公开(公告)号：US20170372186A1

公开(公告)日：2017-12-28

申请号：US15531159

申请日：2016-02-09

Applicant: GEMALTO SA

Inventor： Stéphane OTTOBON ,  Lucile DOSSETTO ,  Luc CHARLES ,  Thierry LAVIRON

IPC: G06K19/077

CPC classification number: G06K19/07754 ,  G06K19/07747 ,  G06K19/07769 ,  H01L2224/48228 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/8592

Abstract: The invention relates to a method for producing a module having an electronic chip including metallisations which are accessible from a first side of the metallisations and an integrated circuit chip which is arranged on the second side of the metallisations, opposite the first side. The method comprises the step of forming electrical interconnection elements which are separate from the metallisations, directly connecting the chip, and are arranged on the second side of the metallisations. The invention also relates to a module corresponding to the method and to a device comprising said module.

公开(公告)号：US20170178991A1

公开(公告)日：2017-06-22

申请号：US15036641

申请日：2014-11-13

Applicant: GEMALTO SA

Inventor： Stéphane OTTOBON ,  Lucile DOSSETTO ,  Lauren AUDOUARD ,  Sébastien GUIJARRO

IPC: H01L23/31 ,  H01L23/00 ,  H01L21/56

CPC classification number: H01L23/3121 ,  H01L21/56 ,  H01L21/561 ,  H01L21/563 ,  H01L21/565 ,  H01L21/568 ,  H01L23/562 ,  H01L24/48 ,  H01L24/49 ,  H01L24/97 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/45099

Abstract: The invention relates to a method for producing an electronic device including at least one electronic component in a substrate body, said method including at least one step of transferring said electronic component to a surface of a removable dielectric substrate, of delivering a protective resin on said electronic component, and of transferring, onto the protective resin, a reinforcement disc having a main front surface with a peripheral contour, wherein the protective resin extends up to the peripheral contour of the disc in order to form, together with the disc, the peripheral side contours and the final layer of the substrate body of the device.

公开(公告)号：US20160183377A1

公开(公告)日：2016-06-23

申请号：US14903770

申请日：2014-06-19

Applicant: GEMALTO SA

Inventor： Stéphane OTTOBON ,  Lucile DOSSETTO ,  Line DEGEILH

IPC: H05K1/18 ,  H05K3/40 ,  H05K3/32 ,  H05K1/11

CPC classification number: H05K1/181 ,  G06K19/07747 ,  H01L21/4821 ,  H01L23/495 ,  H01L23/49541 ,  H01L23/49579 ,  H01L23/49866 ,  H01L33/62 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48228 ,  H01L2224/49171 ,  H01L2924/181 ,  H05K1/032 ,  H05K1/0393 ,  H05K1/112 ,  H05K1/189 ,  H05K3/32 ,  H05K3/4007 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/00

Abstract: The invention relates to an electronic module comprising a first metal layer including at least one contact pad or a conductive pad for connection or interconnection, an insulating layer that is electrically connected to the metal layer via a first surface, a second metal layer connected to the insulating layer on the opposite surface thereof, a chip location or an electronic chip electrically connected to the at least one contact pad through openings in the insulating layer, characterized in that the insulating layer is an adhesive.

Abstract translation: 本发明涉及一种包括第一金属层的电子模块，该第一金属层包括用于连接或互连的至少一个接触焊盘或导电焊盘，经由第一表面与金属层电连接的绝缘层，连接到第二金属层的第二金属层 绝缘层，芯片位置或通过绝缘层中的开口与至少一个接触焊盘电连接的电子芯片，其特征在于绝缘层是粘合剂。