OPTICAL VIA FOR THREE DIMENSIONAL INTERCONNECTION
    3.
    发明申请
    OPTICAL VIA FOR THREE DIMENSIONAL INTERCONNECTION 审中-公开
    光学三维互连

    公开(公告)号:WO2004051327A2

    公开(公告)日:2004-06-17

    申请号:PCT/US2003/036683

    申请日:2003-11-17

    CPC classification number: G02B6/42 G02B6/4206 G02B6/4214

    Abstract: A method and system for increasing the coupling efficiency of optical interconnections between optical elements such as optical fibers, waveguides, and vertical cavity surface emitting lasers (VCSEL) in single mode or multimode.

    Abstract translation: 一种用于增加在单模或多模中的诸如光纤,波导和垂直腔表面发射激光器(VCSEL)的光学元件之间的光学互连的耦合效率的方法和系统。

    LID AND METHOD FOR SEALING A NON-MAGNETIC PACKAGE
    4.
    发明公开
    LID AND METHOD FOR SEALING A NON-MAGNETIC PACKAGE 审中-公开
    用于密封非磁性包装的盖子和方法

    公开(公告)号:EP3213100A1

    公开(公告)日:2017-09-06

    申请号:EP15854648.1

    申请日:2015-10-27

    Abstract: A non-magnetic lid for sealing a hermetic package. The lid includes a molybdenum substrate having a sputtered adhesion layer and a copper seed layer. The lid also includes a plated palladium solder base layer, and has a gold/tin solder preform attached to a sealing surface of the lid.

    Abstract translation: 用于密封气密包装的非磁性盖子。 盖包括具有溅射粘合层和铜籽晶层的钼基板。 盖子还包括镀钯钯焊料基层,并具有连接到盖子密封表面的金/锡焊料预制件。

    SENSOR SYSTEM AND METHOD
    5.
    发明公开

    公开(公告)号:EP3839460A1

    公开(公告)日:2021-06-23

    申请号:EP20213170.2

    申请日:2020-12-10

    Abstract: A system (100) includes a structure bonding layer (202) and a sensor (104). The structure bonding layer is disposed on a structure (102). The structure bonding layer is a metallic alloy. The sensor includes a non-metallic wafer and a sensor bonding layer (204) disposed on a surface of the non-metallic wafer. The sensor bonding layer is a metallic alloy. The sensor bonding layer is coupled to the structure bonding layer via a metallic joint (106), and the sensor is configured to sense data of the structure through the metallic joint, the structure bonding layer, and the sensor bonding layer.

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