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公开(公告)号:WO2016069560A1
公开(公告)日:2016-05-06
申请号:PCT/US2015/057517
申请日:2015-10-27
Applicant: GENERAL ELECTRIC COMPANY
Inventor: KAPUSTA, Christopher , AIMI, Marco
CPC classification number: H01L23/10 , B81B7/0077 , H01L2224/48091 , H01L2224/49171 , H01L2924/0002 , H01L2924/00014 , H01L2924/00
Abstract: A non-magnetic hermetic package includes walls that surround an open cavity, with a generally planar non-magnetic and metallic seal ring disposed in a continuous loop around upper edges of the walls; a sensitive component that is bonded within the cavity; and a non-magnetic lid that is sealed to the seal ring to close the cavity by a metallic seal.
Abstract translation: 非磁性密封包装包括围绕开放空腔的壁,具有围绕壁的上边缘设置在连续环中的大致平面的非磁性和金属密封环; 在腔内结合的敏感部件; 以及密封到密封环以通过金属密封封闭空腔的非磁性盖。
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公开(公告)号:WO2016069575A1
公开(公告)日:2016-05-06
申请号:PCT/US2015/057534
申请日:2015-10-27
Applicant: GENERAL ELECTRIC COMPANY
Inventor: KAPUSTA, Christopher , AIMI, Marco
CPC classification number: C23C28/023 , B23K1/0016 , B23K35/0222 , B23K35/262 , B23K35/3013 , B23K2201/40 , B81C1/00269 , B81C2201/013 , B81C2203/0109 , B81C2203/019 , B81C2203/037 , C23C14/025 , C23C14/165 , C23C14/3414 , C23C14/58 , C23C28/021 , C23F1/00 , C23F4/00 , C25D3/50 , C25D7/123
Abstract: A non-magnetic lid for sealing a hermetic package. The lid includes a molybdenum substrate having a sputtered adhesion layer and a copper seed layer. The lid also includes a plated palladium solder base layer, and has gold/tin solder preforms attached to a sealing surface of the lid.
Abstract translation: 用于密封密封包装的非磁性盖。 盖包括具有溅射粘附层和铜籽晶层的钼基板。 盖子还包括镀钯钯基底层,并且具有附着到盖的密封表面上的金/锡焊料预成型件。
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公开(公告)号:WO2004051327A2
公开(公告)日:2004-06-17
申请号:PCT/US2003/036683
申请日:2003-11-17
Applicant: GENERAL ELECTRIC COMPANY
Inventor: KAPUSTA, Christopher , SHIH, Min-Yi , GUIDA, Renato
IPC: G02B6/00
CPC classification number: G02B6/42 , G02B6/4206 , G02B6/4214
Abstract: A method and system for increasing the coupling efficiency of optical interconnections between optical elements such as optical fibers, waveguides, and vertical cavity surface emitting lasers (VCSEL) in single mode or multimode.
Abstract translation: 一种用于增加在单模或多模中的诸如光纤,波导和垂直腔表面发射激光器(VCSEL)的光学元件之间的光学互连的耦合效率的方法和系统。
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公开(公告)号:EP3213100A1
公开(公告)日:2017-09-06
申请号:EP15854648.1
申请日:2015-10-27
Applicant: General Electric Company
Inventor: KAPUSTA, Christopher , AIMI, Marco
Abstract: A non-magnetic lid for sealing a hermetic package. The lid includes a molybdenum substrate having a sputtered adhesion layer and a copper seed layer. The lid also includes a plated palladium solder base layer, and has a gold/tin solder preform attached to a sealing surface of the lid.
Abstract translation: 用于密封气密包装的非磁性盖子。 盖包括具有溅射粘合层和铜籽晶层的钼基板。 盖子还包括镀钯钯焊料基层,并具有连接到盖子密封表面的金/锡焊料预制件。
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公开(公告)号:EP3839460A1
公开(公告)日:2021-06-23
申请号:EP20213170.2
申请日:2020-12-10
Applicant: General Electric Company
Inventor: ESLER, David , IANNOTTI, Joseph , KAPUSTA, Christopher
Abstract: A system (100) includes a structure bonding layer (202) and a sensor (104). The structure bonding layer is disposed on a structure (102). The structure bonding layer is a metallic alloy. The sensor includes a non-metallic wafer and a sensor bonding layer (204) disposed on a surface of the non-metallic wafer. The sensor bonding layer is a metallic alloy. The sensor bonding layer is coupled to the structure bonding layer via a metallic joint (106), and the sensor is configured to sense data of the structure through the metallic joint, the structure bonding layer, and the sensor bonding layer.
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公开(公告)号:EP3213100B1
公开(公告)日:2020-06-03
申请号:EP15854648.1
申请日:2015-10-27
Applicant: General Electric Company
Inventor: KAPUSTA, Christopher , AIMI, Marco
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公开(公告)号:EP1567900A2
公开(公告)日:2005-08-31
申请号:EP03783590.7
申请日:2003-11-17
Applicant: GENERAL ELECTRIC COMPANY
Inventor: KAPUSTA, Christopher , SHIH, Min-Yi , GUIDA, Renato
IPC: G02B6/30
CPC classification number: G02B6/42 , G02B6/4206 , G02B6/4214
Abstract: A method and system for increasing the coupling efficiency of optical interconnections between optical elements such as optical fibers, waveguides, and vertical cavity surface emitting lasers (VCSEL) in single mode or multimode.
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