公开(公告)号：JP2000263693A

公开(公告)日：2000-09-26

申请号：JP2000020918

申请日：2000-01-28

Applicant: GA TEK INC

Inventor： MERCHANT HARISH D ,  POUTASSE CHARLES A ,  LEE CHIN-HO

IPC: H05K1/03 ,  B32B15/08 ,  C23C28/00 ,  H05K1/00 ,  H05K3/38

Abstract: PROBLEM TO BE SOLVED: To obtain a flexible circuit having resistance against both of high cycle-low strain fatigue and low cycle-high strain fatigue. SOLUTION: In a flexible laminate including a first flexible polymer film, a copper layer having a fine crack preventing layer on at least the single surface thereof and a second flexible polymer film, the fine crack preventing layer is sufficient to prevent a fine crack for at least 50,000,000 bending cycles in the copper layer with a thickness of up to about 18 μm of the flexible laminate and/or for at least 20,000,000 bending cycles in the copper layer with a thickness of up to about 35 μm.

公开(公告)号：JP2001030428A

公开(公告)日：2001-02-06

申请号：JP2000142378

申请日：2000-05-15

Applicant: GA TEK INC

Inventor： POUTASSE CHARLES A ,  LUTHY RICHARD L

IPC: C08J5/24 ,  B32B7/10 ,  B32B9/00 ,  B32B15/08 ,  B32B15/088 ,  B32B27/00 ,  B32B27/04 ,  C08J5/12 ,  C08L79/08 ,  C09J5/02 ,  C09J183/00 ,  C09J183/02 ,  C09J183/04 ,  H05K1/03 ,  H05K3/38 ,  H05K3/46

Abstract: PROBLEM TO BE SOLVED: To provide a multilayered structure having an adhesion promoting layer capable of effectively bonding a prepreg resin and a conductive foil and showing high temp. stability and high peel strength. SOLUTION: A multilayered structure has a prepreg layer formed from a resin capable of being cured by a curing mechanism of a carbon-carbon double bond and an adhesion promoting layer containing silane represented by formula (Y-R)aSi(X)4-a, wherein a is 1 or 2, X is a hydrolyzable group, R is a hydrocarbon group, Y is a functional group selected from the group consisting of a heterocyclic ring, acryloxy, amide and a carbon-carbon double bond-containing group and X and Y are not an epoxy-containing group.

公开(公告)号：JP2000226534A

公开(公告)日：2000-08-15

申请号：JP33870699

申请日：1999-11-29

Applicant: GA TEK INC

Inventor： POUTASSE CHARLES A ,  CENTANNI MICHAEL A

IPC: C09D1/00 ,  C09D183/00 ,  H05K3/02 ,  H05K3/38

Abstract: PROBLEM TO BE SOLVED: To increase the resin dust resistance of a metal foil by bringing the metal foil into contact with an inert silane, a titanate or a zirconate compound and forming a resin dust-resistant film on the surface of the metal foil. SOLUTION: This coating is obtained by bringing a metal foil into contact with an inert silane, a titanate [preferably di(cumyl)phenyloxoethylene titanate, etc.], or a zirconate compound [preferably neopentyl(diallyl)oxy, etc.], and forming a resin dust-resistant film having 0.001-1 μm thickness on the surface of the metal foil. Thereby, the resin dust resistance of the metal foil is increased. The metal foil preferably has a matte surface and a glossy surface and the resin dust-resistant film is preferably formed on the matte surface and the glossy surface. The inert silane preferably contains at least one hydrocarbylsilane or at least one fluorocarbonsilane and methyltrimethoxysilane, etc., are preferred.

公开(公告)号：EP1218178A4

公开(公告)日：2003-01-08

申请号：EP99951482

申请日：1999-09-16

Applicant: GA TEK INC

Inventor： POUTASSE CHARLES A

IPC: C08J5/24 ,  B32B15/08 ,  B32B15/092 ,  B32B27/04 ,  B32B27/12 ,  B32B27/38 ,  C08G59/40 ,  C09J183/00 ,  C09J183/08 ,  H05K1/03 ,  H05K3/46

Abstract: The present invention relates to an adhesion promoting layer which exhibits high temperature stability and high peel strengths when used in a multi-layer structure for a printed circuit board. More specifically, the present invention relates to a multi-layer structure, containing a prepreg layer wherein the prepreg layer is made from an epoxy resin and a non-amine curing agent; and an adhesion promoting layer comprising a nitrogen containing silane compound. The present invention also relates to a multi-layer structure containing a metal foil layer; an epoxy prepreg layer wherein the epoxy prepreg layer is made from an epoxy resin and a non-amine curing agent comprising at least one of an acid, an anhydride, an alkoxyide, a phenoxide, a polymeric thiol and a phenol; and an adhesion promoting layer comprising a nitrogen containing silane compound, wherein the adhesion promoting layer is between the metal foil layer and the epoxy prepreg layer.

