公开(公告)号：WO2006083862A1

公开(公告)日：2006-08-10

申请号：PCT/US2006/003392

申请日：2006-01-30

Applicant: FORMFACTOR, INC. ,  GRUBE, Gary, W. ,  WATSON, Thomas, N.

Inventor： GRUBE, Gary, W. ,  WATSON, Thomas, N.

IPC: G01R31/02

CPC classification number: G01B7/287 ,  G01B11/306 ,  G01R31/2886

Abstract: An apparatus for determining a planarity of a first structure configured to hold a probing device to the planarity of a second structure configured to hold a device to be probed is disclosed. In one example of the apparatus, a plurality of moveable push rods are disposed in a substrate, which is attached to the first structure. In initial non-displaced positions, the push rods correspond to a planarity of the first structure. The second structure is then brought into contact with the push rods, displacing the push rods into second positions that correspond to a planarity of the second structure. In another example of the apparatus, beams of light are reflected off of reflectors disposed on the first structure and onto sensors disposed on the second structure. The locations of the reflected beams on the sensors are noted and used to determine the planarity of the first structure with respect to the second structure.

Abstract translation: 公开了一种用于确定构造成将探测装置保持为构造成保持要探测的装置的第二结构的平面性的第一结构的平坦度的装置。 在该装置的一个示例中，多个可移动的推杆设置在附接到第一结构的基板中。 在初始非位移位置，推杆对应于第一结构的平面度。 然后将第二结构与推杆接触，将推杆移位到与第二结构的平面度对应的第二位置。 在该设备的另一示例中，光束从设置在第一结构上的反射器和设置在第二结构上的传感器上反射。 注意反射光束在传感器上的位置并用于确定第一结构相对于第二结构的平面度。

公开(公告)号：WO2005104742A2

公开(公告)日：2005-11-10

申请号：PCT/US2005/014377

申请日：2005-04-26

Applicant: FORMFACTOR, INC. ,  GRUBE, Gary, W. ,  MATHIEU, Gaetan, L. ,  ELDRIDGE, Benjamin, N. ,  SOFIELD, Chadwick, D.

Inventor： GRUBE, Gary, W. ,  MATHIEU, Gaetan, L. ,  ELDRIDGE, Benjamin, N. ,  SOFIELD, Chadwick, D.

IPC: B32B9/00 ,  B32B15/04

CPC classification number: G01R3/00 ,  G01R1/06716 ,  G01R1/06744 ,  H01L24/80 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/1461 ,  Y10T29/49117 ,  Y10T29/49147 ,  Y10T156/10 ,  Y10T428/12347 ,  Y10T428/12375 ,  Y10T428/12535 ,  Y10T428/12542 ,  Y10T428/12556 ,  Y10T428/12569 ,  Y10T428/31681 ,  H01L2924/00

Abstract: A robust mechanical structure is provided to prevent small foundation structures formed on a substrate from detaching from the substrate surface. The strengthened structure is formed by plating a foundation metal layer on a seed layer and then embedding the plated foundation structure in an adhesive polymer material, such as epoxy. Components, such as spring probes, can then be constructed on the plated foundation. The adhesive polymer material better assures the adhesion of the metal foundation structure to the substrate surface by counteracting forces applied to an element, such as a spring probe, attached to the plated foundation.

Abstract translation: 提供坚固的机械结构以防止形成在基板上的小基础结构从基板表面分离。 强化结构通过在种子层上电镀基础金属层，然后将镀覆的基础结构嵌入诸如环氧树脂的粘合剂聚合物材料中而形成。 然后可以在镀覆的基础上构造诸如弹簧探针的组件。 粘合剂聚合物材料通过抵抗附着在镀覆基底上的诸如弹簧探针的元件的抵抗力，更好地保证金属基础结构与基底表面的粘附。

公开(公告)号：WO2004059330A2

公开(公告)日：2004-07-15

申请号：PCT/US2003/040829

申请日：2003-12-18

Applicant: FORMFACTOR, INC.

