公开(公告)号：WO2008024726A3

公开(公告)日：2008-02-28

申请号：PCT/US2007/076345

申请日：2007-08-21

Applicant: FORMFACTOR, INC. ,  ELDRIDGE, Benjamin, N. ,  GRITTERS, John K. ,  KHANDROS, Igor, K. ,  MARTENS, Rod ,  MATHIEU, Gaetan, L.

Inventor： ELDRIDGE, Benjamin, N. ,  GRITTERS, John K. ,  KHANDROS, Igor, K. ,  MARTENS, Rod ,  MATHIEU, Gaetan, L.

IPC: H01R12/00

Abstract: A carbon nanotube contact structure (1400) can be used for making pressure connections to a DUT The contact structure can be formed using a carbon nanotube film (1100) or with carbon nanotubes in solution The carbon nanotube film can be grown in a trench in a sacrificial substrate in which a contact structure such as a beam or contact element (1403) is then formed by metal plating The film can also be formed on a contact element and have metal posts dispersed therein to provide rigidity and elasticity Contact structures or portions thereof can also be plated with a solution containing carbon nanotubes The resulting contact structure can be tough, and can provide good electrical conductivity.

公开(公告)号：WO2004059328A2

公开(公告)日：2004-07-15

申请号：PCT/US2003/040909

申请日：2003-12-18

Applicant: FORMFACTOR, INC.

Inventor： COOPER, Timothy, E. ,  ELDRIDGE, Benjamin, N. ,  KHANDROS, Igor, K. ,  MARTENS, Rod ,  MATHIEU, Gaetan, L.

IPC: G01R1/00

CPC classification number: G01R31/2887 ,  G01R1/06705 ,  G01R31/2886

Abstract: An electronic device is moved into a first position with respect to probes for making electrical contact with the device. The electronic device is then moved into a second position in which the electronic device is pressed against the probes, compressing the probes. The movement into the second position includes two components. One component of the movement tends to press the electronic device against the probes, compressing the probes and inducing a stress in the probes. The second movement tends to reduce that stress. Test data are then communicated to and from the electronic device through the probes.

Abstract translation: 电子设备相对于用于与设备进行电接触的探针移动到第一位置。 然后将电子设备移动到第二位置，在第二位置电子设备被压靠在探针上，从而压缩探针。 进入第二个位置的运动包括两个部分。 运动的一个组成部分倾向于将电子设备压在探针上，压缩探针并在探针中引起应力。 第二乐章往往会减轻压力。 测试数据然后通过探针与电子设备进行通信。

公开(公告)号：EP1442307B1

公开(公告)日：2009-04-22

申请号：EP02784365.5

申请日：2002-11-01

Applicant: FormFactor, Inc.

Inventor： ELDRIDGE, Benjamin, N. ,  GRUBE, Gary, W. ,  MATSUBAYASHI, Ken, S. ,  LARDER, Richard, A. ,  SHINDE, Makarand, S. ,  MATHIEU, Gaetan, L. ,  MARTENS, Rod

IPC: G01R1/073

CPC classification number: G01R31/2891 ,  G01R1/07342 ,  G01R31/2886

Abstract: The present invention discloses a method and system compensating for thermally induced motion of probe cards used in testing die on a wafer. A probe card incorporating temperature control devices to maintain a uniform temperature throughout the thickness of the probe card is disclosed. A probe card incorporating bi-material stiffening elements which respond to changes in temperature in such a way as to counteract thermally induced motion of the probe card is disclosed including rolling elements, slots and lubrication. Various means for allowing radial expansion of a probe card to prevent thermally induced motion of the probe card are also disclosed. A method for detecting thermally induced movement of the probe card and moving the wafer to compensate is also disclosed.

公开(公告)号：WO2005081001A1

公开(公告)日：2005-09-01

申请号：PCT/US2005/005087

申请日：2005-02-15

Applicant: FORMFACTOR, INC. ,  COOPER, Timothy, E. ,  ELDRIDGE, Benjamin, N. ,  KHANDROS, Igor, K. ,  MARTENS, Rod ,  MATHIEU, Gaetan, L.

Inventor： COOPER, Timothy, E. ,  ELDRIDGE, Benjamin, N. ,  KHANDROS, Igor, K. ,  MARTENS, Rod ,  MATHIEU, Gaetan, L.

IPC: G01R31/02

CPC classification number: G01R31/2886 ,  G01R31/2887

Abstract: An electronic device is moved into a first position such that terminals of the electronic device are adjacent probes for making electrical contact with the terminals. The electronic device is then moved horizontally or diagonally such that the terminals contact the probes. Test data are then communicated to and from the electronic device through the probes.

Abstract translation: 电子设备移动到第一位置，使得电子设备的端子是与端子电接触的相邻探头。 然后电子设备水平或对角地移动，使得端子接触探针。 然后通过探头将测试数据传送到电子设备和从电子设备传送。

公开(公告)号：WO2003040734A3

公开(公告)日：2003-05-15

申请号：PCT/US2002/035022

申请日：2002-11-01

Applicant: FORMFACTOR, INC. ,  ELDRIDGE, Benjamin, N. ,  GRUBE, Gary, W. ,  MATSUBAYASHI, Ken, S. ,  LARDER, Richard, A. ,  SHINDE, Makarand, S. ,  MATHIEU, Gaetan, L. ,  MARTENS, Rod

Inventor： ELDRIDGE, Benjamin, N. ,  GRUBE, Gary, W. ,  MATSUBAYASHI, Ken, S. ,  LARDER, Richard, A. ,  SHINDE, Makarand, S. ,  MATHIEU, Gaetan, L. ,  MARTENS, Rod

IPC: G01R1/073

Abstract: The present invention discloses a method and system compensating for thermally induced motion of probe cards used in testing die on a wafer. A probe card incorporating temperature control devices to maintain a uniform temperature throughout the thickness of the probe card is disclosed. A probe card incorporating bi-material stiffening elements or shaped memory allows wich response to changes in temperature in such a way as to counteract thermally induced motion of the probe card is disclosed including rolling elements, slots and lubrication. Various means for allowing radial expansion of a probe card to prevent thermally induced motion of the probe card are also disclosed. A method for detecting thermally induced movement of the probe card and moving the wafer to compensate is also disclosed.

