Abstract:
Apparatus, system, and method for reducing contamination of semiconductor device wafers in immersion lithography fabrication. A preferred embodiment comprises a support ring to provide structural integrity to the apparatus and a planar ring formed on one side of the support ring. The planar ring has a plurality of openings formed through the planar ring. The apparatus is placed into a trench of a wafer stage and the openings permit excess immersion fluid to pass through, into the trench, where it can be removed. However, the apparatus prevents the excess immersion fluid and contaminants from within the trench from being drawn back onto the wafer stage by the motion of the wafer stage, potentially contaminating a semiconductor wafer.
Abstract:
From a plurality of overlay targets formed with patterns on a test wafer, subsets are formed and for each overlay target contained in the subsets, the measurement results of overlay shifts are obtained. Mean shifts, residual data and ranges are calculated for each subset and compared with the 100% full field results. The subset that represents the full field results to highest agreement is selected and used to measure the overlay of a second or any further wafer. A most preferred embodiment relates to selecting each of the subsets in a form such that the overlay target positions are concentric about the wafer center. In a further advantageous aspect, each of the subsets is confined to concentric areas about the wafer center, e.g., an inner circle and/or one or more outer rings. A distribution of selected overlay targets placed in representative regions on the wafer is thus guaranteed.
Abstract:
A band pass filter includes a first electrode, a second electrode, and a plasma generated by the first and second electrode. The plasma is confined to a region of space through which electromagnetic waves having a frequency above an intrinsic plasma frequency are transmitted, and electromagnetic waves having a frequency below the intrinsic plasma frequency are reflected. The band pass filter may be implemented in a photo lithography tool between a source module and an exposure module. The plasma of the band pass filter may be adapted to reduce IR radiation (or other out of band radiation) exposure to the exposure module by reflecting IR radiation back to the radiation source. In an extreme ultraviolet photo lithography tool, the plasma of the band pass filter may be adapted to transmit EUV radiation.
Abstract:
Lithography systems and methods are disclosed. A preferred embodiment comprises a lithography system including a support for a substrate, a projection lens system, an illuminator adapted to direct light towards the support for the substrate through the projection lens system along an optical path, and at least one Fresnel element disposed in the optical path.
Abstract:
From a plurality of overlay targets formed with patterns on a test wafer, subsets are formed and for each overlay target contained in the subsets, the measurement results of overlay shifts are obtained. Mean shifts, residual data and ranges are calculated for each subset and compared with the 100% full field results. The subset that represents the full field results to highest agreement is selected and used to measure the overlay of a second or any further wafer. A most preferred embodiment relates to selecting each of the subsets in a form such that the overlay target positions are concentric about the wafer center. In a further advantageous aspect, each of the subsets is confined to concentric areas about the wafer center, e.g., an inner circle and/or one or more outer rings. A distribution of selected overlay targets placed in representative regions on the wafer is thus guaranteed.
Abstract:
Fluids for use in immersion lithography systems are disclosed. A resistivity-altering substance is introduced into a fluid, making it more conductive. The fluid is then disposed between an immersion head of a projection lens system and a semiconductor wafer during an exposure process. Because the fluid is conductive, electrostatic energy that may develop during the movement of the semiconductor wafer with respect to the projection lens system during the exposure process is discharged through the conductive fluid, preventing damage to an immersion head of the projection lens system, the semiconductor wafer, and sensors of a stage that supports the semiconductor wafer.
Abstract:
A closing disk for an immersion head of an immersion lithography system is disclosed. The closing disk makes contact with the immersion head at the edges of the closing disk, but not the center, preventing damage to the bottom surface of the immersion head and also to the closing disk. The closing disk may be transparent or opaque, and may be aligned to the immersion head using optical or mechanical alignment.
Abstract:
A pattern can be projected on a resist film layer deposited on a semiconductor surface. The pattern can include structural elements having different feature sizes. Structural elements having feature sizes below a certain limit are not resolved on the resist film layer. The dimension of the corresponding resist pattern can be reduced and the difference can be related to focus parameters of the exposure tool.
Abstract:
A band pass filter includes a first electrode, a second electrode, and a plasma generated by the first and second electrode. The plasma is confined to a region of space through which electromagnetic waves having a frequency above an intrinsic plasma frequency are transmitted, and electromagnetic waves having a frequency below the intrinsic plasma frequency are reflected. The band pass filter may be implemented in a photo lithography tool between a source module and an exposure module. The plasma of the band pass filter may be adapted to reduce IR radiation (or other out of band radiation) exposure to the exposure module by reflecting IR radiation back to the radiation source. In an extreme ultraviolet photo lithography tool, the plasma of the band pass filter may be adapted to transmit EUV radiation.
Abstract:
Fluids for use in immersion lithography systems are disclosed. A resistivity-altering substance is introduced into a fluid, making it more conductive. The fluid is then disposed between an immersion head of a projection lens system and a semiconductor wafer during an exposure process. Because the fluid is conductive, electrostatic energy that may develop during the movement of the semiconductor wafer with respect to the projection lens system during the exposure process is discharged through the conductive fluid, preventing damage to an immersion head of the projection lens system, the semiconductor wafer, and sensors of a stage that supports the semiconductor wafer.