SPUTTER DEPOSITION SYSTEM
    3.
    发明申请

    公开(公告)号:WO2022018282A1

    公开(公告)日:2022-01-27

    申请号:PCT/EP2021/070734

    申请日:2021-07-23

    Abstract: The present invention relates to a sputter deposition system that comprises a rotatable substrate holder for holding one or more substrates and configured to allow rotation of the one or more substrates around their own axis and around the rotation axis of the rotatable substrate holder. The present invention provides for the coating of one or more substrates at the top end of the said one or more substrates and provides a homogeneous deposition of the substrate or substrates. Further, hereby disclosed is a method for depositing a coating on one or more substrates by means of the sputter deposition system described herein.

    SPUTTER DEPOSITION SYSTEM
    4.
    发明公开

    公开(公告)号:EP4400626A2

    公开(公告)日:2024-07-17

    申请号:EP24171254.6

    申请日:2021-07-23

    CPC classification number: C23C14/505 C23C14/044

    Abstract: The present invention relates to a sputter deposition system that comprises a rotatable substrate holder for holding one or more substrates and configured to allow rotation of the one or more substrates around their own axis and around the rotation axis of the rotatable substrate holder. The present invention provides for the coating of one or more substrates at the top end of the said one or more substrates and provides a homogeneous deposition of the substrate or substrates. Further, hereby disclosed is a method for depositing a coating on one or more substrates by means of the sputter deposition system described herein.

    SPUTTER DEPOSITION SYSTEM
    6.
    发明公开

    公开(公告)号:EP4400626A3

    公开(公告)日:2024-12-18

    申请号:EP24171254.6

    申请日:2021-07-23

    Abstract: The present invention relates to a sputter deposition system that comprises a rotatable substrate holder for holding one or more substrates and configured to allow rotation of the one or more substrates around their own axis and around the rotation axis of the rotatable substrate holder. The present invention provides for the coating of one or more substrates at the top end of the said one or more substrates and provides a homogeneous deposition of the substrate or substrates. Further, hereby disclosed is a method for depositing a coating on one or more substrates by means of the sputter deposition system described herein.

Patent Agency Ranking