公开(公告)号：EP2503859A4

公开(公告)日：2013-11-20

申请号：EP10839574

申请日：2010-12-24

Applicant: FUJIKURA LTD

Inventor： YAMAMOTO SATOSHI ,  SUZUKI TAKANAO ,  MATSUYAMA MASAMI

IPC: H05K1/11 ,  H01L23/12 ,  H05K3/40

CPC classification number: H05K3/0029 ,  H01L23/49827 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/115 ,  H05K3/42 ,  H05K2201/09509 ,  H05K2201/09563 ,  H05K2201/09827 ,  H05K2201/09836 ,  H05K2201/09854 ,  H05K2201/10378 ,  H05K2203/025 ,  Y10T29/49165 ,  H01L2924/00

Abstract: An interposer substrate of the present invention includes a planar substrate, and through hole wiring that is formed by filling a through hole that connects together a first main surface and a second main surface of this substrate with a conductor. When the through hole is viewed in a vertical cross-sectional view of the substrate, the through hole has a trapezoidal shape whose side walls are formed by an inside surface of the through hole, and two side faces of the trapezoid are not parallel to each other. The two side faces of the trapezoid are both inclined towards the same side relative to two perpendicular lines that are perpendicular to the first main surface or the second main surface at two apex points forming a top face or a bottom face of the trapezoid.

公开(公告)号：JP2011134982A

公开(公告)日：2011-07-07

申请号：JP2009294989

申请日：2009-12-25

Applicant: Fujikura Ltd ,  株式会社フジクラ

Inventor： YAMAMOTO SATOSHI ,  SUZUKI TAKANAO ,  MATSUYAMA MASAMI

IPC: H05K1/11 ,  H01L23/12 ,  H05K3/40

CPC classification number: H05K3/0029 ,  H01L23/49827 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/115 ,  H05K3/42 ,  H05K2201/09509 ,  H05K2201/09563 ,  H05K2201/09827 ,  H05K2201/09836 ,  H05K2201/09854 ,  H05K2201/10378 ,  H05K2203/025 ,  Y10T29/49165 ,  H01L2924/00

Abstract: PROBLEM TO BE SOLVED: To provide a through wiring board where through wiring which does not have a void causing a defect in a conductor filling a through hole is arranged, and a method of manufacturing the through wiring board that suppresses formation of the void when the through hole or a non-through hole is filled with the conductor. SOLUTION: The through wiring board 10 includes the through wiring 6 formed by arranging the through hole 4 connecting one principal surface 2 and the other principal surface 3 constituting a flat plate type substrate 1 and filling the through hole 4 with the conductor 5, and is characterized in that the through hole 4 is in a trapezoidal shape including inner side faces of the through hole 4 as lateral sides 4p and 4q when viewed in a longitudinal plane of the substrate 1, and the two lateral sides 4p and 4q of the trapezoid are not parallel with each other, and inclined to the same size to two perpendiculars T 1 and T 2 drawn from two vertexes forming the upper side or the lower side of the trapezoid to a straight line containing opposite sides. COPYRIGHT: (C)2011,JPO&INPIT

Abstract translation: 要解决的问题：提供一种通过布线基板，其中布置有不导致填充通孔的导体缺陷的空隙的布线，以及制造通孔布线板的方法， 当通孔或非通孔填充导体时，空隙。 解决方案：贯通布线板10包括通过布置连接一个主表面2的通孔4和构成平板型基板1的另一个主表面3并且将通孔4与导体5填充而形成的贯通布线6 其特征在于，当从基板1的纵向平面观察时，通孔4为包括作为侧面4p和4q的通孔4的内侧面的梯形形状，并且两个侧面4p和4q 梯形不彼此平行，并且从形成上侧或下侧的两个顶点绘制的两个垂直线T 1 和T 2 倾斜到相同的尺寸 梯形到包含相对侧的直线。 版权所有（C）2011，JPO＆INPIT

公开(公告)号：JP2013225687A

公开(公告)日：2013-10-31

申请号：JP2013127533

申请日：2013-06-18

Applicant: Fujikura Ltd ,  株式会社フジクラ

Inventor： YAMAMOTO SATOSHI ,  SUZUKI TAKANAO ,  MATSUYAMA MASAMI

IPC: H05K1/11 ,  H01L23/12 ,  H05K3/00 ,  H05K3/40 ,  H05K3/42

Abstract: PROBLEM TO BE SOLVED: To provide a through wiring board in which through wiring without void which becomes a defect, is disposed in a conductor filling the inside of a through hole, and a manufacturing method of the through wiring board with which generation of the void in filling the through hole or a non-through hole with the conductor can be suppressed.SOLUTION: A through hole 4 is disposed which connects one principal surface 2 and the other principal surface 3 constituting a plate-like board 1, and a through wiring board 10 comprises through wiring 6 which is configured by filling the through hole 4 with a conductor 5. The through wiring board 10 is characterized in that, when the through hole 4 is viewed on one longitudinal cross section of the board 1, the through hole 4 is formed in the shape of a trapezoid with inner side faces of the through hole 4 as sides 4p and 4q, the two sides 4p and 4q of the trapezoid are not parallel with each other, and the two sides 4p and 4q are inclined to the same side, respectively, with respect to two perpendiculars Tand Tdrawn to a straight line including a counter side from two apexes forming an upper bottom or a lower bottom of the trapezoid.

Abstract translation: 要解决的问题：提供一种通过布线基板，其中通过布线将无缺陷的布线变成缺陷，布置在填充通孔内部的导体中，以及通孔布线板的制造方法， 可以抑制在通孔或非贯通孔中填充导体。解决方案：设置连接一个主表面2和构成板状基板1的另一个主表面3的通孔4和通孔 板10包括通过布线6布置，布线6通过用导体5填充通孔4构成。贯通布线板10的特征在于，当在板1的一个纵向截面上观察通孔4时，通孔 4形成为梯形的形状，通孔4的内侧面为侧面4p，4q，梯形的两侧4p，4q彼此不平行，两侧面4p，4q为 分别相对于两个垂直线Tand Tdrawn分成相同的一侧，直到包括形成梯形的上部底部或下部底部的两个顶点的相对侧的直线。