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公开(公告)号:NL2008201C
公开(公告)日:2014-12-17
申请号:NL2008201
申请日:2012-01-31
Applicant: GEN ELECTRIC
Inventor: TKACZYK JOHN ERIC , ROSE JAMES WILSON , LOBASTOV VLADIMIR A , GORDON JEFFREY SEYMOUR
CPC classification number: G01T1/243 , G01T1/24 , G01T1/244 , G01T1/2928 , Y10T29/49826
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公开(公告)号:NL2008201C2
公开(公告)日:2014-12-17
申请号:NL2008201
申请日:2012-01-31
Applicant: GEN ELECTRIC
Inventor: TKACZYK JOHN ERIC , ROSE JAMES WILSON , LOBASTOV VLADIMIR A , GORDON JEFFREY SEYMOUR
Abstract: A detector module for an imaging system, such as a CT system, and a method for fabricating the same are presented. The detector module includes an array of direct conversion sensors, the direct conversion sensors having a first side and a second side. The first side of the direct conversion sensors includes a segmented electrode side forming an array of pixels that receive radiation and convert the received radiation into corresponding charge signals, whereas the second side includes a common electrode side. The detector module also includes a readout electronic circuitry coupled to one or more of the direct conversion sensors where the readout electronic circuitry is configured to be shielded from the radiation. In addition, the detector module includes a bias voltage circuitry coupled to the one or more direct conversion sensors on the second side.
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公开(公告)号:NL2009365C2
公开(公告)日:2014-10-07
申请号:NL2009365
申请日:2012-08-27
Applicant: GEN ELECTRIC
Inventor: LOBASTOV VLADIMIR A , DUROCHER KEVIN MATTHEW , TKACZYK JOHN ERIC , ROSE JAMES WILSON , MCCONNELEE PAUL ALAN
IPC: A61B6/00
Abstract: Interconnect structures suitable for use in connecting anode-illuminated detector modules to downstream circuitry are disclosed. In certain embodiments, the interconnect structures are based on or include low atomic number or polymeric features and/or are formed at a density or thickness so as to minimize or reduce radiation attenuation by the interconnect structures.
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公开(公告)号:NL2009365A
公开(公告)日:2013-03-04
申请号:NL2009365
申请日:2012-08-27
Applicant: GEN ELECTRIC
Inventor: LOBASTOV VLADIMIR A , DUROCHER KEVIN MATTHEW , TKACZYK JOHN ERIC , ROSE JAMES WILSON , MCCONNELEE PAUL ALAN
Abstract: Interconnect structures suitable for use in connecting anode-illuminated detector modules to downstream circuitry are disclosed. In certain embodiments, the interconnect structures are based on or include low atomic number or polymeric features and/or are formed at a density or thickness so as to minimize or reduce radiation attenuation by the interconnect structures.
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公开(公告)号:NL2009365C
公开(公告)日:2014-10-07
申请号:NL2009365
申请日:2012-08-27
Applicant: GEN ELECTRIC
Inventor: LOBASTOV VLADIMIR A , DUROCHER KEVIN MATTHEW , TKACZYK JOHN ERIC , ROSE JAMES WILSON , MCCONNELEE PAUL ALAN
IPC: A61B6/00
CPC classification number: H01L27/14676 , A61B6/037 , A61B6/4208 , H01L27/14618 , H01L27/14636 , H01L27/14659 , H01L27/14683 , H01L27/14696 , H01L2924/0002 , H01L2924/00
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6.
公开(公告)号:DE102012100774A1
公开(公告)日:2012-08-02
申请号:DE102012100774
申请日:2012-01-31
Applicant: GEN ELECTRIC
Inventor: TKACZYK JOHN ERIC , ROSE JAMES WILSON , LOBASTOV VLADIMIR A , GORDON JEFFREY SEYMOUR
IPC: G01T1/29
Abstract: Ein Detektormodul für ein Bildgebungssystem, wie beispielsweise ein CT-System, und ein Verfahren zum Herstellen desselben werden dargestellt. Das Detektormodul umfasst eine Anordnung von Direktumwandlungssensoren, wobei die Direktumwandlungssensoren eine erste Seite und eine zweite Seite aufweisen. Die erste Seite der Direktumwandlungssensoren umfasst eine segmentierte Elektrodenseite, die eine Anordnung von Pixeln bildet, die Strahlung empfangen und die empfangene Strahlung in entsprechende Ladungssignale umwandeln, während die zweite Seite eine gemeinsame Elektrodenseite umfasst. Das Detektormodul umfasst auch eine Ausleseelektronikschaltung, die mit einem oder mehreren der Direktumwandlungssensoren verbunden ist, wobei die Ausleseelektronikschaltung ausgebildet ist, um von der Strahlung abgeschirmt zu werden. Darüber hinaus umfasst das Detektormodul eine Vorspannungsschaltung, die mit dem einen oder den mehreren Direktumwandlungssensoren auf der zweiten Seite verbunden ist.
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公开(公告)号:NL2008201A
公开(公告)日:2012-08-01
申请号:NL2008201
申请日:2012-01-31
Applicant: GEN ELECTRIC
Inventor: TKACZYK JOHN ERIC , ROSE JAMES WILSON , LOBASTOV VLADIMIR A , GORDON JEFFREY SEYMOUR
Abstract: A detector module for an imaging system, such as a CT system, and a method for fabricating the same are presented. The detector module includes an array of direct conversion sensors, the direct conversion sensors having a first side and a second side. The first side of the direct conversion sensors includes a segmented electrode side forming an array of pixels that receive radiation and convert the received radiation into corresponding charge signals, whereas the second side includes a common electrode side. The detector module also includes a readout electronic circuitry coupled to one or more of the direct conversion sensors where the readout electronic circuitry is configured to be shielded from the radiation. In addition, the detector module includes a bias voltage circuitry coupled to the one or more direct conversion sensors on the second side.
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