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公开(公告)号：US20200260991A1
公开(公告)日：2020-08-20
申请号：US16851225
申请日：2020-04-17
Applicant: ENDOTRONIX, INC.
Inventor： Harry Rowland , Michael Nagy , Nathan Plag , Tyler Panian , Suresh Sundaram
IPC: A61B5/07 , A61B5/0215 , A61B5/00 , A61B5/03 , A61B5/01
Abstract: Disclosed is an implant and method of making an implant. The implant having a housing that defines a cavity. The housing includes a sensor comprising a base attached to a diaphragm wherein said base may be positioned within said cavity. The sensor may be a capacitive pressure sensor. The diaphragm may be connected to the housing to hermetically seal said housing. The sensor may include electrical contacts positioned on the diaphragm. The base may define a capacitive gap and a vent wherein the electrodes may be positioned within said capacitive gap such that at least a portion of the electrical contacts extend through the vent. The implant may include a coil in electric communication with the sensor, said coil may be positioned within said housing. A printed circuit board having at least one component may be attached to the floating base.
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公开(公告)号：US20160324443A1
公开(公告)日：2016-11-10
申请号：US15213712
申请日：2016-07-19
Applicant: Endotronix, Inc.
Inventor： Harry Rowland , Michael Nagy , Nathan Plag , Tyler Panian , Suresh Sundaram
CPC classification number: A61B5/076 , A61B5/0031 , A61B5/01 , A61B5/0215 , A61B5/02152 , A61B5/036 , A61B5/08 , A61B5/6869 , A61B5/6876 , A61B2562/0247 , A61B2562/168
Abstract: Disclosed is an implant and method of making an implant. The implant having a housing that defines a cavity. The housing includes a sensor comprising a base attached to a diaphragm wherein said base may be positioned within said cavity. The sensor may be a capacitive pressure sensor. The diaphragm may be connected to the housing to hermetically seal said housing. The sensor may include electrical contacts positioned on the diaphragm. The base may define a capacitive gap and a vent wherein the electrodes may be positioned within said capacitive gap such that at least a portion of the electrical contacts extend through the vent. The implant may include a coil in electric communication with the sensor, said coil may be positioned within said housing. A printed circuit board having at least one component may be attached to the floating base.
Abstract translation: 公开了一种植入物和制造植入物的方法。 植入物具有限定空腔的壳体。 壳体包括传感器，其包括附接到隔膜的基座，其中所述基座可以定位在所述空腔内。 传感器可以是电容式压力传感器。 隔膜可以连接到壳体以气密地密封所述壳体。 传感器可以包括定位在隔膜上的电触点。 基座可以限定电容间隙和通气口，其中电极可以位于所述电容间隙内，使得至少一部分电触头延伸穿过通气孔。 植入物可以包括与传感器电连通的线圈，所述线圈可以定位在所述壳体内。 具有至少一个部件的印刷电路板可以附接到浮动基座。
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公开(公告)号：US20250152037A1
公开(公告)日：2025-05-15
申请号：US19026995
申请日：2025-01-17
Applicant: ENDOTRONIX, INC.
Inventor： Harry Rowland , Michael Nagy , Nathan Plag , Tyler Panian , Suresh Sundaram
Abstract: Disclosed is an implant and method of making an implant. The implant having a housing that defines a cavity. The housing includes a sensor comprising a base attached to a diaphragm wherein said base may be positioned within said cavity. The sensor may be a capacitive pressure sensor. The diaphragm may be connected to the housing to hermetically seal said housing. The sensor may include electrical contacts positioned on the diaphragm. The base may define a capacitive gap and a vent wherein the electrodes may be positioned within said capacitive gap such that at least a portion of the electrical contacts extend through the vent. The implant may include a coil in electric communication with the sensor, said coil may be positioned within said housing. A printed circuit board having at least one component may be attached to the floating base.
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公开(公告)号：US12201414B2
公开(公告)日：2025-01-21
申请号：US16851225
申请日：2020-04-17
Applicant: ENDOTRONIX, INC.
Inventor： Harry Rowland , Michael Nagy , Nathan Plag , Tyler Panian , Suresh Sundaram
Abstract: Disclosed is an implant and method of making an implant. The implant having a housing that defines a cavity. The housing includes a sensor comprising a base attached to a diaphragm wherein said base may be positioned within said cavity. The sensor may be a capacitive pressure sensor. The diaphragm may be connected to the housing to hermetically seal said housing. The sensor may include electrical contacts positioned on the diaphragm. The base may define a capacitive gap and a vent wherein the electrodes may be positioned within said capacitive gap such that at least a portion of the electrical contacts extend through the vent. The implant may include a coil in electric communication with the sensor, said coil may be positioned within said housing. A printed circuit board having at least one component may be attached to the floating base.
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