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    HIGH PERFORMACE PROBE SYSTEM
    1.
    发明申请
    HIGH PERFORMACE PROBE SYSTEM 审中-公开
    高性能探测系统

    公开(公告)号：WO2003100446A2

    公开(公告)日：2003-12-04

    申请号：PCT/US2003/014490

    申请日：2003-05-07

    Applicant: FORMFACTOR, INC.

    Inventor： CHRAFT, Matthew, E. ,  HENSON, Roy, J. ,  MILLER, Charles, A. ,  TSENG, Chih-Chiang

    IPC: G01R1/073

    CPC classification number: G01R1/07314 ,  G01R3/00

    Abstract: A probe system for providing signal paths between an integrated circuit (IC) tester and input/output, power and ground pads on the surfaces of ICs to be tested includes a probe board assembly, a flex cable and a set of probes arranged to contact the IC's I/O pads. The probe board assembly includes one or more rigid substrate layers with traces and vias formed on or within the substrate layers providing relatively low bandwidth signal paths linking the tester to probes accessing some of the IC's pads. The flex cable provides relatively high bandwidth signal paths linking the tester to probes accessing others of the IC's pads. A flex strip may alternatively be disposed behind a substrate with probes.

    Abstract translation: 用于在集成电路（IC）测试器和要测试的IC的表面上的输入/输出，电源和接地焊盘之间提供信号路径的探针系统包括探针板组件，柔性电缆和一组探针， IC的I / O焊盘。 探针板组件包括一个或多个刚性衬底层，其具有形成在衬底层上或衬底层内的迹线和通孔，其提供将测试器连接到访问IC的一些衬垫的探针的相对低带宽的信号路径。 柔性电缆提供相对高带宽的信号路径，将测试仪连接到访问IC其他焊盘的探针。 柔性带可替代地设置在具有探针的基底之后。

    HIGH PERFORMANCE PROBE SYSTEM FOR TESTING SEMICONDUCTOR WAFERS
    2.
    发明申请
    HIGH PERFORMANCE PROBE SYSTEM FOR TESTING SEMICONDUCTOR WAFERS 审中-公开

    公开(公告)号：WO2003100446A3

    公开(公告)日：2003-12-04

    申请号：PCT/US2003/014490

    申请日：2003-05-07

    Applicant: FORMFACTOR, INC.

    Inventor： CHRAFT, Matthew, E. ,  HENSON, Roy, J. ,  MILLER, Charles, A. ,  TSENG, Chih-Chiang

    IPC: G01R1/073

    Abstract: A probe system for providing signal paths between an integrated circuit (IC) tester (52) and input/output, power and ground pads (54) on the surfaces of ICs (56) to be tested includes a probe board assembly (50), a flex cable (86) and a set of probes (80) arranged to contact the IC's I/O pads (54). The probe board assembly (50) includes one or more rigid substrate layers (60, 62, 64) with traces and vias formed on or within the substrate layers providing relatively low bandwidth signal paths linking the tester (52) to probes (80) accessing some of the IC's pads (54). The flex cable (86) provides relatively high bandwidth signal paths linking the tester (52) to probes (80) accessing others of the IC's pads (54). A flex strip may alternatively be disposed behind a substrate with probes.

    HIGH PEFORMANCE PROBE SYSTEM FOR TESTING SEMICONDUCTOR WAFERS
    6.
    发明公开
    HIGH PEFORMANCE PROBE SYSTEM FOR TESTING SEMICONDUCTOR WAFERS 审中-公开
    高性能探针测量系统的半导体晶圆

    公开(公告)号：EP1506414A2

    公开(公告)日：2005-02-16

    申请号：EP03736564.0

    申请日：2003-05-07

    Applicant: FORMFACTOR, INC.

    Inventor： CHRAFT, Matthew, E. ,  HENSON, Roy, J. ,  MILLER, Charles, A. ,  TSENG, Chih-Chiang

    IPC: G01R1/073 ,  G01R31/316

    CPC classification number: G01R1/07314 ,  G01R3/00

    Abstract: A probe system for providing signal paths between an integrated circuit (IC) tester (52) and input/output, power and ground pads (54) on the surfaces of ICs (56) to be tested includes a probe board assembly (50), a flex cable (86) and a set of probes (80) arranged to contact the IC's I/O pads (54). The probe board assembly (50) includes one or more rigid substrate layers (60, 62, 64) with traces and vias formed on or within the substrate layers providing relatively low bandwidth signal paths linking the tester (52) to probes (80) accessing some of the IC's pads (54). The flex cable (86) provides relatively high bandwidth signal paths linking the tester (52) to probes (80) accessing others of the IC's pads (54). A flex strip may alternatively be disposed behind a substrate with probes.

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