Abstract:
In one embodiment, a hybrid backplane coding scheme transmits data using lengthy sequences of scrambled data, separated by 8b/ 10b control character sequences that prepare the receiver for the next scrambled sequence and permit realignment if necessary. Several lanes are coded separately in this manner, and then multiplexed on a common channel. Alignment sequences in the control character sequences, as well as scrambler seeds, are set to avoid synchronization of patterns generated among all lanes, which would tend to confuse a receiving serdes and/or phase-locked loop that recovers timing from the multiplexed scrambled signals.
Abstract:
A high-speed router backplane is disclosed. The router backplane uses differential signal pairs on multiple signal layers, each sandwiched between a pair of digital ground layers. Thru- holes are used to connect the differential signal pairs to external components. To reduce routing complexity, at least some of the differential signal pairs route through a via pair, somewhere along their path, to a different signal layer. At least some of the thru-holes and vias are drilled to reduce an electrically conductive stub length portion of the hole. The drilled portion of a hole includes a transition from a first profile to a second profile to reduce radio frequency reflections from the end of the drilled hole.
Abstract:
A high-speed router backplane, and method for its fabrication, are disclosed. The backplane uses differential signaling trace pairs on multiple high-speed signaling layers, the high-speed signaling layers separated by ground planes. Plated signaling thru-holes connect the trace pairs to the board surface for connection to external components. The signaling thru-holes pass through clearances in each ground plane. At selected ground planes, a conductive pad is patterned within each high-speed signaling thru-hole clearance, the pad slightly larger than the thru-hole diameter. The pads affect the impedance characteristics of the thru-holes, thus providing a better impedance match to the differential trace pairs, reducing signal reflections, and improving the ability to signal across the backplane at high speeds.