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    METHOD AND APPARATUS FOR TESTING DEVICES USING SERIALLY CONTROLLED INTELLIGENT SWITCHES
    1.
    发明申请
    METHOD AND APPARATUS FOR TESTING DEVICES USING SERIALLY CONTROLLED INTELLIGENT SWITCHES 审中-公开
    使用连续控制的智能开关测试设备的方法和装置

    公开(公告)号：WO2009042731A1

    公开(公告)日：2009-04-02

    申请号：PCT/US2008/077586

    申请日：2008-09-25

    Applicant: FORMFACTOR, INC. ,  BERRY, Tommie, Edward ,  SPORCK, A., Nicholas

    Inventor： BERRY, Tommie, Edward ,  SPORCK, A., Nicholas

    IPC: G01R31/02

    CPC classification number: G01R1/07342 ,  G01R31/2889

    Abstract: Methods and apparatus for testing devices using serially controlled intelligent switches have been described. In some embodiments, a probe card assembly can be provided that includes a plurality of integrated circuits (ICs) serially coupled to form a chain, the chain coupled to at least one serial control line, the plurality of ICs including switches coupled to test probes, each of the switches being programmable responsive to a control signal on the at least one serial control line.

    Abstract translation: 已经描述了使用串行控制的智能开关来测试装置的方法和装置。 在一些实施例中，可以提供探针卡组件，其包括串联耦合以形成链的多个集成电路（IC），所述链耦合到至少一个串行控制线，所述多个IC包括耦合到测试探针的开关， 每个开关可响应于至少一个串行控制线上的控制信号来编程。

    PROBE CARD WITH COPLANAR DAUGHTER CARD
    2.
    发明申请
    PROBE CARD WITH COPLANAR DAUGHTER CARD 审中-公开
    带卡通卡卡的探头卡

    公开(公告)号：WO2002084307A1

    公开(公告)日：2002-10-24

    申请号：PCT/US2002/011331

    申请日：2002-04-09

    Applicant: FORMFACTOR, INC. ,  SPORCK, A., Nicholas ,  SHINDE, Makarand, S.

    Inventor： SPORCK, A., Nicholas ,  SHINDE, Makarand, S.

    IPC: G01R1/073

    CPC classification number: G01R1/07342

    Abstract: A probe card assembly includes a printed circuit board with tester contacts for making electrical connections to a semiconductor tester. The probe card assembly also includes a probe head assembly with probes for contacting a semiconductor device under test. One or more daughter cards (432) is mounted to the printed circuit board such that they are substantially coplanar with the printed circuit board. The daughter cards (432) may contain a circuit for processing test data, including test signals to be input into the semiconductor and/or response signals generated by the semiconductor device in response to the test signals.

    Abstract translation: 探针卡组件包括具有用于与半导体测试器电连接的测试器触点的印刷电路板。 探针卡组件还包括具有用于接触被测半导体器件的探针的探针头组件。 一个或多个子卡（432）安装到印刷电路板上，使得它们与印刷电路板基本共面。 子卡（432）可以包含用于处理测试数据的电路，包括要输入到半导体的测试信号和/或响应于测试信号由半导体器件产生的响应信号。

    METHOD AND APPARATUS FOR SWITCHING TESTER RESOURCES
    3.
    发明申请
    METHOD AND APPARATUS FOR SWITCHING TESTER RESOURCES 审中-公开
    用于切换测试资源的方法和装置

    公开(公告)号：WO2008028171A2

    公开(公告)日：2008-03-06

    申请号：PCT/US2007/077467

    申请日：2007-09-01

    Applicant: FORMFACTOR, INC. ,  SPORCK, A., Nicholas ,  HENSON, Roy, J.

    Inventor： SPORCK, A., Nicholas ,  HENSON, Roy, J.

    IPC: G01R31/02

    CPC classification number: G01R31/2889 ,  G01R1/07385

    Abstract: A contactor device comprising a plurality of probes disposed to contact ones of the electronic devices can be electrically connected to a source of test signals. A switch can be activated electrically connecting a connection to the source of test signals to a selected one of a first group of electrically connected ones of the probes disposed to contact a first set of a plurality of the electronic devices or a second group of electrically connected ones of the probes disposed to contact a second set of a plurality of the electronic devices.

    Abstract translation: 包括设置成接触电子装置的多个探针的接触器装置可电连接到测试信号源。 可以激活开关，将连接到测试信号源的连接电连接到被设置为接触多个电子设备的第一组的第一组电连接的探针中的选定的一个或第二组电连接 探针中的一个被设置为接触多个电子设备的第二组。

    SHARING RESOURCES IN A SYSTEM FOR TESTING SEMICONDUCTOR DEVICES
    5.
    发明申请
    SHARING RESOURCES IN A SYSTEM FOR TESTING SEMICONDUCTOR DEVICES 审中-公开
    用于测试半导体器件的系统中的共享资源

    公开(公告)号：WO2008070466A2

    公开(公告)日：2008-06-12

    申请号：PCT/US2007/085483

    申请日：2007-11-25

    Applicant: FORMFACTOR, INC. ,  CHRAFT, Matthew, E. ,  ELDRIDGE, Benjamin, N. ,  HENSON, Roy, J. ,  SPORCK, A., Nicholas

    Inventor： CHRAFT, Matthew, E. ,  ELDRIDGE, Benjamin, N. ,  HENSON, Roy, J. ,  SPORCK, A., Nicholas

    IPC: G01R31/02

    CPC classification number: G01R31/31926 ,  G01R31/318511

    Abstract: Probes in a plurality of DUT probe groups can be connected in parallel to a single tester channel. In one aspect, digital potentiometers can be used to effectively switch the tester channel from a probe in one DUT probe group to a probe in another DUT probe group. In another aspect, switches in parallel with a resistor can accomplish such switching. In yet another aspect, a chip select terminal on each DUT can be used to effectively connect and disconnect internal DUT circuitry to the tester channel. Multiple DUT probe groups so connected can be used to create different patterns of DUT probe groups for testing different patterns of DUTs and thus facilitate sharing tester channels.