公开(公告)号：EP1576378B1

公开(公告)日：2009-08-19

申请号：EP03814300.4

申请日：2003-12-18

Applicant: FormFactor, Inc.

Inventor： COOPER, Timothy, E. ,  ELDRIDGE, Benjamin, N. ,  KHANDROS, Igor, K. ,  MARTENS, Rod ,  MATHIEU, Gaetan, L.

IPC: G01R1/073 ,  G01R31/28

CPC classification number: G01R31/2887 ,  G01R1/06705 ,  G01R31/2886

Abstract: An electronic device is moved into a first position with respect to probes for making electrical contact with the device. The electronic device is then moved into a second position in which the electronic device is pressed against the probes, compressing the probes. The movement into the second position includes two components. One component of the movement tends to press the electronic device against the probes, compressing the probes and inducing a stress in the probes. The second movement tends to reduce that stress. Test data are then communicated to and from the electronic device through the probes.

公开(公告)号：EP1576378A2

公开(公告)日：2005-09-21

申请号：EP03814300.4

申请日：2003-12-18

Applicant: FormFactor, Inc.

Inventor： COOPER, Timothy, E. ,  ELDRIDGE, Benjamin, N. ,  KHANDROS, Igor, K. ,  MARTENS, Rod ,  MATHIEU, Gaetan, L.

IPC: G01R1/073

CPC classification number: G01R31/2887 ,  G01R1/06705 ,  G01R31/2886

Abstract: An electronic device is moved into a first position with respect to probes for making electrical contact with the device. The electronic device is then moved into a second position in which the electronic device is pressed against the probes, compressing the probes. The movement into the second position includes two components. One component of the movement tends to press the electronic device against the probes, compressing the probes and inducing a stress in the probes. The second movement tends to reduce that stress. Test data are then communicated to and from the electronic device through the probes.

Abstract translation: 电子设备相对于用于与设备进行电接触的探针移动到第一位置。 然后将电子设备移动到第二位置，在第二位置电子设备被压靠在探针上，从而压缩探针。 进入第二个位置的运动包括两个部分。 运动的一个组成部分倾向于将电子设备压在探针上，压缩探针并在探针中引起应力。 第二乐章往往会减轻压力。 测试数据然后通过探针与电子设备进行通信。

公开(公告)号：EP2059977A2

公开(公告)日：2009-05-20

申请号：EP07814273.4

申请日：2007-08-21

Applicant: FormFactor, Inc.

Inventor： ELDRIDGE, Benjamin, N. ,  GRITTERS, John K. ,  KHANDROS, Igor, K. ,  MARTENS, Rod ,  MATHIEU, Gaetan, L.

IPC: H01R12/00

CPC classification number: G01R1/06755 ,  H01R13/03 ,  Y10T29/49204

Abstract: A carbon nanotube contact structure (1400) can be used for making pressure connections to a DUT The contact structure can be formed using a carbon nanotube film (1100) or with carbon nanotubes in solution The carbon nanotube film can be grown in a trench in a sacrificial substrate in which a contact structure such as a beam or contact element (1403) is then formed by metal plating The film can also be formed on a contact element and have metal posts dispersed therein to provide rigidity and elasticity Contact structures or portions thereof can also be plated with a solution containing carbon nanotubes The resulting contact structure can be tough, and can provide good electrical conductivity.

公开(公告)号：EP1716422A1

公开(公告)日：2006-11-02

申请号：EP05723223.3

申请日：2005-02-15

Applicant: FormFactor, Inc.

Inventor： COOPER, Timothy, E. ,  ELDRIDGE, Benjamin, N. ,  KHANDROS, Igor, K. ,  MARTENS, Rod ,  MATHIEU, Gaetan, L.

IPC: G01R31/02

CPC classification number: G01R31/2886 ,  G01R31/2887

Abstract: An electronic device is moved into a first position such that terminals of the electronic device are adjacent probes for making electrical contact with the terminals. The electronic device is then moved horizontally or diagonally such that the terminals contact the probes. Test data are then communicated to and from the electronic device through the probes.

公开(公告)号：EP1442307A2

公开(公告)日：2004-08-04

申请号：EP02784365.5

申请日：2002-11-01

Applicant: FORMFACTOR, INC.

Inventor： ELDRIDGE, Benjamin, N. ,  GRUBE, Gary, W. ,  MATSUBAYASHI, Ken, S. ,  LARDER, Richard, A. ,  SHINDE, Makarand, S. ,  MATHIEU, Gaetan, L. ,  MARTENS, Rod

IPC: G01R1/073

CPC classification number: G01R31/2891 ,  G01R1/07342 ,  G01R31/2886

Abstract: The present invention discloses a method and system compensating for thermally induced motion of probe cards used in testing die on a wafer. A probe card incorporating temperature control devices to maintain a uniform temperature throughout the thickness of the probe card is disclosed. A probe card incorporating bi-material stiffening elements or shaped memory allows wich response to changes in temperature in such a way as to counteract thermally induced motion of the probe card is disclosed including rolling elements, slots and lubrication. Various means for allowing radial expansion of a probe card to prevent thermally induced motion of the probe card are also disclosed. A method for detecting thermally induced movement of the probe card and moving the wafer to compensate is also disclosed.