SENSOR DELIVERY SYSTEM AND METHOD
    1.
    发明申请

    公开(公告)号:US20200146562A1

    公开(公告)日:2020-05-14

    申请号:US16727230

    申请日:2019-12-26

    Abstract: Provided are various embodiments of improvements made to methods, systems and assemblies of implant delivery systems and the associated implants. In one embodiment, provided is an implant delivery system comprising an implant, a first sheath and a second sheath each extending from a proximal end of said implant delivery system, the first sheath is translatable relative to said second sheath wherein said implant is connected to an exterior surface of said first sheath, and wherein said first sheath and said second sheath are movable with respect to one another to deploy said implant to a target site in an anatomy. Said delivery system may be configured to be partially inserted into a blood vessel of a human body such that said proximal end remains external to said body and said distal end is internal to said body.

    PRESSURE SENSING IMPLANT
    3.
    发明申请

    公开(公告)号:US20200260991A1

    公开(公告)日:2020-08-20

    申请号:US16851225

    申请日:2020-04-17

    Abstract: Disclosed is an implant and method of making an implant. The implant having a housing that defines a cavity. The housing includes a sensor comprising a base attached to a diaphragm wherein said base may be positioned within said cavity. The sensor may be a capacitive pressure sensor. The diaphragm may be connected to the housing to hermetically seal said housing. The sensor may include electrical contacts positioned on the diaphragm. The base may define a capacitive gap and a vent wherein the electrodes may be positioned within said capacitive gap such that at least a portion of the electrical contacts extend through the vent. The implant may include a coil in electric communication with the sensor, said coil may be positioned within said housing. A printed circuit board having at least one component may be attached to the floating base.

    PRESSURE SENSING IMPLANT
    4.
    发明申请
    PRESSURE SENSING IMPLANT 审中-公开
    压力传感器

    公开(公告)号:US20160324443A1

    公开(公告)日:2016-11-10

    申请号:US15213712

    申请日:2016-07-19

    Abstract: Disclosed is an implant and method of making an implant. The implant having a housing that defines a cavity. The housing includes a sensor comprising a base attached to a diaphragm wherein said base may be positioned within said cavity. The sensor may be a capacitive pressure sensor. The diaphragm may be connected to the housing to hermetically seal said housing. The sensor may include electrical contacts positioned on the diaphragm. The base may define a capacitive gap and a vent wherein the electrodes may be positioned within said capacitive gap such that at least a portion of the electrical contacts extend through the vent. The implant may include a coil in electric communication with the sensor, said coil may be positioned within said housing. A printed circuit board having at least one component may be attached to the floating base.

    Abstract translation: 公开了一种植入物和制造植入物的方法。 植入物具有限定空腔的壳体。 壳体包括传感器,其包括附接到隔膜的基座,其中所述基座可以定位在所述空腔内。 传感器可以是电容式压力传感器。 隔膜可以连接到壳体以气密地密封所述壳体。 传感器可以包括定位在隔膜上的电触点。 基座可以限定电容间隙和通气口,其中电极可以位于所述电容间隙内,使得至少一部分电触头延伸穿过通气孔。 植入物可以包括与传感器电连通的线圈,所述线圈可以定位在所述壳体内。 具有至少一个部件的印刷电路板可以附接到浮动基座。

    MEMS device for an implant assembly

    公开(公告)号:US11589773B2

    公开(公告)日:2023-02-28

    申请号:US16251146

    申请日:2019-01-18

    Abstract: Disclosed is an implant and method of making an implant. The implant having a housing that defines a cavity. The housing includes a sensor comprising a base attached to a diaphragm wherein said base may be positioned within said cavity. The sensor may be a capacitive pressure sensor. The diaphragm may be connected to the housing to hermetically seal said housing. The sensor may include electrical contacts positioned on the diaphragm. The attachment between the base and the diaphragm may define a capacitive gap and at least one discontinuity configured to enhance at least one performance parameter of said implant.

    ANCHORING SYSTEM FOR A CATHETER DELIVERED DEVICE

    公开(公告)号:US20210290165A1

    公开(公告)日:2021-09-23

    申请号:US17306235

    申请日:2021-05-03

    Abstract: The present disclosure relates to various anchoring systems for a catheter delivered device. In one instance the anchoring systems of the present disclosure are designed to be used in connection with a pulmonary artery implant device. In one embodiment, an anchoring system of the present disclosure comprises two anchoring ends, a distal end anchoring structure and a proximal end anchoring structure, where at least one of the distal or proximal anchoring structures has a clover-shaped structure formed by at least three lobes. In another embodiment, the distal anchoring structure includes an elongated and angled shape formed by wire material. In another embodiment, both the distal and proximal anchoring structures have a clover-shaped structure formed by at least three lobes.

    PRESSURE SENSING IMPLANT
    8.
    发明申请

    公开(公告)号:US20250152037A1

    公开(公告)日:2025-05-15

    申请号:US19026995

    申请日:2025-01-17

    Abstract: Disclosed is an implant and method of making an implant. The implant having a housing that defines a cavity. The housing includes a sensor comprising a base attached to a diaphragm wherein said base may be positioned within said cavity. The sensor may be a capacitive pressure sensor. The diaphragm may be connected to the housing to hermetically seal said housing. The sensor may include electrical contacts positioned on the diaphragm. The base may define a capacitive gap and a vent wherein the electrodes may be positioned within said capacitive gap such that at least a portion of the electrical contacts extend through the vent. The implant may include a coil in electric communication with the sensor, said coil may be positioned within said housing. A printed circuit board having at least one component may be attached to the floating base.

    Pressure sensing implant
    9.
    发明授权

    公开(公告)号:US12201414B2

    公开(公告)日:2025-01-21

    申请号:US16851225

    申请日:2020-04-17

    Abstract: Disclosed is an implant and method of making an implant. The implant having a housing that defines a cavity. The housing includes a sensor comprising a base attached to a diaphragm wherein said base may be positioned within said cavity. The sensor may be a capacitive pressure sensor. The diaphragm may be connected to the housing to hermetically seal said housing. The sensor may include electrical contacts positioned on the diaphragm. The base may define a capacitive gap and a vent wherein the electrodes may be positioned within said capacitive gap such that at least a portion of the electrical contacts extend through the vent. The implant may include a coil in electric communication with the sensor, said coil may be positioned within said housing. A printed circuit board having at least one component may be attached to the floating base.

Patent Agency Ranking