公开(公告)号：WO2016049212A8

公开(公告)日：2017-04-20

申请号：PCT/US2015051758

申请日：2015-09-23

Applicant: FINISAR CORP

Inventor： DAGHIGHIAN HENRY M

IPC: H05K1/16 ,  H05K1/02 ,  H05K1/11

CPC classification number: H05K1/115 ,  H05K1/0231 ,  H05K1/0243 ,  H05K1/0298 ,  H05K1/092 ,  H05K1/113 ,  H05K1/162 ,  H05K1/182 ,  H05K2201/0187 ,  H05K2201/0257 ,  H05K2201/09545 ,  H05K2201/09809 ,  H05K2201/10734

Abstract: A capacitor in a multilayer printed circuit board 100 is described. The capacitor may include a via 114, 116 of a via-in-pad type and a dielectric mixture filled in the via of the via-in-pad type. The via may be disposed under an integrated circuit contact pad 112 of the multilayer printed circuit board. The dielectric mixture may include a nanoparticle-sized dielectric powder mixed with an adhesive material.

Abstract translation: 描述多层印刷电路板100中的电容器。 电容器可以包括通孔垫型通孔114,116和填充在通孔垫型通孔中的电介质混合物。 通孔可以布置在多层印刷电路板的集成电路接触焊盘112下方。 介电混合物可以包括与粘合材料混合的纳米颗粒尺寸的介电粉末。