公开(公告)号：MX166210B

公开(公告)日：1992-12-23

申请号：MX1883789

申请日：1989-12-21

Applicant: GOODRICH CO B F

Inventor： BENEDIKT GEORGE M ,  ALEKSA DAVID M ,  TENNEY LINWOOD P

IPC: B32B3/00 ,  B32B15/08 ,  B32B23/14 ,  B32B27/32 ,  H05K1/03 ,  H05K3/38

公开(公告)号：NO173375B

公开(公告)日：1993-08-30

申请号：NO895178

申请日：1989-12-21

Applicant: GOODRICH CO B F

Inventor： BENEDIKT GEORGE M ,  ALEKSA DAVID M ,  TENNEY LINWOOD P

IPC: B32B15/08 ,  B05D1/18 ,  B32B3/12 ,  B32B7/02 ,  B32B9/00 ,  B32B15/14 ,  C08G61/08 ,  C08J5/12 ,  C08J5/24 ,  H01B3/30 ,  H05K1/03 ,  H05K3/02 ,  H05K3/38 ,  H05K3/46 ,  B32B27/04 ,  B32B27/32 ,  B32B31/20 ,  B32B33/00

Abstract: Laminates are provided of at least one polynorbornene prepreg comprising a substrate coated with a polynorbornene secured to a conductive surface, such as copper having an etched matte texture thereon. Adhesion between the polynorbornene prepreg and the conductive surface is improved by coating the conducting surface with as silane coupling agent and/or by providing polyolefin film therebetween. To improve or reduce the dielectric constant, polyolefin powder can be placed in the dipping bath in the preparation of polynorbornene prepregs. Epoxy prepreg can also be incorporated into the laminates. Multi-layer laminates can be provided of alternating or non-alternating epoxy prepregs and polynorbornene prepregs. The prepregs are made by a process which includes an adhesion promotion step wherein the prepreg, preferably polynorbornene prepreg, prior to lamination, is pretreated with a silane adhesion promotion agent. One or more copper foils can also be employed between exterior surfaces of the prepregs, at the interface between the prepregs, as well as on the exterior of the laminates. The copper films can be etched to form patterns such as those suitable for printed circuit wiring boards.

公开(公告)号：NO895178A

公开(公告)日：1990-06-25

申请号：NO895178

申请日：1989-12-21

Applicant: GOODRICH CO B F

Inventor： BENEDIKT GEORGE M ,  ALEKSA DAVID M ,  TENNEY LINWOOD P

IPC: B32B15/08 ,  B05D1/18 ,  B32B3/12 ,  B32B7/02 ,  B32B9/00 ,  B32B15/14 ,  C08G61/08 ,  C08J5/12 ,  C08J5/24 ,  H01B3/30 ,  H05K1/03 ,  H05K3/02 ,  H05K3/38 ,  H05K3/46 ,  B32B7/04 ,  H05K1/02

CPC classification number: C08J5/128 ,  B32B3/12 ,  B32B15/14 ,  C08G61/08 ,  C08J5/24 ,  C08J2365/00 ,  H01B3/30 ,  H05K1/032 ,  H05K1/0353 ,  H05K1/0366 ,  H05K3/022 ,  H05K3/389 ,  H05K3/4611 ,  H05K2201/0158 ,  H05K2201/0239 ,  H05K2201/0355 ,  H05K2203/0723

公开(公告)号：NO173375C

公开(公告)日：1993-12-08

申请号：NO895178

申请日：1989-12-21

Applicant: GOODRICH CO B F

Inventor： BENEDIKT GEORGE M ,  ALEKSA DAVID M ,  TENNEY LINWOOD P

IPC: B32B15/08 ,  B05D1/18 ,  B32B3/12 ,  B32B7/02 ,  B32B9/00 ,  B32B15/14 ,  C08G61/08 ,  C08J5/12 ,  C08J5/24 ,  H01B3/30 ,  H05K1/03 ,  H05K3/02 ,  H05K3/38 ,  H05K3/46 ,  B32B27/04 ,  B32B27/32 ,  B32B31/20 ,  B32B33/00

