-
1.发明申请FLUID FLOW SENSOR CABLE ASSEMBLY, SYSTEM, AND METHOD FOR MEASURING MULTIPHASE FLOW IN BORE WELLS 审中-公开流体流量传感器电缆组件，系统和用于测量钻孔中的多相流的方法
公开(公告)号：WO2017079493A1
公开(公告)日：2017-05-11
申请号：PCT/US2016/060425
申请日：2016-11-04
Applicant: GENERAL ELECTRIC COMPANY
Inventor： TSAKALAKOS, Loucas , RUBINSZTAJN, Slawomir , GUIDA, Renato , BALASUBRAMANIAM, Mahadevan, Nmn , LEE, Boon, Kwee , RUSH, Brian, Magann , AHMAD, Faisal, Razi , MANDAL, Sudeep , SHANKS, David, Sirda
CPC classification number: G01V9/005 , E21B47/06 , E21B47/1005 , G01F1/6884 , G01F1/74 , G01N9/04 , G01N25/00 , G01N27/02
Abstract: A fluid sensor cable assembly and method uses one or more conductive bodies extending along an elongated core body for conducting a heating current to heat the cable assembly. The one or more conductive bodies also are configured to conduct an interrogation signal and to conduct reflections of the interrogation signal. One or more optical fibers extend along the length of the core body and include temperature sensitive elements at different locations along the length of the core body. The temperature sensitive elements measure heat flux out of the cable assembly at the different locations subsequent to heating the cable assembly and communicate the heat flux to a computer acquisition system.
Abstract translation: 流体传感器电缆组件和方法使用沿细长芯体延伸的一个或多个导电体来传导加热电流以加热电缆组件。 一个或多个导电体也被配置为传导询问信号并传导询问信号的反射。 一个或多个光纤沿着芯体的长度延伸并且包括沿着芯体长度的不同位置处的温度敏感元件。 温度敏感元件在加热电缆组件之后测量不同位置处的电缆组件的热通量并将热通量传送到计算机采集系统。
-
2.发明申请
公开(公告)号：WO2017190064A3
公开(公告)日：2017-11-02
申请号：PCT/US2017/030227
申请日：2017-04-28
Applicant: GENERAL ELECTRIC COMPANY , KOSTE, Glen Peter , PALIT, Sabarni , DEKATE, Sachin Narahari , KOREVAAR, Bastiaan Arie , TSAKALAKOS, Loucas , MEYERS, Mark Marshall
Inventor： KOSTE, Glen Peter , PALIT, Sabarni , DEKATE, Sachin Narahari , KOREVAAR, Bastiaan Arie , TSAKALAKOS, Loucas , MEYERS, Mark Marshall
Abstract: A system includes a Mach-Zehnder cirulator isolator. The Mach-Zehnder structure includes a substrate, a plurality of waveguides (128) disposed on the substrate, and a magneto-optic material (132) coupled to the plurality of waveguides. The Mach-Zehnder structure also includes one or more magnets configured to couple to the magneto-optic material and induce a magnetic field (see arrwos) in the magneto-optic material, wherein the Mach-Zehnder structure is configured to induce a non-reciprocal phase shift on light propagating in the plurality of waveguides. The system also includes one or more phase tuning elements (148) coupled to the Mach-Zehnder structure and configured to tune the phase shift.
-
3.发明申请METHODS FOR PRODUCING MAGNETO-OPTICAL PHOTONIC INTEGRATED CIRCUITS AND DEVICES FOR PHOTONIC SENSING 审中-公开生产磁光学光子集成电路和光子传感器件的方法
公开(公告)号：WO2017213768A1
公开(公告)日：2017-12-14
申请号：PCT/US2017/030229
申请日：2017-04-28
Applicant: GENERAL ELECTRIC COMPANY
Inventor： KOREVAAR, Bastiaan Arie , TSAKALAKOS, Loucas
CPC classification number: G02B6/13 , G01R15/246 , G02B6/124 , G02B6/126 , G02B2006/12157 , G02B2006/12159 , G02F1/095 , G02F1/225 , G02F2001/212
Abstract: A method for fabricating a photonic device includes providing a silicon-on-insulator (SOI) chip comprising at least one SOI-waveguide on top of an oxide layer, and providing a magneto-optic-material-on- substrate (MO/substrate) chip comprising a magneto-optic material disposed on top of a substrate. The method includes cleaning a first surface of the SOI chip and a second surface of the MO/substrate chip, wherein the first surface comprises surfaces of the at least one SOI- waveguide and the second surface consisting essentially of a surface of the magneto-optic material. The method also includes assembling the SOI chip and the MO/substrate chip to form an assembly, and removing the substrate of the MO/substrate chip.The wafer are bonded ether using direct bonding of plasma activated surfaces or the use of an adhesive.
