METHODS FOR PRODUCING MAGNETO-OPTICAL PHOTONIC INTEGRATED CIRCUITS AND DEVICES FOR PHOTONIC SENSING
    2.
    发明申请
    METHODS FOR PRODUCING MAGNETO-OPTICAL PHOTONIC INTEGRATED CIRCUITS AND DEVICES FOR PHOTONIC SENSING 审中-公开
    生产磁光学光子集成电路和光子传感器件的方法

    公开(公告)号:WO2017213768A1

    公开(公告)日:2017-12-14

    申请号:PCT/US2017/030229

    申请日:2017-04-28

    Abstract: A method for fabricating a photonic device includes providing a silicon-on-insulator (SOI) chip comprising at least one SOI-waveguide on top of an oxide layer, and providing a magneto-optic-material-on- substrate (MO/substrate) chip comprising a magneto-optic material disposed on top of a substrate. The method includes cleaning a first surface of the SOI chip and a second surface of the MO/substrate chip, wherein the first surface comprises surfaces of the at least one SOI- waveguide and the second surface consisting essentially of a surface of the magneto-optic material. The method also includes assembling the SOI chip and the MO/substrate chip to form an assembly, and removing the substrate of the MO/substrate chip.The wafer are bonded ether using direct bonding of plasma activated surfaces or the use of an adhesive.

    Abstract translation: 一种用于制造光子器件的方法包括:提供绝缘体上硅(SOI)芯片,其在氧化物层的顶部上包​​括至少一个SOI-波导,并且提供磁光材料 - 衬底(MO /衬底)芯片,其包括设置在衬底顶部上的磁光材料。 该方法包括清洁SOI芯片的第一表面和MO /衬底芯片的第二表面,其中第一表面包括至少一个SOI波导的表面,第二表面基本上由磁光盘的表面组成 材料。 该方法还包括组装SOI芯片和MO /衬底芯片以形成组件,并去除MO /衬底芯片的衬底。使用等离子体活化表面的直接结合或使用粘合剂来结合晶片。 / p>

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