公开(公告)号：WO2015088708A3

公开(公告)日：2015-10-08

申请号：PCT/US2014065964

申请日：2014-11-17

Applicant: FUJIFILM DIMATIX INC

Inventor： LATEV DIMITRE ,  HAJATI ARMAN ,  IMAI DARREN TODD ,  TRAN UT

IPC: B06B1/06

CPC classification number: H01L41/042 ,  B06B1/0622 ,  B32B37/12 ,  B32B37/185 ,  B32B2457/00 ,  H01L41/0475 ,  H01L41/098 ,  H01L41/29 ,  Y10T156/10

Abstract: Techniques and structures for providing flexibility of a micromachined transducer array. In an embodiment, a transducer array includes a plurality of transducer elements each comprising a piezoelectric element and one or more electrodes disposed in or on a support layer. The support layer is bonded to a flexible layer including a polymer material, wherein flexibility of the transducer array results in part from a total thickness of a flexible layer. In another embodiment, flexibility of the transducer array results in part from one or more flexural structures formed therein.

Abstract translation: 提供微加工换能器阵列灵活性的技术和结构。 在一个实施例中，换能器阵列包括多个换能器元件，每个换能器元件包括设置在支撑层中或上的压电元件和一个或多个电极。 支撑层结合到包括聚合物材料的柔性层，其中换能器阵列的柔性部分地导致柔性层的总厚度。 在另一个实施例中，换能器阵列的灵活性部分地由其中形成的一个或多个挠曲结构引起。

公开(公告)号：EP3092083A4

公开(公告)日：2017-11-29

申请号：EP14878344

申请日：2014-09-09

Applicant: FUJIFILM DIMATIX INC

Inventor： HAJATI ARMAN ,  TRAN UT ,  IMAI DARREN TODD ,  SCHOEPPLER MARTIN

IPC: B06B1/06

CPC classification number: B06B1/0622 ,  B06B1/0688 ,  H01L41/098 ,  H01L41/313 ,  H01L41/331 ,  Y10T29/42

Abstract: Techniques and mechanisms to provide mechanical support for a micromachined piezoelectric transducer array. In an embodiment, a transducer array includes transducer elements each comprising a respective membrane portion and a respective supporting structure disposed on or around a periphery of that membrane portion. The transducer elements are initially formed on a sacrificial wafer, wherein supporting structures of the transducer elements facilitate subsequent removal of the sacrificial wafer and/or subsequent handling of the transducer elements. In another embodiment, a polymer layer is disposed on the transducer elements to provide for flexible support during such subsequent handling.

公开(公告)号：EP3079838A4

公开(公告)日：2017-08-16

申请号：EP14868892

申请日：2014-11-17

Applicant: FUJIFILM DIMATIX INC

Inventor： LATEV DIMITRE ,  HAJATI ARMAN ,  IMAI DARREN TODD ,  TRAN UT

IPC: B06B1/06

CPC classification number: H01L41/042 ,  B06B1/0622 ,  B32B37/12 ,  B32B37/185 ,  B32B2457/00 ,  H01L41/0475 ,  H01L41/098 ,  H01L41/29 ,  Y10T156/10

Abstract: Techniques and structures for providing flexibility of a micromachined transducer array. In an embodiment, a transducer array includes a plurality of transducer elements each comprising a piezoelectric element and one or more electrodes disposed in or on a support layer. The support layer is bonded to a flexible layer including a polymer material, wherein flexibility of the transducer array results in part from a total thickness of a flexible layer. In another embodiment, flexibility of the transducer array results in part from one or more flexural structures formed therein.

Abstract translation: 提供微加工换能器阵列灵活性的技术和结构。 在一个实施例中，换能器阵列包括多个换能器元件，每个换能器元件包括设置在支撑层中或上的压电元件和一个或多个电极。 支撑层结合到包括聚合物材料的柔性层，其中换能器阵列的柔性部分地导致柔性层的总厚度。 在另一个实施例中，换能器阵列的灵活性部分地由其中形成的一个或多个挠曲结构引起。