Abstract translation: 一种用于制造光子器件的方法包括：提供绝缘体上硅（SOI）芯片，其在氧化物层的顶部上包括至少一个SOI-波导，并且提供磁光材料 - 衬底（MO /衬底）芯片，其包括设置在衬底顶部上的磁光材料。 该方法包括清洁SOI芯片的第一表面和MO /衬底芯片的第二表面，其中第一表面包括至少一个SOI波导的表面，第二表面基本上由磁光盘的表面组成 材料。 该方法还包括组装SOI芯片和MO /衬底芯片以形成组件，并去除MO /衬底芯片的衬底。使用等离子体活化表面的直接结合或使用粘合剂来结合晶片。 / p>
-
公开(公告)号：WO2017190064A2
公开(公告)日：2017-11-02
申请号：PCT/US2017/030227
申请日：2017-04-28
Applicant: GENERAL ELECTRIC COMPANY , KOSTE, Glen Peter , PALIT, Sabarni , DEKATE, Sachin Narahari , KOREVAAR, Bastiaan Arie , TSAKALAKOS, Loucas , MEYERS, Mark Marshall
Inventor： KOSTE, Glen Peter , PALIT, Sabarni , DEKATE, Sachin Narahari , KOREVAAR, Bastiaan Arie , TSAKALAKOS, Loucas , MEYERS, Mark Marshall
CPC classification number: G02B6/13 , G01R15/246 , G02B6/124 , G02B6/126 , G02B2006/12157 , G02B2006/12159 , G02F1/095 , G02F1/225 , G02F2001/212
Abstract: A system includes a Mach-Zehnder structure. The Mach-Zehnder structure includes a substrate, a plurality of waveguides disposed on the substrate, and a magneto-optic material coupled to the plurality of waveguides. The Mach-Zehnder structure also includes one or more magnets configured to couple to the magneto-optic material and induce a magnetic field in the magneto-optic material, wherein the Mach-Zehnder structure is configured to induce a non-reciprocal phase shift on light propagating in the plurality of waveguides. The system also includes one or more phase tuning elements coupled to the Mach-Zehnder structure and configured to tune the phase shift.
Abstract translation: 系统包括Mach-Zehnder结构。 Mach-Zehnder结构包括衬底，设置在衬底上的多个波导以及耦合到多个波导的磁光材料。 Mach-Zehnder结构还包括一个或多个磁体，该磁体被配置为耦合到磁光材料并在磁光材料中感应磁场，其中Mach-Zehnder结构被配置为引起光的非互易相移 在多个波导中传播。 该系统还包括一个或多个耦合到Mach-Zehnder结构并配置成调谐相移的相位调谐元件。
-
Patent Agency Ranking
公开(公告)号：WO2005051842A3
公开(公告)日：2005-06-09
申请号：PCT/US2004/038271
申请日：2004-11-16
Applicant: GENERAL ELECTRIC COMPANY , TSAKALAKOS, Loucas , LEE, Ji-Ung , HUBER, William, Hullinger , CORDERMAN, Reed, Roeder , MANI, Vanita
Inventor： TSAKALAKOS, Loucas , LEE, Ji-Ung , HUBER, William, Hullinger , CORDERMAN, Reed, Roeder , MANI, Vanita
Abstract: In a method of making an elongated carbide nanostructure, a plurality of spatially-separated catalyst particles is applied to a substrate. The spatially-separated catalyst particles and at least a portion of the substrate are exposed to a metal-containing vapor at a preselected temperature and for a period sufficient to cause an inorganic nanostructure to form between the substrate and at least one of the catalyst particles. The inorganic nano-structure is exposed to a carbon-containing vapor source at a preselected temperature and for a period sufficient to carburize the inorganic nanostructure.
-
公开(公告)号：EP3385751A2
公开(公告)日：2018-10-10
申请号：EP18165673.7
申请日：2018-04-04
Applicant: General Electric Company
Inventor： MEYERS, Mark Marshall , FELDMANN, Michael , TSAKALAKOS, Loucas
CPC classification number: G01S17/08 , G01S7/4812 , G01S7/4814 , G01S7/4815 , G01S7/4816 , G01S7/4817 , G01S17/10 , G01S17/42 , G01S17/89 , G01S17/936
Abstract: A light detection and ranging (LiDAR) system 100; 200 includes light sources 302 configured to generate separate beams of light 104, a lens array 106 configured to receive the separate beams of light 104 from the light sources 302 and to collimate the separate beams of light 104 into collimated outgoing light 108 that is directed toward an examined area of interest, a light sensitive detector 126; 208 configured to sense reflection of at least part of the collimated outgoing light 108, and one or more processors 130 configured to determine a distance to one or more objects off which the at least part of the collimated outgoing light 108 was reflected toward the light sensitive detector. The one or more processors 130 are configured to determine the distance based on the reflection of the at least part of the collimated outgoing light 108.
