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    HEAT SINKS WITH DISTRIBUTED AND INTEGRATED JET COOLING
    3.
    发明专利
    HEAT SINKS WITH DISTRIBUTED AND INTEGRATED JET COOLING 未知

    公开(公告)号：CA2697870A1

    公开(公告)日：2010-10-09

    申请号：CA2697870

    申请日：2010-03-25

    Applicant: GEN ELECTRIC

    Inventor： ARIK MEHMET ,  ICOZ TUNC ,  DAVILA JUAN MANUEL RIVAS ,  SEELEY CHARLES ERKLIN ,  UTTURKAR YOGEN VISHWAS ,  WEAVER STANTON EARL JR

    IPC: H05K7/20

    Abstract: A heat sink (10) with distributed jet cooling is provided. The heat sink includes a base (12) for thermal connection to at least one heated object (20), an array of fins (14) thermally coupled to the base, and at least one multi-orifice synthetic jet (30) or multiple single orifice jets disposed on a side (15, 16) of the array of fins. A heat sink (100) with distributed and integrated jet cooling is also provided and includes a base (12) and an array of fins (114). Respective ones of at least a subset of the fins comprise a synthetic jet (102) configured to eject an ambient fluid into an ambient environment of the fins and base. Another heat sink (200) with distributed and integrated jet cooling is provided and includes a base (12), an array of fins (214) and multiple synthetic jets (202) coupled to respective ones of the fins. The synthetic jets are provided for at least a subset of the fins.

    Thermal management assembly for e.g. fuel cells, comprises heat sink including graphite layer (exhibiting thermal conductivity, which is anisotropic in nature) obtained by cleaving graphene layer from graphite sheet, and support layer
    5.
    发明专利
    Thermal management assembly for e.g. fuel cells, comprises heat sink including graphite layer (exhibiting thermal conductivity, which is anisotropic in nature) obtained by cleaving graphene layer from graphite sheet, and support layer 未知

    公开(公告)号：DE102006056816A1

    公开(公告)日：2007-10-04

    申请号：DE102006056816

    申请日：2006-12-01

    Applicant: GEN ELECTRIC

    Inventor： SAYIR HALUK ,  MEHMET ARIK ,  COOPER EVAN B ,  ICOZ TUNC ,  SCHAEPKENS MARC ,  LIU XIANG

    IPC: F28F21/00 ,  F28F13/18 ,  F28F21/02 ,  G06F1/20 ,  H01L23/36 ,  H05K7/20

    Abstract: A thermal management assembly comprises a heat sink including a graphite layer having a first surface, a second surface, and a thickness comprising a graphene layer, where graphite layer is obtained by cleaving a graphene layer from a graphite sheet, where graphite layer exhibits a thermal conductivity, which is anisotropic in nature and is greater than 500 W/m[deg]C in a plane(s); and a support layer comprising a metal, a polymeric resin, and/or a ceramic disposed on a surface(s) of the graphite layer. A thermal management assembly comprises a base thermally coupled to the heat generating device; and a heat sink thermally coupled to the base. The heat sink comprises a graphite layer having a first surface, a second surface, and a thickness comprising a graphene layer, where graphite layer is obtained by cleaving a graphene layer from a graphite sheet, where graphite layer exhibits a thermal conductivity, which is anisotropic in nature and is greater than 500 W/m[deg]C in a plane(s); and a support layer, which comprises a metal, a polymeric resin, and/or a ceramic, the support layer is disposed on a surface(s) of the graphite layer by a process consisting coating, brushing, spraying, spreading, dipping, laminating, or powder coating. Before the support layer is disposed on the graphite layer, the graphite layer is treated by plasma etching, ion etching, and/or chemical etching. The support layer comprises parylene, and formed by applying parylene onto a surface of the graphite layer, where parylene is applied onto the surface by brushing, dipping, spraying, or a chemical vapor deposition process. It comprises a metal foil backed by a thermally conductive adhesive layer. Independent claims are also included for: (1) a heat dissipating fin (14) for use in thermal management assemblies, the fin comprising a graphite layer; (2) a cooling system; and (3) a method for constructing a thermal management system.

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