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公开(公告)号：WO2004051327A3
公开(公告)日：2004-10-28
申请号：PCT/US0336683
申请日：2003-11-17
Applicant: GEN ELECTRIC
Inventor： KAPUSTA CHRISTOPHER , SHIH MIN-YI , GUIDA RENATO
CPC classification number: G02B6/42 , G02B6/4206 , G02B6/4214
Abstract: A method and system for increasing the coupling efficiency of optical interconnections between optical elements such as optical fibers, waveguides, and vertical cavity surface emitting lasers (VCSEL) in single mode or multimode.
Abstract translation: 一种用于增加单模或多模光学元件（例如光纤，波导和垂直腔表面发射激光器（VCSEL））之间的光学互连的耦合效率的方法和系统。
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公开(公告)号：EP3213100A4
公开(公告)日：2018-06-06
申请号：EP15854648
申请日：2015-10-27
Applicant: GEN ELECTRIC
Inventor： KAPUSTA CHRISTOPHER , AIMI MARCO
CPC classification number: C23C28/023 , B23K1/0016 , B23K35/0222 , B23K35/262 , B23K35/3013 , B23K2201/40 , B81C1/00269 , B81C2201/013 , B81C2203/0109 , B81C2203/019 , B81C2203/037 , C23C14/025 , C23C14/165 , C23C14/3414 , C23C14/58 , C23C28/021 , C23F1/00 , C23F4/00 , C25D3/50 , C25D7/123
Abstract: A non-magnetic lid for sealing a hermetic package. The lid includes a molybdenum substrate having a sputtered adhesion layer and a copper seed layer. The lid also includes a plated palladium solder base layer, and has a gold/tin solder preform attached to a sealing surface of the lid.
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公开(公告)号：SG11201703124XA
公开(公告)日：2017-05-30
申请号：SG11201703124X
申请日：2015-10-27
Applicant: GEN ELECTRIC
Inventor： KAPUSTA CHRISTOPHER , AIMI MARCO
Abstract: A non-magnetic lid for sealing a hermetic package. The lid includes a molybdenum substrate having a sputtered adhesion layer and a copper seed layer. The lid also includes a plated palladium solder base layer, and has a gold/tin solder preform attached to a sealing surface of the lid.
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Patent Agency Ranking
公开(公告)号：CA2965348A1
公开(公告)日：2016-05-06
申请号：CA2965348
申请日：2015-10-27
Applicant: GEN ELECTRIC
Inventor： KAPUSTA CHRISTOPHER , AIMI MARCO
Abstract: A non-magnetic lid for sealing a hermetic package. The lid includes a molybdenum substrate having a sputtered adhesion layer and a copper seed layer. The lid also includes a plated palladium solder base layer, and has gold/tin solder preforms attached to a sealing surface of the lid.
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公开(公告)号：AU2003291005A8
公开(公告)日：2004-06-23
申请号：AU2003291005
申请日：2003-11-17
Applicant: GEN ELECTRIC
Inventor： SHIH MIN-YI , KAPUSTA CHRISTOPHER , GUIDA RENATO
Abstract: A method and system for increasing the coupling efficiency of optical interconnections between optical elements such as optical fibers, waveguides, and vertical cavity surface emitting lasers (VCSEL) in single mode or multimode.
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公开(公告)号：CA2507270C
公开(公告)日：2013-02-12
申请号：CA2507270
申请日：2003-11-17
Applicant: GEN ELECTRIC
Inventor： KAPUSTA CHRISTOPHER , SHIH MIN-YI , GUIDA RENATO
Abstract: A method and system for increasing the coupling efficiency of optical interconnections between optical elements such as optical fibers, waveguides, and vertical cavity surface emitting lasers (VCSEL) in single mode or multimode.
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公开(公告)号：AU2003291005A1
公开(公告)日：2004-06-23
申请号：AU2003291005
申请日：2003-11-17
Applicant: GEN ELECTRIC
Inventor： KAPUSTA CHRISTOPHER , SHIH MIN-YI , GUIDA RENATO
Abstract: A method and system for increasing the coupling efficiency of optical interconnections between optical elements such as optical fibers, waveguides, and vertical cavity surface emitting lasers (VCSEL) in single mode or multimode.
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公开(公告)号：CA2507270A1
公开(公告)日：2004-06-17
申请号：CA2507270
申请日：2003-11-17
Applicant: GEN ELECTRIC
Inventor： GUIDA RENATO , KAPUSTA CHRISTOPHER , SHIH MIN-YI
Abstract: A method and system for increasing the coupling efficiency of optical interconnections between optical elements such as optical fibers, waveguides , and vertical cavity surface emitting lasers (VCSEL) in single mode or multimode.
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