-
7.发明公开
公开(公告)号：EP3371556A1
公开(公告)日：2018-09-12
申请号：EP16805924.4
申请日：2016-11-04
Applicant: General Electric Company
Inventor： TSAKALAKOS, Loucas , RUBINSZTAJN, Slawomir , GUIDA, Renato , BALASUBRAMANIAM, Mahadevan, Nmn , LEE, Boon, Kwee , RUSH, Brian, Magann , AHMAD, Faisal, Razi , MANDAL, Sudeep , SHANKS, David, Sirda
CPC classification number: G01V9/005 , E21B47/06 , E21B47/1005 , G01F1/6884 , G01F1/74 , G01N9/04 , G01N25/00 , G01N27/02
Abstract: A fluid sensor cable assembly and method uses one or more conductive bodies extending along an elongated core body for conducting a heating current to heat the cable assembly. The one or more conductive bodies also are configured to conduct an interrogation signal and to conduct reflections of the interrogation signal. One or more optical fibers extend along the length of the core body and include temperature sensitive elements at different locations along the length of the core body. The temperature sensitive elements measure heat flux out of the cable assembly at the different locations subsequent to heating the cable assembly and communicate the heat flux to a computer acquisition system.
-
公开(公告)号：EP3808663A1
公开(公告)日：2021-04-21
申请号：EP20200331.5
申请日：2020-10-06
Applicant: General Electric Company
Inventor： TSAKALAKOS, Loucas , CHEN, Cheng-Po , SHAH, Binoy
IPC: B64F1/20 , F21S41/675 , F21S41/16 , F21S41/153 , G01S1/00 , G01S1/70 , G02B19/00
Abstract: A lighting system (104, 1400) for a navigational system (100) of a vehicle includes a scanning unit (110, 110A, 110B, 1410, 1410A, 1410B) and one or more lighting assemblies (104, 104A, 104B, 404, 1204A, 1204B, 1204C, 1204D, 1204E, 1204F, 1204G, 1204H, 12041, 1204J, 1304). Each lighting assembly (104, 104A, 104B, 404, 1204A, 1204B, 1204C, 1204D, 1204E, 1204F, 1204G, 1204H, 12041, 1204J, 1304) includes one or more laser diodes (124, 1224, 1224A, 1224B) configured to emit light, a lens array (106, 106A, 106B, 206, 302, 1206) including one or more lens elements (206, 206A, 206B, 206C, 206D, 206E, 206F, 1216), and a controller (122, 1222, 1222A, 1222B, 1622) electrically coupled with each of the laser diodes (124, 1224, 1224A, 1224B). The lens array (106, 106A, 106B, 206, 302, 1206) receives incoming light from the laser diodes (124, 1224, 1224A, 1224B) and direct the incoming light from the lens array (106, 106A, 106B, 206, 302, 1206) as a collimated beam (1408, 1508). The controller (122, 1222, 1222A, 1222B, 1622) individually controls a power level of each of the laser diodes (124, 1224, 1224A, 1224B). The laser diodes (124, 1224, 1224A, 1224B), the lens array (106, 106A, 106B, 206, 302, 1206), and the controller (122, 1222, 1222A, 1222B, 1622) are disposed on a substrate (120, 1220, 1720) and disposed in a common housing (111, 1211). Each lighting assembly (104, 104A, 104B, 404, 1204A, 1204B, 1204C, 1204D, 1204E, 1204F, 1204G, 1204H, 12041, 1204J, 1304) is arranged in an arc relative to the scanning unit (110, 110A, 110B, 1410, 1410A, 1410B). The scanning unit (110, 110A, 110B, 1410, 1410A, 1410B) receives the collimated beam (1408, 1508) from each lighting assembly (104, 104A, 104B, 404, 1204A, 1204B, 1204C, 1204D, 1204E, 1204F, 1204G, 1204H, 12041, 1204J, 1304) and directs the collimated beam (1408, 1508) from each lighting assembly (104, 104A, 104B, 404, 1204A, 1204B, 1204C, 1204D, 1204E, 1204F, 1204G, 1204H, 12041, 1204J, 1304) in two orthogonal directions.
-
公开(公告)号：EP3385751A3
公开(公告)日：2019-01-02
申请号：EP18165673.7
申请日：2018-04-04
Applicant: General Electric Company
Inventor： MEYERS, Mark Marshall , FELDMANN, Michael , TSAKALAKOS, Loucas
Abstract: A light detection and ranging (LiDAR) system 100; 200 includes light sources 302 configured to generate separate beams of light 104, a lens array 106 configured to receive the separate beams of light 104 from the light sources 302 and to collimate the separate beams of light 104 into collimated outgoing light 108 that is directed toward an examined area of interest, a light sensitive detector 126; 208 configured to sense reflection of at least part of the collimated outgoing light 108, and one or more processors 130 configured to determine a distance to one or more objects off which the at least part of the collimated outgoing light 108 was reflected toward the light sensitive detector. The one or more processors 130 are configured to determine the distance based on the reflection of the at least part of the collimated outgoing light 108.
-
-
-
-
-
-
-
-
Search Results
9
records
(took 0.025 seconds)
