PRESSURE SENSING IMPLANT
    1.
    发明申请

    公开(公告)号:US20200260991A1

    公开(公告)日:2020-08-20

    申请号:US16851225

    申请日:2020-04-17

    Abstract: Disclosed is an implant and method of making an implant. The implant having a housing that defines a cavity. The housing includes a sensor comprising a base attached to a diaphragm wherein said base may be positioned within said cavity. The sensor may be a capacitive pressure sensor. The diaphragm may be connected to the housing to hermetically seal said housing. The sensor may include electrical contacts positioned on the diaphragm. The base may define a capacitive gap and a vent wherein the electrodes may be positioned within said capacitive gap such that at least a portion of the electrical contacts extend through the vent. The implant may include a coil in electric communication with the sensor, said coil may be positioned within said housing. A printed circuit board having at least one component may be attached to the floating base.

    PRESSURE SENSING IMPLANT
    2.
    发明申请
    PRESSURE SENSING IMPLANT 审中-公开
    压力传感器

    公开(公告)号:US20160324443A1

    公开(公告)日:2016-11-10

    申请号:US15213712

    申请日:2016-07-19

    Abstract: Disclosed is an implant and method of making an implant. The implant having a housing that defines a cavity. The housing includes a sensor comprising a base attached to a diaphragm wherein said base may be positioned within said cavity. The sensor may be a capacitive pressure sensor. The diaphragm may be connected to the housing to hermetically seal said housing. The sensor may include electrical contacts positioned on the diaphragm. The base may define a capacitive gap and a vent wherein the electrodes may be positioned within said capacitive gap such that at least a portion of the electrical contacts extend through the vent. The implant may include a coil in electric communication with the sensor, said coil may be positioned within said housing. A printed circuit board having at least one component may be attached to the floating base.

    Abstract translation: 公开了一种植入物和制造植入物的方法。 植入物具有限定空腔的壳体。 壳体包括传感器,其包括附接到隔膜的基座,其中所述基座可以定位在所述空腔内。 传感器可以是电容式压力传感器。 隔膜可以连接到壳体以气密地密封所述壳体。 传感器可以包括定位在隔膜上的电触点。 基座可以限定电容间隙和通气口,其中电极可以位于所述电容间隙内,使得至少一部分电触头延伸穿过通气孔。 植入物可以包括与传感器电连通的线圈,所述线圈可以定位在所述壳体内。 具有至少一个部件的印刷电路板可以附接到浮动基座。

    PRESSURE SENSING IMPLANT
    3.
    发明申请

    公开(公告)号:US20250152037A1

    公开(公告)日:2025-05-15

    申请号:US19026995

    申请日:2025-01-17

    Abstract: Disclosed is an implant and method of making an implant. The implant having a housing that defines a cavity. The housing includes a sensor comprising a base attached to a diaphragm wherein said base may be positioned within said cavity. The sensor may be a capacitive pressure sensor. The diaphragm may be connected to the housing to hermetically seal said housing. The sensor may include electrical contacts positioned on the diaphragm. The base may define a capacitive gap and a vent wherein the electrodes may be positioned within said capacitive gap such that at least a portion of the electrical contacts extend through the vent. The implant may include a coil in electric communication with the sensor, said coil may be positioned within said housing. A printed circuit board having at least one component may be attached to the floating base.

    Pressure sensing implant
    4.
    发明授权

    公开(公告)号:US12201414B2

    公开(公告)日:2025-01-21

    申请号:US16851225

    申请日:2020-04-17

    Abstract: Disclosed is an implant and method of making an implant. The implant having a housing that defines a cavity. The housing includes a sensor comprising a base attached to a diaphragm wherein said base may be positioned within said cavity. The sensor may be a capacitive pressure sensor. The diaphragm may be connected to the housing to hermetically seal said housing. The sensor may include electrical contacts positioned on the diaphragm. The base may define a capacitive gap and a vent wherein the electrodes may be positioned within said capacitive gap such that at least a portion of the electrical contacts extend through the vent. The implant may include a coil in electric communication with the sensor, said coil may be positioned within said housing. A printed circuit board having at least one component may be attached to the floating base.

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