公开(公告)号：WO2013019422A1

公开(公告)日：2013-02-07

申请号：PCT/US2012/047390

申请日：2012-07-19

Applicant: GENERAL ELECTRIC COMPANY ,  LIU, James, Zhengshe ,  VAFI, Habib

Inventor： LIU, James, Zhengshe ,  VAFI, Habib

IPC: A61B6/10

CPC classification number: A61B6/4233 ,  A61B6/107 ,  A61B6/56

Abstract: A digital X-ray detector includes a multi-functional panel support configured to support a digital detector array on a first side of the panel support and electronics on a second side of the panel support. The panel support includes a first enclosure and a rechargeable battery disposed within the first enclosure.

Abstract translation: 数字X射线检测器包括多功能面板支撑件，其被配置为在面板支撑件的第二侧上在面板支撑件的第一侧和电子设备上支撑数字检测器阵列。 面板支撑件包括第一外壳和设置在第一外壳内的可再充电电池。

公开(公告)号：WO2017116524A1

公开(公告)日：2017-07-06

申请号：PCT/US2016/055555

申请日：2016-10-05

Applicant: GENERAL ELECTRIC COMPANY

Inventor： JACOB, Biju ,  VAFI, Habib ,  YANOFF, Brian David ,  SHAW, Jeffery Jon ,  GUO, Jianjun

IPC: H01L27/146

CPC classification number: H01L27/14689 ,  G01T1/2018 ,  G01T1/247 ,  H01L27/14625 ,  H01L27/14636 ,  H01L27/14658 ,  H01L27/14661 ,  H01L27/14663 ,  H01L27/1469

Abstract: Various approaches are discussed for using four-side buttable CMOS tiles to fabricate detector panels, including large-area detector panels. Fabrication may utilize pads and interconnect structures formed on the top or bottom of the CMOS tiles. Electrical connection and readout may utilize readout and digitization circuitry provided on the CMOS tiles themselves such that readout of groups or sub-arrays of pixels occurs at the tile level, while tiles are then readout at the detector level such that readout operations are tiered or multi-level.

公开(公告)号：WO2017116523A1

公开(公告)日：2017-07-06

申请号：PCT/US2016/055543

申请日：2016-10-05

Applicant: GENERAL ELECTRIC COMPANY

Inventor： JACOB, Biju ,  VAFI, Habib ,  YANOFF, Brian David ,  SHAW, Jeffery Jon ,  GUO, Jianjun

IPC: H01L27/146

CPC classification number: H01L27/14636 ,  G01T1/247 ,  H01L27/14634 ,  H01L27/14643 ,  H01L27/14658 ,  H01L27/14689 ,  H01L27/1469 ,  H04N5/378

Abstract: Various approaches are discussed for using four-side buttable CMOS tiles to fabricate detector panels, including large-area detector panels. Fabrication may utilize pads and interconnect structures formed on the top or bottom of the CMOS tiles. Electrical connection and readout may utilize readout and digitization circuitry provided on the CMOS tiles themselves such that readout of groups or sub-arrays of pixels occurs at the tile level, while tiles are then readout at the detector level such that readout operations are tiered or multi-level.

Abstract translation: 讨论了使用四面可对齐CMOS瓷砖来制造包括大面积检测器面板的检测器面板的各种方法。 制造可以利用形成在CMOS瓦片的顶部或底部上的焊盘和互连结构。 电连接和读出可以利用提供在CMOS瓦片本身上的读出和数字化电路，使得在瓦片层级处出现像素的组或子阵列的读出，然后在检测器层级处读出瓦片，使得读出操作被分层或多 - 电平。

公开(公告)号：WO2015153777A1

公开(公告)日：2015-10-08

申请号：PCT/US2015/023902

申请日：2015-04-01

Applicant: GENERAL ELECTRIC COMPANY

Inventor： LIU, James Zhengshe ,  VAFI, Habib ,  GRANFORS, Paul Richard

IPC: G01T1/20

CPC classification number: G01T1/24 ,  G01T1/2018 ,  H01L31/18

Abstract: An X-ray detector panel includes a plurality of photodetector wafers are arranged in a photodetector array. Each photodetector wafer comprises a sensing surface, a contact surface disposed opposite the sensing surface, and an electrical contact coupled to the contact surface. A substrate is coupled to the photodetector array such that the photodetector array is substantially surrounded by the substrate and a face surface of the substrate is substantially coplanar with the sensing surface. A scintillator is coupled to the face surface of the substrate and substantially covers the sensing surfaces of the photodetector array. A scintillator cover is substantially sealingly coupled to the face surface.

Abstract translation: X射线检测器面板包括多个光电检测器晶片，其布置在光电检测器阵列中。 每个光电检测器晶片包括感测表面，与感测表面相对设置的接触表面以及耦合到接触表面的电接触。 衬底耦合到光电检测器阵列，使得光电检测器阵列基本上被衬底包围，并且衬底的面表面与感测表面基本上共面。 闪烁体耦合到衬底的表面并且基本上覆盖光电检测器阵列的感测表面。 闪烁体盖基本上密封地联接到表面。

公开(公告)号：EP3126876A1

公开(公告)日：2017-02-08

申请号：EP15715642.3

申请日：2015-04-01

Applicant: General Electric Company

Inventor： LIU, James Zhengshe ,  VAFI, Habib ,  GRANFORS, Paul Richard

IPC: G01T1/20

CPC classification number: G01T1/24 ,  G01T1/2018 ,  H01L31/18

Abstract: An X-ray detector panel includes a plurality of photodetector wafers are arranged in a photodetector array. Each photodetector wafer comprises a sensing surface, a contact surface disposed opposite the sensing surface, and an electrical contact coupled to the contact surface. A substrate is coupled to the photodetector array such that the photodetector array is substantially surrounded by the substrate and a face surface of the substrate is substantially coplanar with the sensing surface. A scintillator is coupled to the face surface of the substrate and substantially covers the sensing surfaces of the photodetector array. A scintillator cover is substantially sealingly coupled to the face surface.

Abstract translation: X射线检测器面板包括多个光电检测器晶片，其布置在光电检测器阵列中。 每个光电检测器晶片包括感测表面，与感测表面相对设置的接触表面和耦合到接触表面的电触点。 衬底耦合到光电检测器阵列，使得光电检测器阵列基本上被衬底包围，并且衬底的面表面与感测表面基本上共面。 闪烁体耦合到衬底的表面并且基本上覆盖光电检测器阵列的感测表面。 闪烁体盖基本上密封地联接到面表面。