Abstract:
A photocathode (300) having a gate electrode (307) so that modulation of the resulting electron beam is accomplished independently of the light beam (303). The photocathode includes a transparent substrate (301), a photoemitter (302), and an electrically separate gate electrode (307) surrounding an emission region of the photoemitter. The electron beam emission from the emission region is modulated by voltages supplied to the gate electrode. In addition, the gate electrode may have multiple segments that are capable of shaping the electron beam in response to voltages supplied individually to each of the multiple segments.
Abstract:
A lithographic apparatus using an array of charged particle (electron) beam columns, where the array includes a plurality of charged particle beam columns that each selectively expose a target to a plurality of charged particle beams. Each charged particle beam column includes a beam source that selectively generates a plurality of charged particle beams; an anode coaxial with the charged particle beams and that accelerates the plurality of charged particle beams from the beam source; and a lens coaxial with the charged particle beams and that demagnifies the charged particle beams. The beam source is a photocathode array that selectively supplies multiple electron beams when illuminated.
Abstract:
A photocathode having a gate electrode so that modulation of the resulting electron beam is accomplished independently of the laser beam. The photocathode includes a transparent substrate, a photoemitter, and an electrically separate gate electrode surrounding an emission region of the photoemitter. The electron beam emission from the emission region is modulated by voltages supplied to the gate electrode. In addition, the gate electrode may have multiple segments that are capable of shaping the electron beam in response to voltages supplied individually to each of the multiple segments.
Abstract:
In electron beam lithography, a lithography system uses multiple microcolumns in an array to increase throughput for direct writing of semiconductor wafers. The mismatch between the microcolumn array and the semiconductor die periodicity is resolved by using only one microcolumn to scan each individual die. This is accomplished by assuring that the stage carrying the semiconductor wafer moves a total distance in each of the X and Y directions which is greater than the pitch between adjacent die. Hence each die is scanned by only a single microcolumn although at possibly different times during the total stage motion.
Abstract:
A raster scan lithography system is modified so that the duration of illumination (dose modulation) for particular pixels is varied to lie between the full on and full off normally used. For instance, three levels of pixel intensity are provided, 100%, 70% and 30% (in addition to off which is 0%). The 30% and 70% pixels are used along the edge of a feature so as to locate the edge when written in between the lines of the cartesian raster scan grid. Thus the edges of the feature are moved off the grid, without the need for multiple passes. This pixel dose modulation uses three preset delay lines determining dwell times for each pixel on a pixel-by-pixel basis, as defined by a two (or more) bit deep memory file associated with the pattern to be written. Additionally, the pixel center locations are directly moved off the grid by deflecting the beam as it scans certain pixels located along feature edges. The amount of deflection is controllably variable to achieve various edge locations. This deflection is used by itself or in combination with dose modulation, and is implemented by an electrostatic deflector in the beam lens for an E-beam system.
Abstract:
A raster scan lithography system is modified so that the duration of illumination (dose modulation) for particular pixels is varied to lie between the full on and full off normally used. For instance, three levels of pixel intensity are provided, 100 %, 70 % and 30 % (in addition to off which is 0 %). The 30 % and 70 % pixels are used along the edge of a feature so as to locate the edge (52, 54) when written in between the lines of the cartesian raster scan grid. Thus the edges of the feature are moved off the grid, without the need for multiple passes. This pixel dose modulation uses three preset delay lines (30) determining dwell times for each pixel on a pixel-by-pixel basis, as defined by a two (or more) bit deep memory file associated with the pattern to be written. Additionally, the pixel center locations are directly moved off the grid by deflecting the beam as it scans certain pixels located along feature edges. The amount of deflection is controllably variable to achieve various edge locations. This deflection is used by itself or in combination with dose modulation, and is implemented by an electrostatic deflector in the beam lens for an E-beam system.