Abstract: Laminates are provided of at least one polynorbornene prepreg comprising a substrate coated with a polynorbornene secured to a conductive surface, such as copper having an etched matte texture thereon. Adhesion between the polynorbornene prepreg and the conductive surface is improved by coating the conducting surface with as silane coupling agent and/or by providing polyolefin film therebetween. To improve or reduce the dielectric constant, polyolefin powder can be placed in the dipping bath in the preparation of polynorbornene prepregs. Epoxy prepreg can also be incorporated into the laminates. Multi-layer laminates can be provided of alternating or non-alternating epoxy prepregs and polynorbornene prepregs. The prepregs are made by a process which includes an adhesion promotion step wherein the prepreg, preferably polynorbornene prepreg, prior to lamination, is pretreated with a silane adhesion promotion agent. One or more copper foils can also be employed between exterior surfaces of the prepregs, at the interface between the prepregs, as well as on the exterior of the laminates. The copper films can be etched to form patterns such as those suitable for printed circuit wiring boards.

公开(公告)号：NO895178L

公开(公告)日：1990-06-25

申请号：NO895178

申请日：1989-12-21

Applicant: GOODRICH CO B F

Inventor： BENEDIKT GEORGE M ,  ALEKSA DAVID M ,  TENNEY LINWOOD P

IPC: B32B15/08 ,  B05D1/18 ,  B32B3/12 ,  B32B7/02 ,  B32B9/00 ,  B32B15/14 ,  C08G61/08 ,  C08J5/12 ,  C08J5/24 ,  H01B3/30 ,  H05K1/03 ,  H05K3/02 ,  H05K3/38 ,  H05K3/46 ,  B32B7/04 ,  H05K1/02

Abstract: Laminates are provided of at least one polynorbornene prepreg comprising a substrate coated with a polynorbornene secured to a conductive surface, such as copper having an etched matte texture thereon. Adhesion between the polynorbornene prepreg and the conductive surface is improved by coating the conducting surface with as silane coupling agent and/or by providing polyolefin film therebetween. To improve or reduce the dielectric constant, polyolefin powder can be placed in the dipping bath in the preparation of polynorbornene prepregs. Epoxy prepreg can also be incorporated into the laminates. Multi-layer laminates can be provided of alternating or non-alternating epoxy prepregs and polynorbornene prepregs. The prepregs are made by a process which includes an adhesion promotion step wherein the prepreg, preferably polynorbornene prepreg, prior to lamination, is pretreated with a silane adhesion promotion agent. One or more copper foils can also be employed between exterior surfaces of the prepregs, at the interface between the prepregs, as well as on the exterior of the laminates. The copper films can be etched to form patterns such as those suitable for printed circuit wiring boards.

公开(公告)号：CA1294386C

公开(公告)日：1992-01-14

申请号：CA527639

申请日：1987-01-19

Applicant: GOODRICH CO B F

Inventor： SULLIVAN FRANCIS R ,  ALEKSA DAVID M

IPC: H01B1/22 ,  C09D5/24 ,  C09D7/12 ,  C09D7/80 ,  H01B1/00 ,  H05K9/00 ,  C09D7/14

Abstract: An aqueous based electrically conductive paint having substantially enhanced settling properties employing a nickel plate pigment and a surfactant having substantial unsaturation characteristics. Paint finds particular application in providing EMI and RFI shielding for electrical components when applied to cabinetry housing such components.

公开(公告)号：BR8906749A

公开(公告)日：1990-09-18

申请号：BR8906749

申请日：1989-12-26

Applicant: GOODRICH CO B F

Inventor： BENEDIKT GEORGE M ,  TENNEY LINWOOD P ,  ALEKSA DAVID M

IPC: B32B15/08 ,  B05D1/18 ,  B32B3/12 ,  B32B7/02 ,  B32B9/00 ,  B32B15/14 ,  C08G61/08 ,  C08J5/12 ,  C08J5/24 ,  H01B3/30 ,  H05K1/03 ,  H05K3/02 ,  H05K3/38 ,  H05K3/46 ,  B32B31/04 ,  B32B7/12

