公开(公告)号：WO2008156932A3

公开(公告)日：2010-02-25

申请号：PCT/US2008063618

申请日：2008-05-15

Applicant: GEN ELECTRIC ,  ARIK MEHMET ,  SEELEY CHARLES ERKLIN ,  UTTURKAR YOGEN VISHWAS ,  BURDICK WILLIAM EDWARD JR ,  GORAY KUNAL RAVINDRA ,  WEAVER STANTON EARL JR

Inventor： ARIK MEHMET ,  SEELEY CHARLES ERKLIN ,  UTTURKAR YOGEN VISHWAS ,  BURDICK WILLIAM EDWARD JR ,  GORAY KUNAL RAVINDRA ,  WEAVER STANTON EARL JR

IPC: H01L23/40 ,  H01L23/467

CPC classification number: H01L23/40 ,  G06F1/20 ,  H01L23/467 ,  H01L2924/0002 ,  Y10T29/49002 ,  Y10T29/4935 ,  Y10T29/5313 ,  H01L2924/00

Abstract: A mounting apparatus for a cooling device is disclosed. The mounting apparatus includes a plurality of connectors extending outwardly from the cooling device. The mounting apparatus also includes at least one mounting post coupled to the plurality of connectors and configured to mount the cooling device on a substrate.

Abstract translation: 公开了一种用于冷却装置的安装装置。 安装装置包括从冷却装置向外延伸的多个连接器。 安装设备还包括至少一个安装柱，其连接到多个连接器并被配置成将冷却装置安装在基板上。

公开(公告)号：WO2011162969A3

公开(公告)日：2012-08-30

申请号：PCT/US2011039757

申请日：2011-06-09

Applicant: GEN ELECTRIC ,  UTTURKAR YOGEN VISHWAS ,  WETZEL TODD ,  ARIK MEHMET ,  DE BOCK HENDRICK PIETER

Inventor： UTTURKAR YOGEN VISHWAS ,  WETZEL TODD ,  ARIK MEHMET ,  DE BOCK HENDRICK PIETER

IPC: F21V15/06 ,  F21V29/00

CPC classification number: F21S8/02 ,  F21V29/2212 ,  F21V29/63 ,  F21V29/677 ,  F21V29/717 ,  F21V29/773 ,  F21Y2105/10 ,  F21Y2115/10

Abstract: A heat transfer system is provided for a LED lamp. The LED lamp includes a board surface to supply heat energy during an operation of the LED lamp. The LED lamp is mounted within a recessed housing that separates a first area having a first temperature from a second area having a second temperature, where the second temperature is lower than the first temperature. The system includes a thermal dissipator positioned within the second area. The system further includes a heat transfer device with a first end mounted to the board surface, and a second end mounted to the thermal dissipator, to transfer the heat energy from the board surface in the first area to the thermal dissipator in the second area, and dissipate the heat energy within the second area.

Abstract translation: 为LED灯提供传热系统。 LED灯包括在LED灯的操作期间提供热能的板表面。 LED灯安装在凹入的壳体内，其将具有第一温度的第一区域与具有第二温度的第二区域分开，其中第二温度低于第一温度。 该系统包括位于第二区域内的散热器。 该系统还包括传热装置，其第一端安装到板表面，以及第二端安装到散热器，以将来自第一区域中的板表面的热能传递到第二区域中的散热器， 并消散第二区域内的热能。

公开(公告)号：CA3019393A1

公开(公告)日：2017-10-12

申请号：CA3019393

申请日：2017-04-06

Applicant: GEN ELECTRIC

Inventor： ZIA JALAL HUNAIN ,  UTTURKAR YOGEN VISHWAS ,  HAWES NATHANIEL BENEDICT

IPC: E21B43/12

Abstract: A self-cooling electric submersible pump having an integrated cooling system is provided. The cooling system is configured to cool and lubricate the electric motor section of the pump by expanding a compressed multi-component coolant fluid through flow channels within the motor. The coolant fluid contains a first fluid having a boiling point of at least 230°C and a second fluid having a boiling point of less than 150°C. During pump operation the first fluid acts as a largely incompressible liquid and the second fluid behaves as a compressible gas. A compressor compresses the second fluid in the presence of the first fluid to produce a hot compressed coolant fluid from which heat is transferred to a production fluid being processed by the pump. The compressed coolant fluid is expanded through an orifice and into the motor flow channels, returning thereafter to the compressor.

公开(公告)号：CA2697870A1

公开(公告)日：2010-10-09

申请号：CA2697870

申请日：2010-03-25

Applicant: GEN ELECTRIC

Inventor： ARIK MEHMET ,  ICOZ TUNC ,  DAVILA JUAN MANUEL RIVAS ,  SEELEY CHARLES ERKLIN ,  UTTURKAR YOGEN VISHWAS ,  WEAVER STANTON EARL JR

IPC: H05K7/20

Abstract: A heat sink (10) with distributed jet cooling is provided. The heat sink includes a base (12) for thermal connection to at least one heated object (20), an array of fins (14) thermally coupled to the base, and at least one multi-orifice synthetic jet (30) or multiple single orifice jets disposed on a side (15, 16) of the array of fins. A heat sink (100) with distributed and integrated jet cooling is also provided and includes a base (12) and an array of fins (114). Respective ones of at least a subset of the fins comprise a synthetic jet (102) configured to eject an ambient fluid into an ambient environment of the fins and base. Another heat sink (200) with distributed and integrated jet cooling is provided and includes a base (12), an array of fins (214) and multiple synthetic jets (202) coupled to respective ones of the fins. The synthetic jets are provided for at least a subset of the fins.

公开(公告)号：DE602007013933D1

公开(公告)日：2011-05-26

申请号：DE602007013933

申请日：2007-10-26

Applicant: GEN ELECTRIC

Inventor： ARIK MEHMET ,  WOLFE CHARLES FRANKLIN ,  UTTURKAR YOGEN VISHWAS ,  SEELEY CHARLES ERKLIN ,  SLATON DAVID SHANNON ,  LUECKENBACH WILLIAM HENRY

IPC: G06F1/20

公开(公告)号：AT505759T

公开(公告)日：2011-04-15

申请号：AT07844627

申请日：2007-10-26

Applicant: GEN ELECTRIC

Inventor： ARIK MEHMET ,  WOLFE CHARLES FRANKLIN ,  UTTURKAR YOGEN VISHWAS ,  SEELEY CHARLES ERKLIN ,  SLATON DAVID ,  LUECKENBACH WILLIAM HENRY

IPC: G06F1/20

Abstract: A thermal management system for an embedded environment is described. The thermal management system includes a pleumo-jet that has at least one wall defining a chamber, at least one piezoelectric device on the at least one wall, and a compliant material within the at least one wall and encompassing the chamber. The compliant material has at least one opening providing fluid communication between said chamber and the embedded environment. A cooling system is also described. A method for making a pleumo-jet is also described.