Abstract:
A method for manufacturing an electron multiplier or microchannel plate (10) comprises the steps of forming a body (12) of etchable material, directionally applying a flux of reactive particles against the body in selected areas for removing material therefrom in order to form at least one electron multiplication channel (14) in the body.
Abstract:
The invention is directed to continuous dynodes formed by thin film processing techniques. According to one embodiment of the invention, a continuous dynode is disclosed in which at least one layer is formed by reacting a vapour in the presence of a substrate at a temperature and pressure sufficient to result in chemical vapour deposition kinetics dominated by interfacial processes between the vapour and the substrate. In another embodiment the surface of a bulk semiconductor or substrate is subjected to a reactive atmosphere at a temperature and pressure sufficient to result in a reaction modifying the surface of the substrate. In yet another embodiment a continuous dynode is formed by liquid phase deposition of a dynode material into the substrate from a supersaturated solution. The resulting devices exhibit conductive and emissive properties suitable for electron multiplication in CEM, MCP and MEM applications.
Abstract:
The invention is directed to continuous dynodes formed by thin film processing techniques. According to one embodiment of the invention, a continuous dynode is disclosed in which at least one layer is formed by reacting a vapour in the presence of a substrate at a temperature and pressure sufficient to result in chemical vapour deposition kinetics dominated by interfacial processes between the vapour and the substrate. In another embodiment the surface of a bulk semiconductor or substrate is subjected to a reactive atmosphere at a temperature and pressure sufficient to result in a reaction modifying the surface of the substrate. In yet another embodiment a continuous dynode is formed by liquid phase deposition of a dynode material into the substrate from a supersaturated solution. The resulting devices exhibit conductive and emissive properties suitable for electron multiplication in CEM, MCP and MEM applications.
Abstract:
A method for manufacturing an electron multiplier or microchannel plate (10) comprises the steps of forming a body (12) of etchable material, directionally applying a flux of reactive particles against the body in selected areas for removing material therefrom in order to form at least one electron multiplication channel (14) in the body.