公开(公告)号：EP1166353A4

公开(公告)日：2003-06-04

申请号：EP99964034

申请日：1999-12-01

Applicant: GA TEK INC

Inventor： BERGSTRESSER TAD ,  POUTASSE CHARLES A

IPC: B32B15/08 ,  B32B15/088 ,  H05K1/03 ,  H05K3/18 ,  H05K3/24 ,  H05K3/38 ,  H05K3/46 ,  H01L23/053 ,  H01L23/10 ,  H01L23/12 ,  H01L23/34

CPC classification number: H05K3/4655 ,  H01L2924/0002 ,  H05K3/181 ,  H05K3/386 ,  H05K3/387 ,  H05K3/388 ,  H05K3/4652 ,  H05K2201/0195 ,  H05K2201/0344 ,  Y10T428/12542 ,  Y10T428/12556 ,  Y10T428/1291 ,  Y10T428/12917 ,  Y10T428/24917 ,  Y10T428/28 ,  Y10T428/31681 ,  H01L2924/00

Abstract: A laminate for use as a surface laminate in a multi-layer printed circuit board. The laminate is comprised of a film substrate (12) formed of a first polymeric material. At least one layer of a flash material (14) is applied to a first side of the film substrate. At least one layer of copper (16) is disposed on the layer of flash material. An adhesive layer (18) formed of a second polymer material has a first surface that is attached to a second side of the film substrate.

公开(公告)号：DE69625554T2

公开(公告)日：2003-11-20

申请号：DE69625554

申请日：1996-07-22

Applicant: GA TEK INC

Inventor： POUTASSE CHARLES A ,  LUTHY RICHARD L

IPC: C08J5/24 ,  B32B7/10 ,  B32B9/00 ,  B32B15/08 ,  B32B15/088 ,  B32B27/00 ,  B32B27/04 ,  C08J5/12 ,  C08L79/08 ,  C09J5/02 ,  C09J183/00 ,  C09J183/02 ,  C09J183/04 ,  H05K1/03 ,  H05K3/38 ,  H05K3/46

Abstract: The present invention relates to an adhesion promoting layer which exhibits high temperature stability and high peel strengths when used in a multi-layer structure for a printed circuit board. More specifically, the present invention relates to an adhesion promoting layer for a multi-layer structure containing a first silane of the formula (Y-R)a Si(X)4-a wherein a is 1 or 2, X is a hydrolyzable group, R is a hydrocarbon group and Y is a functional group selected from the group consisting of heterocyclic, acryloxy, amide and a carbon carbon double bond containing group, with the proviso that X and Y are not epoxy-containing groups and a second silane of the formula (GR)bSi(K)4-b wherein b is 0, 1 or 2, K is individually an alkoxy, alkyl or halogen group, R is a hydrocarbon group and G is a functional group selected from an epoxy group and a glycidoxy group. The present invention also relates to a multi-layer structure containing a prepreg layer wherein the prepreg is made from a resin curable via a carbon carbon double bond curing process; and an adhesion promoting layer comprising a first silane and a second silane, the first silane represented by the formula (Y-R)a Si(X)4-a wherein a is 1 or 2, X is a hydrolyzable group, R is a hydrocarbon group and Y is a functional group selected from the group consisting of heterocyclic, acryloxy, amide and a carbon carbon double bond containing group, with the proviso that X and Y are not epoxy-containing groups and the second silane represented by the formula (GR)bSi(K)4-b wherein b is 0, 1 or 2, K is individually an alkoxy, alkyl or halogen group, R is a hydrocarbon group and G is a functional group selected from an epoxy group and a glycidoxy group.

公开(公告)号：CA2360323A1

公开(公告)日：2000-09-21

申请号：CA2360323

申请日：1999-12-01

Applicant: GA TEK INC

Inventor： BERGSTRESSER TAD ,  POUTASSE CHARLES A

IPC: B32B15/08 ,  B32B15/088 ,  H05K1/03 ,  H05K3/18 ,  H05K3/24 ,  H05K3/38 ,  H05K3/46 ,  H05K1/02

Abstract: A laminate for use as a surface laminate in a multi-layer printed circuit board. The laminate is comprised of a film substrate (12) formed of a first polymeric material. At least one layer of a flash material (14) is applied t o a first side of the film substrate. At least one layer of copper (16) is disposed on the layer of flash material. An adhesive layer (18) formed of a second polymer material has a first surface that is attached to a second sid e of the film substrate.

