公开(公告)号：ES2066807T3

公开(公告)日：1995-03-16

申请号：ES89111580

申请日：1989-06-26

Applicant: GEN ELECTRIC

Inventor： HALLGREN JOHN EDWARD ,  BOLON DONALD ALLEN ,  EDDY VICTORIA JEAN ,  IRWIN PATRICIA CHAPMAN ,  PRESLEY JAMES ROBERT ,  DAVIS MICHAEL JOHN ,  MINNICK MICHAEL GERALD ,  KUBISEN STEVEN JOSEPH JR ,  WALLES ERIK WILHELM ,  LUPINSKI JOHN HENRY ,  MARKOVITZ MARC NMN ,  COLBORN ROBERT EDGAR

IPC: C08K3/22 ,  C08G59/00 ,  C08G59/06 ,  C08G59/14 ,  C08G59/38 ,  C08G59/50 ,  C08G59/56 ,  C08G59/62 ,  C08G59/68 ,  C08L61/10 ,  C08L63/00 ,  C08L71/12 ,  D01F11/12 ,  H01B1/04 ,  H05K1/03 ,  C08L63/04 ,  C08K5/09

Abstract: Curable compositions containing a reaction product of at least one bisphenol polyglycidyl ether, at least one epoxidized novolak and at least one brominated bisphenol, in combination with a polyphenylene ether and further components including specific catalysts and hardeners, may be used in the preparation of laminates useful as printed circuit boards and having excellent physical and electrical properties.

公开(公告)号：GB2210371A

公开(公告)日：1989-06-07

申请号：GB8822037

申请日：1988-09-20

Applicant: GEN ELECTRIC

Inventor： WALLES ERIK WILHELM ,  CRIVELLO JAMES VINCENT ,  LUPINSKI JOHN HENRY

IPC: C08G59/00 ,  C08G59/68 ,  C08K3/36 ,  C08L63/00 ,  C09K3/10 ,  H01L21/56 ,  H01L23/29 ,  H01L23/31

Abstract: A method for encapsulating microelectronic devices is provided using a heat curable epoxy composition having a monomeric or polymeric diaryliodonium hexafluoroantimonate salt. Curable compositions are also provided as well as encapsulated microelectronic devices.

公开(公告)号：DE3851194T2

公开(公告)日：1995-04-06

申请号：DE3851194

申请日：1988-09-24

Applicant: GEN ELECTRIC

Inventor： WALLES ERIK WILHELM ,  CRIVELLO JAMES VINCENT ,  LUPINSKI JOHN HENRY

IPC: C08G59/00 ,  C08G59/68 ,  C08K3/36 ,  C08L63/00 ,  C09K3/10 ,  H01L21/56 ,  H01L23/29 ,  H01L23/31

Abstract: A method for encapsulating microelectronic devices is provided using a heat curable epoxy composition having a monomeric or polymeric diaryliodonium hexafluoroantimonate salt. Curable compositions are also provided as well as encapsulated microelectronic devices.

公开(公告)号：HK112494A

公开(公告)日：1994-10-27

申请号：HK112494

申请日：1994-10-20

Applicant: GEN ELECTRIC

Inventor： WALLES ERIK WILHELM ,  CRIVELLO JAMES VINCENT ,  LUPINSKI JOHN HENRY

IPC: C08G59/00 ,  C08G59/68 ,  C08K3/36 ,  C08L63/00 ,  C09K3/10 ,  H01L21/56 ,  H01L23/29 ,  H01L23/31 ,  B29C43/18

Abstract: A method for encapsulating microelectronic devices is provided using a heat curable epoxy composition having a monomeric or polymeric diaryliodonium hexafluoroantimonate salt. Curable compositions are also provided as well as encapsulated microelectronic devices.

公开(公告)号：DE3851194D1

公开(公告)日：1994-09-29

申请号：DE3851194

申请日：1988-09-24

Applicant: GEN ELECTRIC

Inventor： WALLES ERIK WILHELM ,  CRIVELLO JAMES VINCENT ,  LUPINSKI JOHN HENRY

IPC: C08G59/00 ,  C08G59/68 ,  C08K3/36 ,  C08L63/00 ,  C09K3/10 ,  H01L21/56 ,  H01L23/29 ,  H01L23/31

Abstract: A method for encapsulating microelectronic devices is provided using a heat curable epoxy composition having a monomeric or polymeric diaryliodonium hexafluoroantimonate salt. Curable compositions are also provided as well as encapsulated microelectronic devices.

公开(公告)号：FI903241A0

公开(公告)日：1990-06-27

申请号：FI903241

申请日：1990-06-27

Applicant: GEN ELECTRIC

Inventor： WALLES ERIK WILHELM ,  LUPINSKI JOHN HENRY ,  CRIVELLO JAMES VINCENT

IPC: H01L21/56 ,  C08F4/06 ,  C08G59/68 ,  C08K3/36 ,  H01B3/40 ,  H01L23/29 ,  H01L23/31 ,  C08F

Abstract: A heat curable composition is provided which is useful for encapsulating microelectronic devices using a heat curable epoxy composition having a diaryliodonium hexafluoroantimonate salt as a catalyst in combination with an effective amount of a free radical generating aromatic compound as a cocatalyst.