Inventor： GRUBE, Gary, W. ,  MATHIEU, Gaetan, L. ,  MADSEN, Alec

IPC: G01R1/067

CPC classification number: G01R1/06733 ,  G01R1/06716 ,  G01R1/0675 ,  G01R1/07314 ,  G01R3/00

Abstract: An elongate, columnar micro-mechanical structure disposed along a central longitudinal axis; the structure is made up of laminated structural layers, each comprised of a structural material. The layers define a substantially rigid base portion at a proximal end of the structure, a resilient intermediate portion extending from the base portion along the central axis, and a contact tip extending from the resilient portion at a distal end of the structure. The resilient portion of the contact structure is comprised of resilient arms defined in the layers. Opposite ends of the resilient arms may be angularly offset with respect to one another around the central axis. Accordingly, when the contact structure is compressed in an axial direction, the contact tip will rotate around the central axis, while the base remains fixed, providing beneficial wiping action to the contact tip.

Abstract translation: 沿着中心纵向轴线设置的细长柱状微机械结构; 该结构由层压结构层组成，每层由结构材料构成。 这些层在结构的近端处限定基本上刚性的基部，从基部延伸的弹性中间部分沿着中心轴线，以及在结构的远端处从弹性部分延伸的接触尖端。 接触结构的弹性部分由限定在层中的弹性臂组成。 弹性臂的相对端部可以相对于中心轴线彼此成角度地偏移。 因此，当接触结构沿轴向压缩时，接触尖端将围绕中心轴线旋转，同时基座保持固定，为接触尖端提供有益的擦拭作用。

公开(公告)号：WO2006113708A2

公开(公告)日：2006-10-26

申请号：PCT/US2006/014554

申请日：2006-04-18

Applicant: FORMFACTOR, INC. ,  ELDRIDGE, Benjamin, N. ,  GRUBE, Gary, W. ,  HOBBS, Eric, D. ,  MATHIEU, Gaetan, L. ,  SHINDE, Makarand, S. ,  SPORCK, A., Nicholas ,  WATSON, Thomas, N. ,  SLOCUM, Alexander, N.

Inventor： ELDRIDGE, Benjamin, N. ,  GRUBE, Gary, W. ,  HOBBS, Eric, D. ,  MATHIEU, Gaetan, L. ,  SHINDE, Makarand, S. ,  SPORCK, A., Nicholas ,  WATSON, Thomas, N. ,  SLOCUM, Alexander, N.

IPC: G01R31/02

CPC classification number: G01R31/2874 ,  G01R31/2863 ,  G01R31/2889 ,  Y10T29/5313

Abstract: A probe card assembly can include a probe head assembly having probes for contacting an electronic device to be tested. The probe head assembly can be electrically connected to a wiring substrate and mechanically attached to a stiffener plate. The wiring substrate can provide electrical connections to a testing apparatus, and the stiffener plate can provide structure for attaching the probe card assembly to the testing apparatus. The stiffener plate can have a greater mechanical strength than the wiring substrate and can be less susceptible to thermally induced movement than the wiring substrate. The wiring substrate may be attached to the stiffener plate at a central location of the wiring substrate. Space may be provided at other locations where the wiring substrate is attached to the stiffener plate so that the wiring substrate can expand and contract with respect to the stiffener plate.

Abstract translation: 探针卡组件可以包括具有用于接触要测试的电子设备的探针的探针头组件。 探针头组件可以电连接到布线基板并且机械地附接到加强板。 布线基板可以提供到测试装置的电连接，并且加强板可以提供用于将探针卡组件附接到测试装置的结构。 加强板可以具有比布线基板更大的机械强度，并且可以比布线基板更不易受热引起的移动。 布线基板可以在布线基板的中心位置处附接到加强板。 可以在将布线基板附接到加强板的其他位置处设置空间，使得布线基板能够相对于加强板膨胀和收缩。

公开(公告)号：WO2005003791A2

公开(公告)日：2005-01-13

申请号：PCT/US2004/020513

申请日：2004-06-25

Applicant: FORMFACTOR, INC. ,  GRUBE, Gary, W.

Inventor： GRUBE, Gary, W.

IPC: G01R

CPC classification number: H01R13/2442 ,  G01R1/07342 ,  H01R12/7076 ,  H01R13/2464 ,  H01R13/447

Abstract: An insulative material is applied to one or more selected probe tips to disable those probes, and the probes are brought into contact with a semiconductor die. One or more tests are run on the die to verify sufficient testing of the die without the disabled probes. The process may be repeated with other probes disabled to determine which probes need not be used in testing the die.