    Abstract translation: 多个DUT探针组中的探针可以并联连接到单个测试仪通道。 在一个方面，数字电位器可用于有效地将测试仪通道从一个DUT探针组中的探头切换到另一个DUT探针组中的探针。 另一方面，与电阻并联的开关可以实现这种切换。 在另一方面，每个DUT上的芯片选择端可用于有效地连接和断开内部DUT电路到测试器通道。 如此连接的多个DUT探针组可用于创建不同的DUT探针组，以测试DUT的不同图案，从而便于共享测试仪通道。

    AC COUPLED PARAMETRIC TEST PROBE
    6.
    发明申请
    AC COUPLED PARAMETRIC TEST PROBE 审中-公开
    交流耦合参数测试探头

    公开(公告)号：WO2007146582A2

    公开(公告)日：2007-12-21

    申请号：PCT/US2007/069806

    申请日：2007-05-25

    Applicant: FORMFACTOR, INC. ,  MILLER, Charles, A. ,  SPORCK, A., Nicholas ,  ELDRIDGE, Benjamin, N.

    Inventor： MILLER, Charles, A. ,  SPORCK, A., Nicholas ,  ELDRIDGE, Benjamin, N.

    IPC: G01R31/02

    CPC classification number: G01R1/06711 ,  G01R1/06727 ,  G01R1/07 ,  G01R31/3025

    Abstract: A probe for contacting and testing ICs on a semiconductor device includes a dielectric insulating material tip. The dielectric tip does not contaminate the surface being probed unlike metal probe tips. A contact scrub is further not required with signals being capacitively or inductively coupled from the probe tip to the IC. Testing can be performed during early fabrication steps of the wafer without the need for applying a metalization layer to the wafer to form bond pads. Testing can be performed by inductively coupling an AC signal to the probe tip, with coupling enhanced by including a magnetic material in the dielectric probe tip. Using an AC test signal enables testing of ICs without requiring separate power and ground connections.

    Abstract translation: 用于在半导体器件上接触和测试IC的探针包括介电绝缘材料尖端。 与金属探针尖端不同，电介质尖端不会污染被探测的表面。 进一步不需要接触擦洗，信号从探头尖端到IC电容或电感耦合。 可以在晶片的早期制造步骤期间进行测试，而不需要将金属化层施加到晶片以形成接合焊盘。 可以通过将AC信号电感耦合到探针尖端来进行测试，通过在介电探针尖端中包括磁性材料来增强耦合。 使用AC测试信号可以测试IC，而不需要单独的电源和接地连接。

    AC COUPLED PARAMETRIC TEST PROBE
    8.
    发明公开
    AC COUPLED PARAMETRIC TEST PROBE 审中-公开
    AC电源耦合参变量PROBE

    公开(公告)号：EP2027477A2

    公开(公告)日：2009-02-25

    申请号：EP07811949.2

    申请日：2007-05-25

    Applicant: FormFactor, Inc.

    Inventor： MILLER, Charles, A. ,  SPORCK, A., Nicholas ,  ELDRIDGE, Benjamin, N.

    IPC: G01R31/02

    CPC classification number: G01R1/06711 ,  G01R1/06727 ,  G01R1/07 ,  G01R31/3025

    Abstract: A probe for contacting and testing ICs on a semiconductor device includes a dielectric insulating material tip. The dielectric tip does not contaminate the surface being probed unlike metal probe tips. A contact scrub is further not required with signals being capacitively or inductively coupled from the probe tip to the IC. Testing can be performed during early fabrication steps of the wafer without the need for applying a metalization layer to the wafer to form bond pads. Testing can be performed by inductively coupling an AC signal to the probe tip, with coupling enhanced by including a magnetic material in the dielectric probe tip. Using an AC test signal enables testing of ICs without requiring separate power and ground connections.

    METHOD AND APPARATUS FOR TESTING DEVICES USING SERIALLY CONTROLLED INTELLIGENT SWITCHES
    10.
    发明公开
    METHOD AND APPARATUS FOR TESTING DEVICES USING SERIALLY CONTROLLED INTELLIGENT SWITCHES 审中-公开
    方法和装置考试的安排采用串行控制的智能交换机

    公开(公告)号：EP2198315A1

    公开(公告)日：2010-06-23

    申请号：EP08832821.6

    申请日：2008-09-25

    Applicant: FormFactor, Inc.

    Inventor： BERRY, Tommie, Edward ,  SPORCK, A., Nicholas

    IPC: G01R31/02

    CPC classification number: G01R1/07342 ,  G01R31/2889

    Abstract: Methods and apparatus for testing devices using serially controlled intelligent switches have been described. In some embodiments, a probe card assembly can be provided that includes a plurality of integrated circuits (ICs) serially coupled to form a chain, the chain coupled to at least one serial control line, the plurality of ICs including switches coupled to test probes, each of the switches being programmable responsive to a control signal on the at least one serial control line.

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