Abstract:
The present invention relates to a positiive-working presensitized plate useful for preparing a lithographic printing plate comprising a positive-working photosensitive composition comprising at least one ester of 1,2-naphthoquinone-2-diazide-5-sulfonic acid, at least one ester of 1,2-naphthoquinone-2-diazide-4-sulfonic acid, and at least one polymer which is insoluble in water and soluble in an aqueous alkaline solution and which comprises at least one group or bond selected from sulfonamide group, urea bond or urethane bond. A lithographic printing plate prepared from the presensitized plate of the present invention shows improvement of chemical-resistance and printing durability, and good sensitivity, coupling property, adaptability to ball-point pen, shelf stability, and stability of sensitivity with time after exposure.
Abstract:
PROBLEM TO BE SOLVED: To provide a temporary adhesive for manufacturing a semiconductor apparatus, capable of supporting temporarily a member to be processed, such as a semiconductor wafer, reliably and easily when the member to be processed is subjected to mechanical or chemical processing, and capable of easily releasing the temporal support to a processed member without damaging the processed member; and to provide an adhesive support using the adhesive and a method of manufacturing the semiconductor apparatus.SOLUTION: A temporary adhesive for manufacturing a semiconductor apparatus comprises (A) a polymer compound having an acid group, (B) a diluent, and (C) a solvent. An adhesive support using the adhesive and a method of manufacturing the semiconductor apparatus are also provided.
Abstract:
PROBLEM TO BE SOLVED: To provide a positive resist composition for electron beam or X-ray having high sensitivity and good profile configuration in addition to high resolution particularly in the manufacture of a semiconductor device or the like, and a pattern forming method using the same. SOLUTION: The chemically amplified positive resist composition for electron beam or X-ray comprises an alkali-soluble resin having a weight average molecular weight of >3,000 to 300,000 and a specific structure or a resin which is decomposed by the action of an acid and has increased solubility to an alkali developer. The pattern forming method using the same is also provided. COPYRIGHT: (C)2009,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device in which a to-be-processed member is temporarily supported with ease and with sure, and temporary supporting of a processed member is easily released without damaging the processed member.SOLUTION: A method of manufacturing a semiconductor device includes a step in which active beam, radiation, or heat is radiated to an adhesive layer of adhesive supporters 100, 110, and 120 containing adhesive layers 11, 21, and 31 whose adhesive property increases or decreases under radiation of the active beam, radiation, or heat 50, and a substrate, a step in which a first surface of a to-be processed member is bonded to the adhesive layer of the adhesive supporter, a step in which a second surface which is different from the first surface of the to-be processed member is applied with mechanical or chemical treatment, to obtain a processed member, and a step in which the first surface of the processed member is disconnected from the adhesive layer of the adhesive supporter. In order that the adhesive property degrades from an inner surface on the substrate side of the adhesive layer to an outer surface, the adhesive layer is radiated with active beam, radiation, or heat.
Abstract:
PROBLEM TO BE SOLVED: To temporarily bond a processed substrate surely and easily to a substrate support member, and to easily release temporal bonding for the processed substrate without causing any damage or warpage of the processed substrate after processing.SOLUTION: A substrate support member supports a processed substrate removably on a flat supporting surface 17 where an adhesive layer 19 is formed. The adhesive layer 19 has at least a first adhesive region 41, and a plurality of second adhesive regions 43 having adhesive strength higher than that of the first adhesive region. The plurality of second adhesive regions 43 are arranged discretely on the flat supporting surface 17, and the first adhesive region 41 is arranged continuously from the outer peripheral side edge 19a of the adhesive layer 19 toward the center position of the flat supporting surface 17.
Abstract:
PROBLEM TO BE SOLVED: To provide a semiconductor device manufacturing method which causes less influence on processing accuracy when performing mechanical or chemical treatment on a processing member, and which can temporarily support the processing member reliably and easily and easily release the temporary support of the processing member without causing a damage on the processing member.SOLUTION: The semiconductor device manufacturing method comprises the steps of: forming a high adhesion region and a low adhesion region in an adhesive layer 11 of an adhesive support medium 100 having a substrate 12 and the adhesive layer 11 with adhesion increased or decreased by irradiation of active light beams or radial rays 50, by performing pattern exposure on the adhesive layer; adhering a first surface of a processing member to the adhesive layer of the adhesive support medium; performing a mechanical or chemical treatment on a second surface of the processing member different from the first surface to obtain a processed member; and detaching the adhesive support medium from the first surface of the processed member.
Abstract:
PROBLEM TO BE SOLVED: To provide a temporary adhesive for semiconductor device manufacturing, an adhesive support member using the same and a semiconductor device manufacturing method, which can temporarily support a processing member reliably and easily and easily release temporary support of a processed member without causing damages in the processed member when the processing member (semiconductor wafer and the like) is subjected to a mechanical or chemical treatment.SOLUTION: A temporary adhesive for semiconductor device manufacturing includes (A) a resin, (B) a cross-linking compound, (C) a solvent, (D) a reaction initiator and (E) a sensitizing dye. An adhesive support member and a semiconductor manufacturing method using the temporary adhesive for semiconductor device manufacturing are provided.