Abstract translation: 将绝缘材料施加到一个或多个所选择的探针尖端以禁用那些探针，并且使探针与半导体管芯接触。 在芯片上运行一个或多个测试，以验证芯片的充分测试，而不使用禁用的探针。 可以重复该过程，其他探针被禁用以确定哪些探针不需要用于测试模具。

公开(公告)号：WO1996015459A1

公开(公告)日：1996-05-23

申请号：PCT/US1995014885

申请日：1995-11-15

Applicant: FORMFACTOR, INC.

Inventor： FORMFACTOR, INC. ,  KHANDROS, Igor, Y. ,  MATHIEU, Gaetan, L. ,  ELDRIDGE, Benjamin, N. ,  GRUBE, Gary, W.

IPC: G01R01/073

CPC classification number: H05K7/1069 ,  B23K1/0016 ,  B23K20/004 ,  B23K2101/40 ,  C25D5/08 ,  C25D5/22 ,  C25D7/12 ,  C25D21/02 ,  G01R1/0483 ,  G01R31/2863 ,  H01L21/288 ,  H01L21/4853 ,  H01L21/4889 ,  H01L21/563 ,  H01L21/67138 ,  H01L22/20 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/72 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/16 ,  H01L2224/0401 ,  H01L2224/05082 ,  H01L2224/05644 ,  H01L2224/1134 ,  H01L2224/1147 ,  H01L2224/13099 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13582 ,  H01L2224/13639 ,  H01L2224/13644 ,  H01L2224/13647 ,  H01L2224/13655 ,  H01L2224/13657 ,  H01L2224/16145 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4554 ,  H01L2224/45644 ,  H01L2224/4824 ,  H01L2224/48465 ,  H01L2224/48644 ,  H01L2224/48699 ,  H01L2224/48844 ,  H01L2224/49109 ,  H01L2224/73203 ,  H01L2224/81801 ,  H01L2224/85201 ,  H01L2224/85205 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06555 ,  H01L2225/06572 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01031 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01056 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01R12/52 ,  H05K1/141 ,  H05K3/20 ,  H05K3/308 ,  H05K3/326 ,  H05K3/3421 ,  H05K3/3426 ,  H05K3/368 ,  H05K3/4015 ,  H05K3/4092 ,  H05K2201/0397 ,  H05K2201/068 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10378 ,  H05K2201/10719 ,  H05K2201/10734 ,  H05K2201/10757 ,  H05K2201/10878 ,  H05K2201/10909 ,  H05K2201/10946 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2224/48 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2224/48744 ,  H01L2924/20751 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/00015 ,  H01L2924/2075 ,  H01L2924/20754

Abstract: Resilient contact structures (430) are mounted directly to bond pads (410) on semiconductor dies (402a, 402b), prior to the dies (402a, 402b) being singulated (separated) from a semiconductor wafer. This enables the semiconductor dies (402a, 402b) to be exercised (e.g., tested and/or burned-in) by connecting to the semiconductor dies (702, 704) with a circuit board (710) or the like having a plurality of terminals (712) disposed on a surface thereof. Subsequently, the semiconductor dies (402a, 402b) may be singulated from the semiconductor wafer, whereupon the same resilient contact structures (430) can be used to effect interconnections between the semiconductor dies and other electronic components (such as wiring substrates, semiconductor packages, etc.). Using the all-metallic composite interconnection elements (430) of the present invention as the resilient contact structures, burn-in (792) can be performed at temperatures of at least 150 DEG C, and can be completed in less than 60 minutes.

Abstract translation: 在将模具（402a，402b）与半导体晶片分离（分离）之前，将弹性接触结构（430）直接安装在半导体管芯（402a，402b）上的接合焊盘（410）上。 这使得半导体管芯（402a，402b）能够通过用具有多个端子的电路板（710）等连接到半导体管芯（702,704）来实现（例如，测试和/或烧入）半导体管芯（402a，402b） （712）设置在其表面上。 随后，半导体管芯（402a，402b）可以从半导体晶片分离，于是可以使用相同的弹性接触结构（430）来实现半导体管芯和其它电子部件（例如布线基板，半导体封装， 等等。）。 使用本发明的全金属复合互连元件（430）作为弹性接触结构，老化（792）可以在至少150℃的温度下进行，并且可以在少于60分钟内完成。

公开(公告)号：EP1442307B1

公开(公告)日：2009-04-22

申请号：EP02784365.5

申请日：2002-11-01

Applicant: FormFactor, Inc.

