-
公开(公告)号：WO9832314A3
公开(公告)日：1999-06-03
申请号：PCT/IB9701602
申请日：1997-12-29
Applicant: FORD GLOBAL TECH INC
Inventor： MCMILLAN RICHARD KEITH II , JAIRAZBHOY VIVEK AMIR , PAO YI-HSIN
CPC classification number: H05K3/3442 , H05K2201/09427 , H05K2201/09781 , H05K2201/10636 , H05K2203/0465 , H05K2203/306 , Y02P70/611 , Y02P70/613
Abstract: There is disclosed herein a surface mount printed circuit board having a substrate (10), at least one surface mount device (14), at least two mounting pads (12) per device (14), solder joints (24) connecting the terminations (22) of the device (14) to their respective mounting pads (12), at least one rectangular lifter pad (30) on the substrate (10) amid the mounting pads (12), and a solder mass (32) on each lifter pad (30) in contact with the bottom surface (18) of the device (14). The solder joint (24) has preferably convex outer fillets (28), the device (14) is maintained at a predetermined height (ho) above the mounting pads (12), the inner fillet angle ( alpha ) is maintained above a predetermined minimum angle to increase solder joint crack initiation time, and the overall solder joint crack propagation length is increased (li and lo). An alternative embodiment also includes plugged vias (34) under the lifter pads (30) and/or mounting pads (12), with gas pockets (40) trapped between the solder masses (32)/solder joints (24) and the plugged vias (34). This trapped gas pocket (40) provides additional buoyant force upon the SMD (14) during reflow.
Abstract translation: 这里公开了一种表面贴装印刷电路板，其具有基底（10），至少一个表面安装装置（14），每个装置（14）至少两个安装垫（12），连接终端的焊接接头（24） （14）的至少一个矩形升降器垫（30）和安装垫（12）中的基板（10）上的至少一个矩形提升垫（30），以及每个升降器上的焊料块（32） 垫（30）与装置（14）的底表面（18）接触。 焊接接头（24）优选地具有凸形外圆角（28），该装置（14）保持在安装垫（12）上方的预定高度（ho）处，内圆角（α）保持在预定最小值 角度增加焊点裂纹引发时间，并且整体焊点裂纹扩展长度增加（li和lo）。 替代实施例还包括位于升降器垫（30）和/或安装垫（12）下方的插入通孔（34），其中气囊（40）被捕获在焊料块（32）/焊接接头（24）和堵塞的通孔 （34）。 这个被困的气体袋（40）在回流时在SMD（14）上提供额外的浮力。
-
公开(公告)号：GB2321303A
公开(公告)日：1998-07-22
申请号：GB9727541
申请日：1997-12-30
Applicant: FORD GLOBAL TECH INC
Inventor： JAIRAZBHOY VIVEK AMIR , REDDY PRATHAP AMERWAI , MOZURKEWICH GEORGE JR
Abstract: Apparatus for acoustic cooling of a heat load 12 such as automotive electronics comprises an acoustic driver 28 and an acoustic reflector 32 disposed within a hollow member 20. A heat transport member 18 is connected between the heat load 12 and the member 20 and is in intimate thermal contact with the hollow member. A standing acoustic wave is generated by an oscillator and the driver 28 and reflector 32. The acoustic wave induces circulation of fluid flow within the hollow member which transports heat from the member 18 to a remote location of the hollow member, which acts as a heat sink.
-
公开(公告)号：ES2167797T3
公开(公告)日：2002-05-16
申请号：ES97947200
申请日：1997-12-29
Applicant: FORD GLOBAL TECH INC
Inventor： MCMILLAN RICHARD KEITH II , JAIRAZBHOY VIVEK AMIR , PAO YI-HSIN
Abstract: There is disclosed herein a surface mount printed circuit board having a substrate, at least one surface mount device, at least two mounting pads per device, solder joints connecting the terminations of the device to their respective mounting pads, at least one rectangular lifter pad on the substrate amid the mounting pads, and a solder mass on each lifter pad in contact with the bottom surface of the device. The inner and outer extensions of the mounting pads, the size, number, and shape of the lifter pads, and the amounts of solder deposited on the mounting and lifter pads are designed such that the solder joint has preferably convex outer fillets, the device is maintained at a predetermined height above the mounting pads, the inner fillet angle is maintained above a predetermined minimum angle to increase solder joint crack initiation time, and the overall solder joint crack propagation length is increased. An alternate embodiment also includes plugged vias under the lifter pads and/or mounting pads, with gas pockets trapped between the solder masses/solder joints and the plugged vias. This trapped gas pocket provides additional buoyant force upon the SMD during reflow.
-
Patent Agency Ranking
公开(公告)号：CA2226108A1
公开(公告)日：1998-07-16
申请号：CA2226108
申请日：1998-01-05
Applicant: FORD GLOBAL TECH INC
Inventor： JAIRAZBHOY VIVEK AMIR , REDDY PRATHAP AMERWAI , MOZURKEWICH GEORGE JR
Abstract: An apparatus for acoustically cooling automotive electronics in which an acoustic driver and acoustic reflector are disposed within a hollow member, such as a cross-car-beam of a vehicle. The frequency of the acoustic driver and the distance between the acoustic driver and the acoustic reflector are selected to generate a standing acoustic wave within the hollow member. The standing acoustic wave will generate a fluid flow providing forced air convection cooling of a base or its extension on which the automotive electronics module is mounted.
