公开(公告)号：DE60142142D1

公开(公告)日：2010-07-01

申请号：DE60142142

申请日：2001-03-22

Applicant: FUJIFILM CORP

Inventor： FUJITA KAZUO ,  TAN SHIRO ,  NAGASHIMA AKIRA

IPC: G03F7/022 ,  G03F7/033 ,  B41N1/14 ,  G03F7/00 ,  G03F7/023

公开(公告)号：AT468550T

公开(公告)日：2010-06-15

申请号：AT01106429

申请日：2001-03-22

Applicant: FUJIFILM CORP

Inventor： FUJITA KAZUO ,  TAN SHIRO ,  NAGASHIMA AKIRA

IPC: G03F7/022 ,  G03F7/033 ,  B41N1/14 ,  G03F7/00 ,  G03F7/023

Abstract: The present invention relates to a positiive-working presensitized plate useful for preparing a lithographic printing plate comprising a positive-working photosensitive composition comprising at least one ester of 1,2-naphthoquinone-2-diazide-5-sulfonic acid, at least one ester of 1,2-naphthoquinone-2-diazide-4-sulfonic acid, and at least one polymer which is insoluble in water and soluble in an aqueous alkaline solution and which comprises at least one group or bond selected from sulfonamide group, urea bond or urethane bond. A lithographic printing plate prepared from the presensitized plate of the present invention shows improvement of chemical-resistance and printing durability, and good sensitivity, coupling property, adaptability to ball-point pen, shelf stability, and stability of sensitivity with time after exposure.

公开(公告)号：JP2013256610A

公开(公告)日：2013-12-26

申请号：JP2012134189

申请日：2012-06-13

Applicant: Fujifilm Corp ,  富士フイルム株式会社

Inventor： FUJIMAKI KAZUHIRO ,  KOYAMA ICHIRO ,  NAKAMURA ATSUSHI ,  IWAI HISASHI ,  TAN SHIRO

IPC: C09J201/02 ,  C09J11/06 ,  C09J133/00 ,  C09J161/06 ,  C09J175/04 ,  H01L21/304 ,  H01L23/14

CPC classification number: C09J7/02 ,  C09J7/20 ,  C09J7/38 ,  C09J133/02 ,  C09J133/12 ,  C09J161/06 ,  C09J175/14 ,  C09J175/16 ,  C09J2203/326 ,  C09J2205/31 ,  C09J2433/00 ,  C09J2461/00 ,  C09J2475/00 ,  H01L21/302 ,  H01L21/6835 ,  H01L21/6836 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381 ,  H01L2221/68386 ,  H01L2224/13 ,  Y10T428/2852

Abstract: PROBLEM TO BE SOLVED: To provide a temporary adhesive for manufacturing a semiconductor apparatus, capable of supporting temporarily a member to be processed, such as a semiconductor wafer, reliably and easily when the member to be processed is subjected to mechanical or chemical processing, and capable of easily releasing the temporal support to a processed member without damaging the processed member; and to provide an adhesive support using the adhesive and a method of manufacturing the semiconductor apparatus.SOLUTION: A temporary adhesive for manufacturing a semiconductor apparatus comprises (A) a polymer compound having an acid group, (B) a diluent, and (C) a solvent. An adhesive support using the adhesive and a method of manufacturing the semiconductor apparatus are also provided.

Abstract translation: 要解决的问题：提供一种用于制造半导体装置的临时粘合剂，当待加工的构件经受机械或化学处理时，能够可靠且容易地暂时支撑诸如半导体晶片的待加工构件，并且 能够容易地将时间支撑件释放到加工构件而不损坏被处理构件; 并提供使用粘合剂的粘合剂支持体和制造半导体装置的方法。解决方案：用于制造半导体装置的临时粘合剂包括（A）具有酸基的聚合物化合物，（B）稀释剂，和（C） 溶剂。 还提供了使用粘合剂的粘合剂支撑体和制造半导体装置的方法。

公开(公告)号：JP2009086684A

公开(公告)日：2009-04-23

申请号：JP2008324528

申请日：2008-12-19

Applicant: Fujifilm Corp ,  富士フイルム株式会社

Inventor： TAN SHIRO ,  SORORI TADAHIRO ,  ADEGAWA YUTAKA

IPC: G03F7/039 ,  G03F7/00 ,  H01L21/027

Abstract: PROBLEM TO BE SOLVED: To provide a positive resist composition for electron beam or X-ray having high sensitivity and good profile configuration in addition to high resolution particularly in the manufacture of a semiconductor device or the like, and a pattern forming method using the same. SOLUTION: The chemically amplified positive resist composition for electron beam or X-ray comprises an alkali-soluble resin having a weight average molecular weight of >3,000 to 300,000 and a specific structure or a resin which is decomposed by the action of an acid and has increased solubility to an alkali developer. The pattern forming method using the same is also provided. COPYRIGHT: (C)2009,JPO&INPIT