Inventor： ELDRIDGE, Benjamin, N. ,  GRUBE, Gary, W. ,  MATSUBAYASHI, Ken, S. ,  LARDER, Richard, A. ,  SHINDE, Makarand, S. ,  MATHIEU, Gaetan, L. ,  MARTENS, Rod

IPC: G01R1/073

CPC classification number: G01R31/2891 ,  G01R1/07342 ,  G01R31/2886

Abstract: The present invention discloses a method and system compensating for thermally induced motion of probe cards used in testing die on a wafer. A probe card incorporating temperature control devices to maintain a uniform temperature throughout the thickness of the probe card is disclosed. A probe card incorporating bi-material stiffening elements which respond to changes in temperature in such a way as to counteract thermally induced motion of the probe card is disclosed including rolling elements, slots and lubrication. Various means for allowing radial expansion of a probe card to prevent thermally induced motion of the probe card are also disclosed. A method for detecting thermally induced movement of the probe card and moving the wafer to compensate is also disclosed.

公开(公告)号：EP0839322B1

公开(公告)日：2005-08-10

申请号：EP97926534.5

申请日：1997-05-15

Applicant: FormFactor, Inc.

Inventor： KHANDROS, Igor, Y. ,  ELDRIDGE, Benjamin, N. ,  MATHIEU, Gaetan, L. ,  GRUBE, Gary, W.

IPC: G01R1/067 ,  G01R1/073

CPC classification number: G01R1/07342 ,  G01R1/06727 ,  G01R1/06744 ,  G01R3/00 ,  H01H1/0036 ,  H01L23/49811 ,  H01L24/06 ,  H01L24/10 ,  H01L24/45 ,  H01L24/72 ,  H01L2224/04042 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05657 ,  H01L2224/0566 ,  H01L2224/06136 ,  H01L2224/45144 ,  H01L2224/48639 ,  H01L2224/48644 ,  H01L2224/48647 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K3/20 ,  H05K3/3421 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2224/48657 ,  H01L2224/4866 ,  H01L2224/85399

Abstract: Spring contact elements are fabricated by depositing at least one layer of metallic material into openings defined on a sacrificial substrate. The openings may be within the surface of the substrate, or in one or more layers deposited on the surface of the sacrificial substrate. Each spring contact element has a base end portion, a contact end portion, and a central body portion. The contact end portion is offset in the z-axis (at a different height) than the central body portion. The base end portion is preferably offset in an opposite direction along the z-axis from the central body portion. In this manner, a plurality of spring contact elements are fabricated in a prescribed spatial relationship with one another on the sacrificial substrate. The spring contact elements are suitably mounted by their base end portions to corresponding terminals on an electronic component, such as a space transformer or a semiconductor device, whereupon the sacrificial substrate is removed so that the contact ends of the spring contact elements extend above the surface of the electronic component. In an exemplary use, the spring contact elements are thereby disposed on a space transformer component of a probe card assembly so that their contact ends effect pressure connections to corresponding terminals on another electronic component, for the purpose of probing the electronic component.

公开(公告)号：EP0792462A1

公开(公告)日：1997-09-03

申请号：EP95939968.0

申请日：1995-11-13

Applicant: FORMFACTOR, INC.

Inventor： KHANDROS, Igor, Y. ,  MATHIEU, Gaetan, L. ,  ELDRIDGE, Benjamin, N. ,  GRUBE, Gary, W.

