  Y02E10/52 ,  Y02E10/60

Abstract: The invention is notably directed to a photovoltaic thermal hybrid solar receiver (20), comprising: a photovoltaic module (21) and a thermal collector (22). The latter extends in a first plane (220); it comprises an aperture (68). The photovoltaic module (21) is designed for electrical output power (Po) delivery; it comprises a photo-active area (212) that extends in a second plane (210) at a distance (232) from the first plane (220). The photo-active area is located vis-à-vis the aperture, i.e., a projection of the aperture perpendicularly to the second plane corresponds to the photo-active area.

Abstract translation: 本发明特别涉及一种光伏热混合太阳能接收器（20），包括：光伏模块（21）和热收集器（22）。 后者在第一平面（220）中延伸; 它包括孔（68）。 光电模块（21）被设计用于电输出功率（Po）输送; 它包括在与第一平面（220）一定距离（232）的第二平面（210）中延伸的光有源区（212）。 光活性区域相对于孔径定位，即垂直于第二平面的孔的投影对应于光活性区域。

公开(公告)号：JP2007142390A

公开(公告)日：2007-06-07

申请号：JP2006294961

申请日：2006-10-30

Applicant: Internatl Business Mach Corp ,  インターナショナル・ビジネス・マシーンズ・コーポレーションInternational Business Maschines Corporation

Inventor： MICHEL BRUNO ,  THOMAS J BRUNSCHWILER ,  ROTHUIZEN HUGO E ,  KLOTER URS ,  LINDERMAN RYAN J

IPC: H01L23/473 ,  H05K7/20

CPC classification number: H01L23/4735 ,  H01L2924/0002 ,  H01L2924/00

Abstract: PROBLEM TO BE SOLVED: To provide a collision cooling device which is in contact with a microprocessor.
SOLUTION: This invention includes a cooling device comprising parallel return paths and having a lot of collision injection ports closely arranged with spaces adjacent to a collision gap 42. This invention also includes a method for, by using branching hierarchy manifolds alternatively engaged, supplying a cooling agent flow to the collision injection ports with less pressure drop as much as possible. Further, a surface extension structure extending to the collision gap 42 forms a U-shaped micro channel between a single collision injection port and a single exit.
COPYRIGHT: (C)2007,JPO&INPIT

Abstract translation: 要解决的问题：提供与微处理器接触的碰撞冷却装置。 解决方案：本发明包括一种冷却装置，该冷却装置包括平行返回路径，并且具有大量碰撞注入口，其紧密地布置有与碰撞间隙42相邻的空间。本发明还包括一种通过使用交替接合的分支层级歧管的方法， 尽可能地以较少的压降将冷却剂流提供给碰撞注入口。 此外，延伸到碰撞间隙42的表面延伸结构在单个碰撞注入口和单个出口之间形成U形微通道。 版权所有（C）2007，JPO＆INPIT

公开(公告)号：WO2013144751A3

公开(公告)日：2014-01-23

申请号：PCT/IB2013051852

申请日：2013-03-08

Applicant: IBM ,  EGYPT NANOTECHNOLOGY CT EGNC ,  IBM RES GMBH

Inventor： ESCHER WERNER ,  GHANNAM RAMI ,  MICHEL BRUNO ,  PAREDES STEPHAN

IPC: H01L31/052

CPC classification number: H01L31/056 ,  F24J2/07 ,  F24J2/10 ,  F24J2/202 ,  F24J2/22 ,  F24J2002/0092 ,  H01L31/0547 ,  H02S40/44 ,  Y02E10/41 ,  Y02E10/44 ,  Y02E10/52 ,  Y02E10/60

Abstract: The invention is notably directed to a photovoltaic thermal hybrid solar receiver (20), comprising: a photovoltaic module (21) and a thermal collector (22). The latter extends in a first plane (220); it comprises an aperture (68). The photovoltaic module (21) is designed for electrical output power (Po) delivery; it comprises a photo-active area (212) that extends in a second plane (210) at a distance (232) from the first plane (220). The photo-active area is located vis-à-vis the aperture, i.e., a projection of the aperture perpendicularly to the second plane corresponds to the photo-active area.

Abstract translation: 本发明特别涉及一种光伏热混合太阳能接收器（20），包括：光伏模块（21）和集热器（22）。 后者在第一平面（220）中延伸; 它包括一个孔（68）。 光伏模块（21）被设计用于电输出功率（Po）输送; 它包括在距离第一平面（220）一定距离（232）的第二平面（210）中延伸的光敏区域（212）。 光敏区域相对于孔径定位，即孔径垂直于第二平面的投影对应于光敏区域。

公开(公告)号：WO2013144749A3

公开(公告)日：2014-01-23

申请号：PCT/IB2013051850

申请日：2013-03-08

Applicant: IBM ,  EGYPT NANOTECHNOLOGY CT EGNC ,  IBM RES GMBH

Inventor： ESCHER WERNER ,  GHANNAM RAMI ,  MICHEL BRUNO ,  PAREDES STEPHAN

IPC: H01L31/052

CPC classification number: H02S40/44 ,  F24J2/07 ,  F24J2/10 ,  F24J2/202 ,  F24J2/22 ,  F24J2002/0092 ,  H01L31/0521 ,  H01L31/0547 ,  H02S10/20 ,  H02S20/00 ,  H02S20/10 ,  Y02E10/41 ,  Y02E10/44 ,  Y02E10/52 ,  Y02E10/60