Abstract: Laminates are provided of at least one polynorbornene prepreg comprising a substrate coated with a polynorbornene secured to a conductive surface, such as copper having an etched matte texture thereon. Adhesion between the polynorbornene prepreg and the conductive surface is improved by coating the conducting surface with as silane coupling agent and/or by providing polyolefin film therebetween. To improve or reduce the dielectric constant, polyolefin powder can be placed in the dipping bath in the preparation of polynorbornene prepregs. Epoxy prepreg can also be incorporated into the laminates. Multi-layer laminates can be provided of alternating or non-alternating epoxy prepregs and polynorbornene prepregs. The prepregs are made by a process which includes an adhesion promotion step wherein the prepreg, preferably polynorbornene prepreg, prior to lamination, is pretreated with a silane adhesion promotion agent. One or more copper foils can also be employed between exterior surfaces of the prepregs, at the interface between the prepregs, as well as on the exterior of the laminates. The copper films can be etched to form patterns such as those suitable for printed circuit wiring boards.

公开(公告)号：CA2005690A1

公开(公告)日：1990-06-23

申请号：CA2005690

申请日：1989-12-15

Applicant: GOODRICH CO B F

Inventor： BENEDIKT GEORGE M ,  ALEKSA DAVID M ,  TENNEY LINWOOD P

IPC: B32B15/08 ,  B05D1/18 ,  B32B3/12 ,  B32B7/02 ,  B32B9/00 ,  B32B15/14 ,  C08G61/08 ,  C08J5/12 ,  C08J5/24 ,  H01B3/30 ,  H05K1/03 ,  H05K3/02 ,  H05K3/38 ,  H05K3/46

Abstract: Laminates are provided of at least one polynorbornene prepreg comprising a substrate coated with a polynorbornene secured to a conductive surface, such as copper having an etched matte texture thereon. Adhesion between the polynorbornene prepreg and the conductive surface is improved by coating the conducting surface with as silane coupling agent and/or by providing polyolefin film therebetween. To improve or reduce the dielectric constant, polyolefin powder can be placed in the dipping bath in the preparation of polynorbornene prepregs. Epoxy prepreg can also be incorporated into the laminates. Multi-layer laminates can be provided of alternating or non-alternating epoxy prepregs and polynorbornene prepregs. The prepregs are made by a process which includes an adhesion promotion step wherein the prepreg, preferably polynorbornene prepreg, prior to lamination, is pretreated with a silane adhesion promotion agent. One or more copper foils can also be employed between exterior surfaces of the prepregs, at the interface between the prepregs, as well as on the exterior of the laminates. The copper films can be etched to form patterns such as those suitable for printed circuit wiring boards. 2067E

公开(公告)号：NO895178D0

公开(公告)日：1989-12-21

申请号：NO895178

申请日：1989-12-21

Applicant: GOODRICH CO B F

Inventor： BENEDIKT GEORGE M ,  ALEKSA DAVID M ,  TENNEY LINWOOD P

IPC: B32B15/08 ,  B05D1/18 ,  B32B3/12 ,  B32B7/02 ,  B32B9/00 ,  B32B15/14 ,  C08G61/08 ,  C08J5/12 ,  C08J5/24 ,  H01B3/30 ,  H05K1/03 ,  H05K3/02 ,  H05K3/38 ,  H05K3/46 ,  B32B

Abstract: Laminates are provided of at least one polynorbornene prepreg comprising a substrate coated with a polynorbornene secured to a conductive surface, such as copper having an etched matte texture thereon. Adhesion between the polynorbornene prepreg and the conductive surface is improved by coating the conducting surface with as silane coupling agent and/or by providing polyolefin film therebetween. To improve or reduce the dielectric constant, polyolefin powder can be placed in the dipping bath in the preparation of polynorbornene prepregs. Epoxy prepreg can also be incorporated into the laminates. Multi-layer laminates can be provided of alternating or non-alternating epoxy prepregs and polynorbornene prepregs. The prepregs are made by a process which includes an adhesion promotion step wherein the prepreg, preferably polynorbornene prepreg, prior to lamination, is pretreated with a silane adhesion promotion agent. One or more copper foils can also be employed between exterior surfaces of the prepregs, at the interface between the prepregs, as well as on the exterior of the laminates. The copper films can be etched to form patterns such as those suitable for printed circuit wiring boards.