IPC: G01R31 ,  B23K20 ,  C23C18 ,  C25D7 ,  G01R1 ,  H01L21 ,  H01L23 ,  H01L25 ,  H01R12 ,  H01R13 ,  H01R33 ,  H05K3 ,  H05K7 ,  C25D5 ,  C25D21 ,  H01R107 ,  H05K1

CPC classification number: H05K7/1069 ,  B23K1/0016 ,  B23K20/004 ,  B23K2201/40 ,  C25D5/08 ,  C25D5/22 ,  C25D7/12 ,  C25D21/02 ,  G01R1/0466 ,  G01R1/0483 ,  G01R1/06711 ,  G01R1/07314 ,  G01R1/07342 ,  G01R1/07357 ,  G01R1/07371 ,  G01R1/07378 ,  G01R31/2884 ,  G01R31/2886 ,  G01R31/2889 ,  H01L21/4853 ,  H01L21/4889 ,  H01L21/563 ,  H01L21/67138 ,  H01L22/20 ,  H01L23/32 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/72 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/16 ,  H01L2224/0401 ,  H01L2224/05124 ,  H01L2224/05166 ,  H01L2224/05599 ,  H01L2224/05647 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13639 ,  H01L2224/13644 ,  H01L2224/13647 ,  H01L2224/13655 ,  H01L2224/13657 ,  H01L2224/16145 ,  H01L2224/29111 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45111 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4554 ,  H01L2224/456 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48463 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/48799 ,  H01L2224/49109 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/81801 ,  H01L2224/85201 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06555 ,  H01L2225/06572 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01037 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01057 ,  H01L2924/0106 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01076 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01088 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/1517 ,  H01L2924/15312 ,  H01L2924/1532 ,  H01L2924/15787 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01R12/52 ,  H01R13/2407 ,  H01R13/2464 ,  H05K1/141 ,  H05K3/20 ,  H05K3/326 ,  H05K3/3421 ,  H05K3/368 ,  H05K3/4015 ,  H05K3/4092 ,  H05K2201/0397 ,  H05K2201/068 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10378 ,  H05K2201/10719 ,  H05K2201/10734 ,  H05K2201/10757 ,  H05K2201/10878 ,  Y02P70/611 ,  H01L2924/00 ,  H01L2924/01013 ,  H01L2924/01026 ,  H01L2924/3512 ,  H01L2224/29099 ,  H01L2224/48 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/00012 ,  H01L2924/20751 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/00015 ,  H01L2924/2075

Abstract: The probe card assembly (500) includes a probe card (502), and a space transformer (506) having resilient contact structures (524) mounted to and extending from terminals (522) on its surface. An interposer (504) is disposed between the space transformer and the probe card. The space transformer and interposer are stacked on the probe card and the resilient contact structures can be arranged to optimise probing of entire wafer.

Abstract translation: 探针卡组件（500）包括探针卡（502）和具有安装到其表面上的端子（522）并且在其表面上从端子（522）延伸的弹性接触结构（524）的空间变换器（506）。 插入器（504）设置在空间变换器和探针卡之间。 空间变压器和插入器堆叠在探针卡上，并且可以布置弹性接触结构以优化整个晶片的探测。

公开(公告)号：WO2003062322A1

公开(公告)日：2003-07-31

申请号：PCT/US2003/001577

申请日：2003-01-16

Applicant: FORMFACTOR, INC.

Inventor： KHANDROS, Igor, K. ,  ELDRIDGE, Benjamin, N. ,  FANG, Treliant ,  MATHIEU, Gaetan, L. ,  GRUBE, Gary, W. ,  DRUSH, Michael, A. ,  BUCKHOLTZ, Christopher, C.

IPC: C08L83/04

CPC classification number: C08G77/48 ,  B08B1/00 ,  B08B7/0028 ,  G01R1/06711 ,  G01R3/00 ,  Y10T428/24388 ,  Y10T428/31663

Abstract: A probe cleaning apparatus for cleaning a probe tip use to test semiconductors dies having an abrasive substrate layer an a tacky gel layer on top of the abrasive surface of the abrasive substrate layer. The probe tip is cleaned by passing it through the tacky gel layer so that it comes in contact with the abrasive surface of the abrasive substrate, moving the probe tip across the abrasive surface of the substrate layer, and then removing the probe tip from the successive layers of the cleaning apparatus. The probe tip emerges from the cleaning apparatus free from debris associated with testing the semiconductor dies.

Abstract translation: 用于清洁探针头的探针清洁装置用于测试在磨料基底层的研磨表面的顶部上具有磨料基底层和粘性凝胶层的半导体模具。 通过将探针尖端通过粘性凝胶层进行清洁，使其与磨料基材的研磨表面接触，使探针尖端跨过基底层的研磨表面，然后从连续的 层的清洁装置。 探针尖端从清洁设备中出来，没有与测试半导体管芯相关的碎片。