-
公开(公告)号：CA2278019A1
公开(公告)日：1998-07-23
申请号：CA2278019
申请日：1997-12-29
Applicant: FORD GLOBAL TECH INC
Inventor： PAO YI-HSIN , MCMILLAN RICHARD KEITH II , JAIRAZBHOY VIVEK AMIR
Abstract: There is disclosed herein a surface mount printed circuit board having a substrate (10), at least one surface mount device (14), at least two mounting pads (12) per device (14), solder joints (24) connecting the terminations (22) of the device (14) to their respective mounting pads (12), at least one rectangular lifter pad (30) on the substrate (10) amid the mounting pads (12), and a solder mass (32) on each lifter pad (30) in contact with the bottom surface (18) of the device (14). The solder joint (24) has preferably convex outer fillets (28), the device (14) is maintained at a predetermined height (ho) above the mounting pads (12), the inner fillet angle (.alpha.) is maintained above a predetermined minimum angle to increase solder joint crack initiation time, and the overall solder joint crack propagation length is increased (li and lo). An alternative embodiment also includes plugged vias (34) under the lifter pads (30) and/or mounting pads (12), with gas pockets (40) trapped between the solder masses (32)/solder joints (24) and the plugged vias (34). This trapped gas pocket (40) provides additional buoyant force upon the SMD (14) during reflow.
-
公开(公告)号：PT953277E
公开(公告)日：2002-06-28
申请号：PT97947200
申请日：1997-12-29
Applicant: FORD GLOBAL TECH INC
Inventor： MCMILLAN RICHARD KEITH II , JAIRAZBHOY VIVEK AMIR , PAO YI-HSIN
Abstract: There is disclosed herein a surface mount printed circuit board having a substrate, at least one surface mount device, at least two mounting pads per device, solder joints connecting the terminations of the device to their respective mounting pads, at least one rectangular lifter pad on the substrate amid the mounting pads, and a solder mass on each lifter pad in contact with the bottom surface of the device. The inner and outer extensions of the mounting pads, the size, number, and shape of the lifter pads, and the amounts of solder deposited on the mounting and lifter pads are designed such that the solder joint has preferably convex outer fillets, the device is maintained at a predetermined height above the mounting pads, the inner fillet angle is maintained above a predetermined minimum angle to increase solder joint crack initiation time, and the overall solder joint crack propagation length is increased. An alternate embodiment also includes plugged vias under the lifter pads and/or mounting pads, with gas pockets trapped between the solder masses/solder joints and the plugged vias. This trapped gas pocket provides additional buoyant force upon the SMD during reflow.
-
公开(公告)号：GB2321303B
公开(公告)日：2001-01-17
申请号：GB9727541
申请日：1997-12-30
Applicant: FORD GLOBAL TECH INC
Inventor： JAIRAZBHOY VIVEK AMIR , REDDY PRATHAP AMERWAI , MOZURKEWICH JR GEORGE
Abstract: An apparatus for acoustically cooling automotive electronics in which an acoustic driver and acoustic reflector are disposed within a hollow member, such as a cross-car-beam of a vehicle. The frequency of the acoustic driver and the distance between the acoustic driver and the acoustic reflector are selected to generate a standing acoustic wave within the hollow member. The standing acoustic wave will generate a fluid flow providing forced air convection cooling of a base or its extension on which
-
公开(公告)号：BR9714289A
公开(公告)日：2000-04-25
申请号：BR9714289
申请日：1997-12-29
Applicant: FORD GLOBAL TECH INC
Inventor： MCMILLAN RICHARD KEITH II , JAIRAZBHOY VIVEK AMIR , PAO YI-HSIN
Abstract: There is disclosed herein a surface mount printed circuit board having a substrate, at least one surface mount device, at least two mounting pads per device, solder joints connecting the terminations of the device to their respective mounting pads, at least one rectangular lifter pad on the substrate amid the mounting pads, and a solder mass on each lifter pad in contact with the bottom surface of the device. The inner and outer extensions of the mounting pads, the size, number, and shape of the lifter pads, and the amounts of solder deposited on the mounting and lifter pads are designed such that the solder joint has preferably convex outer fillets, the device is maintained at a predetermined height above the mounting pads, the inner fillet angle is maintained above a predetermined minimum angle to increase solder joint crack initiation time, and the overall solder joint crack propagation length is increased. An alternate embodiment also includes plugged vias under the lifter pads and/or mounting pads, with gas pockets trapped between the solder masses/solder joints and the plugged vias. This trapped gas pocket provides additional buoyant force upon the SMD during reflow.
-
-
-
-
-
-
-
Search Results
8
records
(took 0.023 seconds)
