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    TEMPORARY BONDING LAMINATES FOR USED IN MANUFACTURE OF SEMICONDUCTOR DEVICES AND METHODS FOR MANUFACTURING SEMICONDUCTOR DEVICES
    2.
    发明申请
    TEMPORARY BONDING LAMINATES FOR USED IN MANUFACTURE OF SEMICONDUCTOR DEVICES AND METHODS FOR MANUFACTURING SEMICONDUCTOR DEVICES 有权
    用于制造半导体器件的临时粘结层压板及制造半导体器件的方法

    公开(公告)号：US20160035612A1

    公开(公告)日：2016-02-04

    申请号：US14865961

    申请日：2015-09-25

    Applicant: FUJIFILM Corporation

    Inventor： Ichiro KOYAMA ,  Yu IWAI ,  Masafumi YOSHIDA

    IPC: H01L21/683

    CPC classification number: H01L21/6835 ,  C09J7/40 ,  C09J2201/622 ,  C09J2203/326 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381 ,  H01L2221/68386

    Abstract: Provided is temporary bonding laminates for used in a manufacture of semiconductor devices, by which a member to be processed (a semiconductor wafer or the like) can be temporarily supported securely and readily during a mechanical or chemical process of the member to be processed and then the processed member can be readily released from the temporary support without damaging the processed member even after a high temperature process, and processes for manufacturing semiconductor devices. The temporary bonding laminate includes (A) a release layer and (B) an adhesive layer, wherein the release layer (A) comprises (a1) a first release layer having a softening point of 200° C. or more and adjoining the adhesive layer (B), and (a2) a second release layer adjoining the first release layer (a1); the second release layer (a2) contains a resin; and the resin after curing has a capable of being dissolved at 5% by mass or more, at 25° C., in at least one kind of solvents selected from hexane and the like.

    Abstract translation: 提供了用于制造半导体器件的临时粘合层压体，通过该半导体器件可以在待加工构件的机械或化学过程中可靠且容易地暂时支撑待加工构件（半导体晶片等），然后 即使在高温处理之后，处理过的构件也可以容易地从临时支撑体释放而不损坏处理的构件，以及用于制造半导体器件的工艺。 临时粘合层压体包括（A）剥离层和（B）粘合剂层，其中剥离层（A）包含（a1）软化点为200℃以上的第一剥离层，并且与粘合剂层相邻 （B），和（a2）与第一剥离层（a1）相邻的第二剥离层。 第二剥离层（a2）含有树脂; 固化后的树脂在25℃，5质量％以上溶解于选自己烷等的至少一种溶剂中。

    NANOIMPRINTING METHOD
    3.
    发明申请
    NANOIMPRINTING METHOD 审中-公开
    纳米法

    公开(公告)号：US20130292877A1

    公开(公告)日：2013-11-07

    申请号：US13932688

    申请日：2013-07-01

    Applicant: FUJIFILM Corporation

    Inventor： Atsushi TATSUGAWA ,  Masafumi YOSHIDA

    IPC: B29C59/02

    CPC classification number: B29C59/026 ,  B29C37/0067 ,  B82Y10/00 ,  B82Y40/00 ,  G03F7/0002

    Abstract: A mold equipped with a substrate having a fine pattern of protrusions and recesses and a mold release layer formed along the pattern of protrusions and recesses on the surface thereof is employed to press resist coated on a substrate, to form a resist pattern, to which the pattern of protrusions and recesses is transferred. The thickness of the mold release layer and the pressing force with which the mold is pressed against the resist are controlled such that the line width of the resist pattern becomes a desired value. The width of the lines of the resist pattern is controlled by this configuration.

    Abstract translation: 采用具有突起和凹陷的精细图案的基板和沿其表面上的突起和凹陷的图案形成的脱模层的模具来压制涂覆在基板上的抗蚀剂，以形成抗蚀剂图案， 转移突起和凹陷的图案。 控制脱模层的厚度和将模具压在抗蚀剂上的压力使得抗蚀剂图案的线宽变为期望值。 通过该结构来控制抗蚀剂图案的线的宽度。

    LENTICULAR DISPLAY
    4.
    发明申请
    LENTICULAR DISPLAY 审中-公开

    公开(公告)号：US20180224661A1

    公开(公告)日：2018-08-09

    申请号：US15944803

    申请日：2018-04-04

    Applicant: FUJIFILM CORPORATION

    Inventor： Ryou HIBINO ,  Masafumi YOSHIDA ,  Ryuichi KATSUMOTO ,  Yanlong CHE

    IPC: G02B27/02 ,  G02B3/00 ,  G02B3/06

    CPC classification number: G02B27/022 ,  G02B3/0056 ,  G02B3/06 ,  G02B27/2214 ,  G02B2003/0093 ,  G03B25/02 ,  G09F19/14

    Abstract: Provided is a lenticular display including a lenticular lens including a plurality of columnar convex lenses that each have a semicylindrical surface and are arrayed in parallel and a lenticular image disposed on an opposite side of the convex lenses from the semicylindrical surface. The lenticular image includes an image strip group in which a plurality of image strips for displaying a plurality of display images respectively are arranged in positions for causing the image strips to be displayed through the plurality of convex lenses respectively in a state where a longitudinal direction of the image strips is parallel to a longitudinal direction of the plurality of convex lenses, and in the image strip groups, and a total width of image strips for displaying at least one display image among the plurality of display images is larger than a total width of image strips for displaying another display image.

    METHOD FOR CLEANSING NANOIMPRINTING MOLDS
    6.
    发明申请
    METHOD FOR CLEANSING NANOIMPRINTING MOLDS 有权
    清洁纳米粒子的方法

    公开(公告)号：US20130291890A1

    公开(公告)日：2013-11-07

    申请号：US13932126

    申请日：2013-07-01

    Applicant: Fujifilm Corporation

    Inventor： Masafumi YOSHIDA

    IPC: B08B3/12

    CPC classification number: B08B3/12 ,  B29C33/62 ,  B82Y10/00 ,  B82Y40/00 ,  C11D11/0047 ,  G03F7/0002 ,  G03F7/3014

    Abstract: A method for cleansing a mold of the present invention suppresses generation of damage is a method for cleansing a nanoimprinting mold, in which a mesa type mold is immersed in cleansing fluid and ultrasonic cleansing is performed in a state in which a mold release layer containing a fluorine compound is provided on a patterned region of the mesa type mold.

    Abstract translation: 本发明的清洁模具的方法抑制损伤的产生是一种清洁纳米压印模具的方法，其中将台面型模具浸入清洁液中并在超声波清洗中进行超声波清洗，其中含有 氟化合物设置在台面型模具的图案化区域上。

    MOBILE COMMUNICATION TERMINAL
    7.
    发明申请
    MOBILE COMMUNICATION TERMINAL 审中-公开

    公开(公告)号：US20190165486A1

    公开(公告)日：2019-05-30

    申请号：US16263468

    申请日：2019-01-31

    Applicant: FUJIFILM Corporation

    Inventor： Masafumi YOSHIDA

    IPC: H01Q21/06 ,  H01Q1/24 ,  H01Q3/36 ,  H01Q1/38 ,  H04M1/02

    Abstract: A mobile communication terminal capable of maintaining communication with the outside is provided. The mobile communication terminal includes a proximity sensor, a film antenna, a casing antenna, and a control unit, and the proximity sensor, the film antenna, the casing antenna, and the control unit are provided in the casing. It is preferable for a main component of the casing to be a metal.

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