Abstract translation: 要解决的问题：除了具有高分辨率，特别是在半导体器件等的制造中，提供具有高灵敏度和良好轮廓结构的电子束或X射线的正型抗蚀剂组合物，以及图案形成方法 使用相同 解决方案：电子束或X射线的化学放大型正性抗蚀剂组合物包括重均分子量> 3,000至300,000的碱溶性树脂和特定结构或通过 并且对碱性显影剂具有增加的溶解性。 还提供了使用该图案形成方法的图案形成方法。 版权所有（C）2009，JPO＆INPIT

公开(公告)号：JP2013211505A

公开(公告)日：2013-10-10

申请号：JP2012134188

申请日：2012-06-13

Applicant: Fujifilm Corp ,  富士フイルム株式会社

Inventor： TAN SHIRO ,  FUJIMAKI KAZUHIRO ,  IWAI HISASHI ,  KOYAMA ICHIRO ,  NAKAMURA ATSUSHI

IPC: H01L21/683 ,  H01L21/02 ,  H01L21/304

CPC classification number: H01L23/562 ,  C09J7/22 ,  C09J7/35 ,  C09J2203/326 ,  C09J2205/302 ,  H01L21/67115 ,  H01L21/6835 ,  H01L21/6836 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381 ,  H01L2924/0002 ,  H01L2924/00

Abstract: PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device in which a to-be-processed member is temporarily supported with ease and with sure, and temporary supporting of a processed member is easily released without damaging the processed member.SOLUTION: A method of manufacturing a semiconductor device includes a step in which active beam, radiation, or heat is radiated to an adhesive layer of adhesive supporters 100, 110, and 120 containing adhesive layers 11, 21, and 31 whose adhesive property increases or decreases under radiation of the active beam, radiation, or heat 50, and a substrate, a step in which a first surface of a to-be processed member is bonded to the adhesive layer of the adhesive supporter, a step in which a second surface which is different from the first surface of the to-be processed member is applied with mechanical or chemical treatment, to obtain a processed member, and a step in which the first surface of the processed member is disconnected from the adhesive layer of the adhesive supporter. In order that the adhesive property degrades from an inner surface on the substrate side of the adhesive layer to an outer surface, the adhesive layer is radiated with active beam, radiation, or heat.

Abstract translation: 要解决的问题：提供一种制造半导体器件的方法，其中待处理部件能够容易且暂时地被支撑，并且可以容易地释放处理部件的临时支撑而不损坏处理部件。解决方案： 一种制造半导体器件的方法包括以下步骤：主动光束，辐射或热辐射到粘合剂支撑体100,110和120的粘合剂层，粘合剂层100,110和120的粘合剂层11,21和31的粘合性能增加或降低， 活性光束的辐射，辐射或热量50以及基板，将待处理部件的第一表面粘合到粘合剂支撑体的粘合剂层的步骤，其中第二表面是 与被处理构件的第一表面不同的是施加机械或化学处理，以获得加工构件，以及处理构件的第一表面断开的步骤 从粘合剂支撑体的粘合剂层上覆盖。 为了使粘合剂性能从粘合剂层的基材侧的内表面降解到外表面，粘合剂层以活性光束，辐射或热辐射。

公开(公告)号：JP2014096422A

公开(公告)日：2014-05-22

申请号：JP2012245829

申请日：2012-11-07

Applicant: Fujifilm Corp ,  富士フイルム株式会社

Inventor： SAWANO MITSURU ,  NAKAMURA ATSUSHI ,  TAN SHIRO

IPC: H01L21/683 ,  H01L21/02 ,  H01L27/12

Abstract: PROBLEM TO BE SOLVED: To temporarily bond a processed substrate surely and easily to a substrate support member, and to easily release temporal bonding for the processed substrate without causing any damage or warpage of the processed substrate after processing.SOLUTION: A substrate support member supports a processed substrate removably on a flat supporting surface 17 where an adhesive layer 19 is formed. The adhesive layer 19 has at least a first adhesive region 41, and a plurality of second adhesive regions 43 having adhesive strength higher than that of the first adhesive region. The plurality of second adhesive regions 43 are arranged discretely on the flat supporting surface 17, and the first adhesive region 41 is arranged continuously from the outer peripheral side edge 19a of the adhesive layer 19 toward the center position of the flat supporting surface 17.