公开(公告)号：BR8903453A

公开(公告)日：1990-03-06

申请号：BR8903453

申请日：1989-07-13

Applicant: GEN ELECTRIC

Inventor： WALLES ERIK WILHELM ,  LUPINSKI JOHN HENRY ,  MARKOVITZ MARK ,  COLBORN ROBERT-EDGAR ,  PRESLEY JAMES ROBERT ,  DAVIS MICHAEL JOHN ,  MINNICK MICHAEL GERALD ,  KUBISEN STEVEN JOSEPH JR ,  HALLGREN JOHN EDWARD ,  BOLON DONALD ALLEN ,  EDDY VICTORIA JEAN ,  IRWIN PATRICIA CHAPMAN

IPC: C08K3/22 ,  C08G59/00 ,  C08G59/06 ,  C08G59/14 ,  C08G59/38 ,  C08G59/50 ,  C08G59/56 ,  C08G59/62 ,  C08G59/68 ,  C08L61/10 ,  C08L63/00 ,  C08L71/12 ,  D01F11/12 ,  H01B1/04 ,  H05K1/03 ,  H05K5/02

Abstract: Curable compositions containing a reaction product of at least one bisphenol polyglycidyl ether, at least one epoxidized novolak and at least one brominated bisphenol, in combination with a polyphenylene ether and further components including specific catalysts and hardeners, may be used in the preparation of laminates useful as printed circuit boards and having excellent physical and electrical properties.

公开(公告)号：DE68920646T2

公开(公告)日：1995-08-17

申请号：DE68920646

申请日：1989-06-26

Applicant: GEN ELECTRIC

Inventor： HALLGREN JOHN EDWARD ,  BOLON DONALD ALLEN ,  EDDY VICTORIA JEAN ,  IRWIN PATRICIA CHAPMAN ,  PRESLEY JAMES ROBERT ,  DAVIS MICHAEL JOHN ,  MINNICK MICHAEL GERALD ,  KUBISEN STEVEN JOSEPH ,  WALLES ERIK WILHELM ,  LUPINSKI JOHN HENRY ,  MARKOVITZ MARC NMN ,  COLBORN ROBERT EDGAR

IPC: C08K3/22 ,  C08G59/00 ,  C08G59/06 ,  C08G59/14 ,  C08G59/38 ,  C08G59/50 ,  C08G59/56 ,  C08G59/62 ,  C08G59/68 ,  C08L61/10 ,  C08L63/00 ,  C08L71/12 ,  D01F11/12 ,  H01B1/04 ,  H05K1/03 ,  C08L63/04 ,  C08K5/09

Abstract: Curable compositions containing a reaction product of at least one bisphenol polyglycidyl ether, at least one epoxidized novolak and at least one brominated bisphenol, in combination with a polyphenylene ether and further components including specific catalysts and hardeners, may be used in the preparation of laminates useful as printed circuit boards and having excellent physical and electrical properties.

公开(公告)号：DE68920646D1

公开(公告)日：1995-03-02

申请号：DE68920646

申请日：1989-06-26

Applicant: GEN ELECTRIC

Inventor： HALLGREN JOHN EDWARD ,  BOLON DONALD ALLEN ,  EDDY VICTORIA JEAN ,  IRWIN PATRICIA CHAPMAN ,  PRESLEY JAMES ROBERT ,  DAVIS MICHAEL JOHN ,  MINNICK MICHAEL GERALD ,  KUBISEN STEVEN JOSEPH ,  WALLES ERIK WILHELM ,  LUPINSKI JOHN HENRY ,  MARKOVITZ MARC NMN ,  COLBORN ROBERT EDGAR

IPC: C08K3/22 ,  C08G59/00 ,  C08G59/06 ,  C08G59/14 ,  C08G59/38 ,  C08G59/50 ,  C08G59/56 ,  C08G59/62 ,  C08G59/68 ,  C08L61/10 ,  C08L63/00 ,  C08L71/12 ,  D01F11/12 ,  H01B1/04 ,  H05K1/03 ,  C08L63/04 ,  C08K5/09

Abstract: Curable compositions containing a reaction product of at least one bisphenol polyglycidyl ether, at least one epoxidized novolak and at least one brominated bisphenol, in combination with a polyphenylene ether and further components including specific catalysts and hardeners, may be used in the preparation of laminates useful as printed circuit boards and having excellent physical and electrical properties.

公开(公告)号：GB2210371B

公开(公告)日：1991-11-06

申请号：GB8822037

申请日：1988-09-20

Applicant: GEN ELECTRIC

Inventor： WALLES ERIK WILHELM ,  CRIVELLO JAMES VINCENT ,  LUPINSKI JOHN HENRY

IPC: C08G59/00 ,  C08G59/68 ,  C08K3/36 ,  C08L63/00 ,  C09K3/10 ,  H01L21/56 ,  H01L23/29 ,  H01L23/31

Abstract: A method for encapsulating microelectronic devices is provided using a heat curable epoxy composition having a monomeric or polymeric diaryliodonium hexafluoroantimonate salt. Curable compositions are also provided as well as encapsulated microelectronic devices.