公开(公告)号：US20240023227A1

公开(公告)日：2024-01-18

申请号：US17864396

申请日：2022-07-14

Applicant: FIRST HI-TEC ENTERPRISE Co., Ltd.

Inventor： Ching-Shan CHANG ,  Kun-Tao TANG ,  Tsung-Ting TSAI ,  Chien-Lin CHEN

IPC: H05K1/02 ,  H05K1/11

CPC classification number: H05K1/0228 ,  H05K1/111 ,  H05K2201/09236 ,  H05K2201/09545 ,  H05K2201/09718

Abstract: A circuit board comprises a substrate with opposite first and second sides. A pair of plated through holes (PTHs) extends along z-axis. A pair of signal traces are made on the first side of the substrate and electrically coupled to the pair of the PTHs respectively to form a differential pair. A ground metal is made on the second side of the substrate, the ground metal has a clearance made therein. The ground metal extends fully overlapping with the full signal traces to eliminate reflection noise caused by a boundary between the clearance and the metal ground.