公开(公告)号：US20160183377A1

公开(公告)日：2016-06-23

申请号：US14903770

申请日：2014-06-19

Applicant: GEMALTO SA

Inventor： Stéphane OTTOBON ,  Lucile DOSSETTO ,  Line DEGEILH

IPC: H05K1/18 ,  H05K3/40 ,  H05K3/32 ,  H05K1/11

CPC classification number: H05K1/181 ,  G06K19/07747 ,  H01L21/4821 ,  H01L23/495 ,  H01L23/49541 ,  H01L23/49579 ,  H01L23/49866 ,  H01L33/62 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48228 ,  H01L2224/49171 ,  H01L2924/181 ,  H05K1/032 ,  H05K1/0393 ,  H05K1/112 ,  H05K1/189 ,  H05K3/32 ,  H05K3/4007 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/00

Abstract: The invention relates to an electronic module comprising a first metal layer including at least one contact pad or a conductive pad for connection or interconnection, an insulating layer that is electrically connected to the metal layer via a first surface, a second metal layer connected to the insulating layer on the opposite surface thereof, a chip location or an electronic chip electrically connected to the at least one contact pad through openings in the insulating layer, characterized in that the insulating layer is an adhesive.

Abstract translation: 本发明涉及一种包括第一金属层的电子模块，该第一金属层包括用于连接或互连的至少一个接触焊盘或导电焊盘，经由第一表面与金属层电连接的绝缘层，连接到第二金属层的第二金属层 绝缘层，芯片位置或通过绝缘层中的开口与至少一个接触焊盘电连接的电子芯片，其特征在于绝缘层是粘合剂。