公开(公告)号：EP1528593B1

公开(公告)日：2009-07-22

申请号：EP02758823.5

申请日：2002-08-09

Applicant: Fujitsu Microelectronics Limited

Inventor： AIBA, Kazuyuki ,  TAKASHIMA, Akira ,  OZAWA, Kaname ,  HIRAOKA, Tetsuya ,  SUZUKI, Takaaki ,  MATSUZAKI, Yasurou

IPC: H01L21/60

CPC classification number: H01L29/0657 ,  H01L23/3128 ,  H01L23/4334 ,  H01L24/81 ,  H01L25/065 ,  H01L25/0652 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/13144 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/81801 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06555 ,  H01L2225/06582 ,  H01L2924/01079 ,  H01L2924/12044 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/3511

Abstract: A semiconductor chip is secured in a state deformed into a substantially cylinder shape by a coating material formed on its surface. The deformed semiconductor chip is flip-chip connected to an interposer and sealed with sealing resin onto the interposer. Solder balls are provided, as external terminals, on the other side of the interposer.

Abstract translation: 通过形成在其表面上的涂层材料将半导体芯片固定在变形为大致圆柱形状的状态中。 将变形的半导体芯片倒装连接到插入器并用密封树脂密封到插入器上。 在插入器的另一侧上提供焊球作为外部端子。