Abstract translation: 要解决的问题：将经处理的基板牢固地粘合到基板支撑构件上，并且可以容易地释放处理后的基板的时间粘合，而不会在加工后对加工的基板造成任何损坏或翘曲。解决方案：基板支撑构件 处理后的基板可移除地形成在其上形成有粘合剂层19的平坦支撑表面17上。 粘合剂层19至少具有第一粘合区域41和具有比第一粘合剂区域的粘合强度高的粘合强度的多个第二粘合区域43。 多个第二粘合区域43分散配置在平坦支撑面17上，第一粘合区域41从粘合剂层19的外周侧边缘19a向扁平支撑面17的中心位置连续配置。

公开(公告)号：JP2014017462A

公开(公告)日：2014-01-30

申请号：JP2012232417

申请日：2012-10-19

Applicant: Fujifilm Corp ,  富士フイルム株式会社

Inventor： TAN SHIRO ,  FUJIMAKI KAZUHIRO ,  NAKAMURA ATSUSHI ,  IWAI HISASHI ,  KOYAMA ICHIRO

IPC: H01L21/304 ,  H01L21/02

CPC classification number: H01L21/673 ,  C09J5/04 ,  C09J7/22 ,  C09J7/35 ,  C09J2205/302 ,  H01L21/6835 ,  H01L21/6836 ,  H01L24/13 ,  H01L2221/68331 ,  H01L2221/6834 ,  H01L2221/68363 ,  H01L2221/68381 ,  H01L2221/68386 ,  H01L2924/12042 ,  H01L2924/00

Abstract: PROBLEM TO BE SOLVED: To provide a semiconductor device manufacturing method which causes less influence on processing accuracy when performing mechanical or chemical treatment on a processing member, and which can temporarily support the processing member reliably and easily and easily release the temporary support of the processing member without causing a damage on the processing member.SOLUTION: The semiconductor device manufacturing method comprises the steps of: forming a high adhesion region and a low adhesion region in an adhesive layer 11 of an adhesive support medium 100 having a substrate 12 and the adhesive layer 11 with adhesion increased or decreased by irradiation of active light beams or radial rays 50, by performing pattern exposure on the adhesive layer; adhering a first surface of a processing member to the adhesive layer of the adhesive support medium; performing a mechanical or chemical treatment on a second surface of the processing member different from the first surface to obtain a processed member; and detaching the adhesive support medium from the first surface of the processed member.

Abstract translation: 要解决的问题：提供一种在对处理部件进行机械化学处理时对加工精度影响较小的半导体装置的制造方法，能够可靠且容易地暂时支撑加工部件，并且能够容易地释放加工用的临时支撑体 构件，而不会对处理构件造成损坏。解决方案：半导体器件制造方法包括以下步骤：在具有基底12和粘合剂的粘合剂支撑介质100的粘合剂层11中形成高粘合性区域和低粘合性区域 通过在粘合剂层上进行图案曝光，通过照射活性光束或径向射线50而增加或减少粘附层11; 将加工构件的第一表面粘附到粘合剂支撑介质的粘合剂层; 对与所述第一表面不同的所述处理用构件的第二表面进行机械或化学处理，以获得加工构件; 并且从加工构件的第一表面分离粘合剂支撑介质。

公开(公告)号：JP2013258332A

公开(公告)日：2013-12-26

申请号：JP2012134191

申请日：2012-06-13

Applicant: Fujifilm Corp ,  富士フイルム株式会社

Inventor： TAN SHIRO ,  FUJIMAKI KAZUHIRO ,  IWAI HISASHI ,  KOYAMA ICHIRO ,  NAKAMURA ATSUSHI

IPC: H01L21/02 ,  C09J11/06 ,  C09J201/00 ,  H01L21/304

CPC classification number: C09J11/06 ,  C08L2203/206 ,  H01L21/6835 ,  H01L21/6836 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381

Abstract: PROBLEM TO BE SOLVED: To provide a temporary adhesive for semiconductor device manufacturing, an adhesive support member using the same and a semiconductor device manufacturing method, which can temporarily support a processing member reliably and easily and easily release temporary support of a processed member without causing damages in the processed member when the processing member (semiconductor wafer and the like) is subjected to a mechanical or chemical treatment.SOLUTION: A temporary adhesive for semiconductor device manufacturing includes (A) a resin, (B) a cross-linking compound, (C) a solvent, (D) a reaction initiator and (E) a sensitizing dye. An adhesive support member and a semiconductor manufacturing method using the temporary adhesive for semiconductor device manufacturing are provided.

Abstract translation: 要解决的问题：为了提供一种用于半导体器件制造的临时粘合剂，使用该粘合剂的粘合剂支撑构件和半导体器件制造方法，其能够可靠且容易地临时地支撑处理构件并且容易地释放处理构件的临时支撑而不引起 处理部件（半导体晶片等）进行机械或化学处理时，加工部件的损伤。解决方案：半导体器件制造用临时粘合剂包括（A）树脂，（B）交联化合物， （C）溶剂，（D）反应引发剂和（E）敏化染料。 提供了一种粘合剂支撑构件和使用该半导体器件制造用临时粘合剂的半导体制造方法。