Abstract: The invention is notably directed to methods of operating photovoltaic thermal hybrid systems (10). A such system (10) comprises: a hybrid solar receiver (20), having a photovoltaic module (21), operatively coupled to the system to deliver an electrical output power (P0) for a power user; and a thermal collector (22) distinct from the photovoltaic module. The photovoltaic module and/or the thermal collector are movably mounted in the system. The system further comprises a collector thermal storage (42) thermally connected to the thermal collector to store heat collected at the thermal collector; and positioning means (30) adapted to move the photovoltaic module and/or the thermal collector. The method comprises instructing (S30) the positioning means to move the photovoltaic module and/or the thermal collector to change a ratio of an intensity of radiation received (S10) at the photovoltaic module to an intensity of radiation received (S10) at the thermal collector.

Abstract translation: 本发明特别涉及操作光伏热混合系统（10）的方法。 一种这样的系统（10）包括：混合式太阳能接收器（20），具有光伏模块（21），可操作地耦合到所述系统以传递用于电力用户的电力输出功率（P0） 和与光伏模块不同的热收集器（22）。 光伏模块和/或热收集器可移动地安装在系统中。 所述系统还包括与所述热收集器热连接以收集在所述热收集器处收集的热的收集器热存储器（42） 以及适于移动光伏模块和/或热收集器的定位装置（30）。 该方法包括指示（S30）定位装置移动光伏模块和/或热收集器以改变在光伏模块处接收的辐射强度（S10）与所接收的辐射强度（S10）的比率 集电极。

公开(公告)号：JP2003260861A

公开(公告)日：2003-09-16

申请号：JP2003014127

申请日：2003-01-23

Applicant: IBM

Inventor： BIEBUYCK HANS A ,  MICHEL BRUNO

IPC: B41M1/14 ,  B41M3/00

Abstract: PROBLEM TO BE SOLVED: To provide a method for multi-color printing in a single step without the necessity to register a position. SOLUTION: This printing method performs a printing work by applying the process to selectively fill microcontainers of an elastic stamp with color inks to a single printing master. In addition, the method comprises the steps of sequentially filling stamp hollows with a color ink (1040) selected for printing through a plurality of rollers of different colors (941) covered with a lid layer (1010) having an opening part at a position which is aligned to an appropriate stamp hollow, and bringing a stamp face into contact with the surfaces of printing media (96 and 1060), tightly fitted to a surface shape under an outer force and the elastic force of a stamp layer and simultaneously sealing the periphery of openings of the stamp hollows and limiting the transfer of a color ink to the printing media (96 and 1060) to the medium part coming into contact with the hollow openings. COPYRIGHT: (C)2003,JPO

公开(公告)号：JP2002294469A

公开(公告)日：2002-10-09

申请号：JP2002084108

申请日：2002-03-25

Applicant: IBM

Inventor： BIETSCH ALEXANDER ,  DELAMARCHE EMMANUEL ,  GEISSLER MATTHIAS ,  MICHEL BRUNO ,  SCHMIDT HEINZ

IPC: C23F1/00 ,  C23F1/02 ,  C23F1/34 ,  C23F1/40 ,  H01L21/768

Abstract: PROBLEM TO BE SOLVED: To provide a fine structure by etching a substrate having a region covered with self-assembly monomolecule(SAM). SOLUTION: A wet etching system for selectively forming a pattern on the substrate having the region covered with SAM and controlling an etching profile, includes (a) a fluid etching solution, and (b) additives having higher affinity for the region covered with the SAM than for the other region. The method for selectively forming the pattern on the substrate having the region covered with the SAM and controlling the etching profile, includes (a) a step of providing a fluid etching solution, (b) a step of adding the additives having the higher affinity for the region covered with SAM than for the other region to the above etching solution, and (c) a step of etching the above substrate with the above fluid etching solution containing the above additives.

公开(公告)号：JP2003218498A

公开(公告)日：2003-07-31

申请号：JP2002290197

申请日：2002-10-02

Applicant: IBM

Inventor： PAUL S ANDREE ,  JOHN C FLAKE ,  MICHEL BRUNO ,  TSUJIMURA TAKATOSHI

IPC: G02F1/1343 ,  G09F9/00 ,  H01L21/02 ,  H01L21/28 ,  H01L21/288 ,  H01L21/768 ,  H01L51/50 ,  H05K3/18 ,  H05K3/38 ,  H05B33/14

Abstract: PROBLEM TO BE SOLVED: To provide a method of forming pattern, a semiconductor device and a metal conductive pattern. SOLUTION: A method of forming pattern includes the steps of: preparing a substrate; (202) forming an insulating layer having OH functional groups on a surface of the insulating layer; (203) forming a patterned polymer layer on the insulating layer; patterning the polymer layer by etching the insulating layer; exposing the insulating layer by peeling off (205) the polymer layer; and (207) selectively depositing conductive materials on the insulating layer. COPYRIGHT: (C)2003,JPO