公开(公告)号：CA2286969A1

公开(公告)日：2000-06-14

申请号：CA2286969

申请日：1999-10-20

Applicant: GA TEK INC

Inventor： CENTANNI MICHAEL A ,  POUTASSE CHARLES A

IPC: C09D1/00 ,  C09D183/00 ,  H05K3/02 ,  H05K3/38 ,  C09D163/00 ,  C09D167/02 ,  C09D179/08 ,  B32B15/20

Abstract: In one embodiment, the present invention relates to a method of increasing resin dust resistance of metal foil comprising contacting the metal foil with an inert silane, titanate or zirconate compound to form a resin dust resistant film having a thickness from about 0.001 microns to about 1 micron on a surface of the metal foil. In another embodiment, the present invention relates to a method of treating metal foil comprising contacting a first side of the metal foil with a hydrocarbylsilane solution to form a resin dust resistant film on a surface of the metal foil, the hydrocarbylsilane solution comprising from about 0.01 % to about 10% v/v of a hydrocarbylsilane; and laminating a second side of the metal foil to a prepreg.

公开(公告)号：IN188605B

公开(公告)日：2002-10-19

申请号：IN987CA1996

申请日：1996-05-30

Applicant: GA TEK INC

Inventor： POUTASSE CHARLES A ,  LUTHY RICHARD L

IPC: C08J5/24 ,  B32B7/10 ,  B32B9/00 ,  B32B15/08 ,  B32B15/088 ,  B32B27/00 ,  B32B27/04 ,  C08J5/12 ,  C08L79/08 ,  C09J5/02 ,  C09J183/00 ,  C09J183/02 ,  C09J183/04 ,  H05K1/03 ,  H05K3/38 ,  H05K3/46

Abstract: The present invention relates to an adhesion promoting layer which exhibits high temperature stability and high peel strengths when used in a multi-layer structure for a printed circuit board. More specifically, the present invention relates to an adhesion promoting layer for a multi-layer structure containing a first silane of the formula (Y-R)a Si(X)4-a wherein a is 1 or 2, X is a hydrolyzable group, R is a hydrocarbon group and Y is a functional group selected from the group consisting of heterocyclic, acryloxy, amide and a carbon carbon double bond containing group, with the proviso that X and Y are not epoxy-containing groups and a second silane of the formula (GR)bSi(K)4-b wherein b is 0, 1 or 2, K is individually an alkoxy, alkyl or halogen group, R is a hydrocarbon group and G is a functional group selected from an epoxy group and a glycidoxy group. The present invention also relates to a multi-layer structure containing a prepreg layer wherein the prepreg is made from a resin curable via a carbon carbon double bond curing process; and an adhesion promoting layer comprising a first silane and a second silane, the first silane represented by the formula (Y-R)a Si(X)4-a wherein a is 1 or 2, X is a hydrolyzable group, R is a hydrocarbon group and Y is a functional group selected from the group consisting of heterocyclic, acryloxy, amide and a carbon carbon double bond containing group, with the proviso that X and Y are not epoxy-containing groups and the second silane represented by the formula (GR)bSi(K)4-b wherein b is 0, 1 or 2, K is individually an alkoxy, alkyl or halogen group, R is a hydrocarbon group and G is a functional group selected from an epoxy group and a glycidoxy group.

公开(公告)号：CA2376697A1

公开(公告)日：2001-03-22

申请号：CA2376697

申请日：1999-09-16

Applicant: GA TEK INC

Inventor： POUTASSE CHARLES A

IPC: C08J5/24 ,  B32B15/08 ,  B32B15/092 ,  B32B27/04 ,  B32B27/12 ,  B32B27/38 ,  C08G59/40 ,  C09J183/00 ,  C09J183/08 ,  H05K1/03 ,  H05K3/46

Abstract: The present invention relates to an adhesion promoting layer which exhibits high temperature stability and high peel strengths when used in a multi-laye r structure for a printed circuit board. More specifically, the present invention relates to a multi-layer structure, containing a prepreg layer wherein the prepreg layer is made from an epoxy resin and a non-amine curing agent; and an adhesion promoting layer comprising a nitrogen containing sila ne compound. The present invention also relates to a multi-layer structure containing a metal foil layer; an epoxy prepreg layer wherein the epoxy prepreg layer is made from an epoxy resin and a non-amine curing agent comprising at least one of an acid, an anhydride, an alkoxyide, a phenoxide, a polymeric thiol and a phenol; and an adhesion promoting layer comprising a nitrogen containing silane compound, wherein the adhesion promoting layer is between the metal foil layer and the epoxy prepreg layer.