Abstract:
The present invention provides an organic semiconductor film forming composition which is capable of producing an organic semiconductor film showing excellent mobility and having a small variation in mobility between samples. The organic semiconductor film forming composition of the present invention contains at least a first organic semiconductor compound which includes a mother nucleus that has two or more thiophene rings and is formed of a fused ring structure having at least four or more rings including thiophene rings, and a substituent X bonded to the mother nucleus in a molecule; a second organic semiconductor compound which includes the same mother nucleus as the mother nucleus of the first organic semiconductor compound and satisfies a predetermined requirement; and an organic solvent.
Abstract:
An object of the present invention is to provide a composition for forming an organic semiconductor film that makes it possible to obtain an organic semiconductor film having excellent mobility and heat stability, an organic semiconductor element including an organic semiconductor film having excellent mobility and heat stability, and a method for manufacturing the organic semiconductor element. The composition for forming an organic semiconductor film of the present invention contains an organic semiconductor having a condensed polycyclic aromatic group and a polymer, in which the number of rings in the condensed polycyclic aromatic group is equal to or greater than 4, at least two rings in the condensed polycyclic aromatic group contain at least one atom selected from the group consisting of a sulfur atom, a nitrogen atom, a selenium atom, and an oxygen atom, the condensed polycyclic aromatic group contains, as a partial structure, at least any one structure selected from the group consisting of a benzene ring, a naphthalene ring, and a phenanthrene ring, and the polymer has a glass transition temperature of equal to or higher than -100°C and equal to or less than -30°C and an elastic recovery of equal to or less than 30%.
Abstract:
An aqueous ink composition includes an aqueous medium and resin microparticles formed from a resin, in which the resin has a structural unit represented by General Formula (1) or (2), and the content of the resin microparticles is 1% to 15% by mass, R 1 , R 2 , and R 3 each represent a hydrogen atom or an alkyl group having 1 to 4 carbon atoms; A 1 represents -O- or -NR 3 -; L 1 represents an alkylene group having 6 to 22 carbon atoms; M 1 and M 2 each represent a hydrogen atom, an alkali metal ion, or an ammonium ion; A 2 represents a single bond, -COO-, or -CONH-; and L 2 represents a divalent linking group having 6 to 23 carbon atoms.
Abstract:
A silver halide color photographic light-sensitive material, having, on a support, at least one silver halide emulsion layer containing a cyan dye forming coupler, at least one silver halide emulsion layer containing a magenta dye forming coupler, and at least one silver halide emulsion layer containing a yellow dye forming coupler, wherein at least one layer of said at least one silver halide emulsion layer containing a cyan dye forming coupler contains high-silver chloride emulsion grains, which are selenium-sensitized and have a silver chloride content of 90 mol % or more, and contains at least one coupler of formula (I): wherein R' and R'' each independently are a substituent; and Z is a hydrogen atom, or a group capable of being split-off upon coupling reaction with an oxidized aromatic primary amine color-developing agent.
Abstract:
A silver halide color photographic light-sensitive material having, on a support, at least one red-sensitive silver halide emulsion layer, at least one green-sensitive silver halide emulsion layer and at least one blue-sensitive silver halide emulsion layer, characterized in that at least one of the silver halide emulsion layers contains a silver halide emulsion having a silver chloride content of 90 mole % or above, the silver halide emulsion contains at least one kind of selenium compound, and the silver halide emulsion layer containing the silver halide emulsion has a characteristic curve satisfying the following relation (1); Relation €ƒ ( 1 ) €ƒ 2.0 ‰¥ ³ H / ³ L ‰¥ 0.5 wherein ³ represents a gradient of the characteristic curve, ³ H represents a gradient in the case of 1 × 10 -6 - second exposure and ³ L represents a gradient in the case of 100-second exposure.
Abstract:
PROBLEM TO BE SOLVED: To provide a method for producing a conductive film, capable of obtaining a conductive film excellent in adhesion to a thermoplastic resin substrate by pulse light irradiation.SOLUTION: The method for producing a conductive film comprises: a coating film formation step of applying a conductive film-forming composition containing copper oxide particles (A), copper particles (B), and an organic polymer (C), where the ratio (B/A) of the content of the copper particles (B) to the content of the copper oxide particles (A) is 10-50 mass%, onto a thermoplastic resin substrate to form a coating film; and a reduction step of reducing the copper oxide particles (A) by irradiating the coating film with pulse light, to form a conductive film containing copper.
Abstract:
PROBLEM TO BE SOLVED: To provide a wiring structure manufacturing method by which fine wiring formed so as to extend over a plurality of materials is prevented from being disconnected and desirable fine wiring is formed, in the formation of fine wiring using an inkjet system, to provide a wiring structure manufacturing apparatus, and to provide a wiring structure.SOLUTION: A first adhesion auxiliary layer (14) corresponding to the base material of a substrate (10) is pattern-formed by an inkjet system, and a second adhesion auxiliary layer (16) corresponding to a silicon device (12) is pattern-formed by the inkjet system, so as to correspond to a pattern of electrical wiring (20) that is formed on the surface of the substrate (10) containing silicon device (12) so as to extend over the substrate and the silicon device. Then, a plating receptive layer (18) is pattern-formed by using the inkjet system on the first adhesion auxiliary layer and second adhesion auxiliary layer. Further, the electrical wiring (20) is formed by applying a plating treatment to the plating receptive layer.
Abstract:
PROBLEM TO BE SOLVED: To provide an image forming method achieving excellent glossiness of an image, suppressing the fixing offset of an image part, and improving both side printing performance.SOLUTION: The image forming method includes an ink feeding step for feeding an ink composition on a recording medium by an ink jet method, and a dispersion liquid feeding step for feeding a dispersion liquid having polymer particles with the volume average particle size of 1 μm or more and 30 μm or less and the glass transition temperature of 100°C or more, and an nonvolatile solvent on the recording medium with the ink composition.
Abstract:
PROBLEM TO BE SOLVED: To provide an ink composition having excellent scratch resistance and formable of an image wherein generation of fixing roller offset is suppressed, and to provide a method for producing the same. SOLUTION: The ink composition contains resin particles thermally treated at 40 to 80°C for 12 hr or more in the presence of an organic solvent, a pigment and water. COPYRIGHT: (C)2011,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a thermal transfer technology that can form a high-density image at high speed while being used to solve the problem of fusion or sticking with an image-receiving sheet for thermal transfer recording without the occurrence of ribbon wrinkles. SOLUTION: A thermal transfer sheet comprises at least one yellow thermal transfer layer, one magenta thermal transfer layer, one cyan thermal transfer layer, and one releasable, thermal-transferable protective layer on a support body. The thermal transfer layer of each color contains a release agent. Contents of the release agent in the thermal transfer layers are reduced in a frame-sequential manner. COPYRIGHT: (C)2009,JPO&INPIT