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    2.
    发明专利
    未知

    公开(公告)号：SE439230B

    公开(公告)日：1985-06-03

    申请号：SE7813171

    申请日：1978-12-21

    Applicant: GOULD INC

    Inventor： BERDAN B L ,  LUCE B M

    IPC: B32B15/04 ,  B32B15/08 ,  B32B15/092 ,  C23F1/00 ,  C25D3/12 ,  H05K1/09 ,  H05K3/06 ,  H05K3/38 ,  H05K1/00

    Abstract: A readily etchable printed circuit board is provided which comprises a resinous substrate having bonded to at least one surface thereof a composite metal structure. This metal structure includes a layer of copper foil having opposed first and second surfaces and a thin layer of nickel having opposed first and second surfaces with one of the surfaces of the copper foil being bonded to one of the surfaces of the nickel layer and the opposite opposed surface of the nickel layer being bonded to the resinous substrate with the nickel layer containing an effective amount of sulfur to render the copper foil and the nickel barrier layer mutually etchable, i.e., etchable by the same etchant. The preferred amount of sulfur ranges from about 0.05 to about 10.0 weight percent.

    3.
    发明专利
    未知

    公开(公告)号：SE434758B

    公开(公告)日：1984-08-13

    申请号：SE7606209

    申请日：1976-06-02

    Applicant: GOULD INC

    Inventor： BERDAN B L ,  LUCE B M

    IPC: C25D1/04 ,  C25D1/22 ,  C25D5/44 ,  C25D7/06 ,  H05K3/02 ,  H05K3/38

    Abstract: An improvement in providing a mechanically strippable copper plate on an aluminum carrier is achieved by pretreating the aluminum carrier with an alkaline, aqueous, alkali metal zincate composition containing a small amount of one or more water soluble iron, cobalt or nickel salts, and removing substantially all of the deposited zincate coating with acid prior to copper plating.

    4.
    发明专利
    未知

    公开(公告)号：SE7606209L

    公开(公告)日：1977-01-08

    申请号：SE7606209

    申请日：1976-06-02

    Applicant: GOULD INC

    Inventor： BERDAN B L ,  LUCE B M

    IPC: C25D1/04 ,  C25D1/22 ,  C25D5/44 ,  C25D7/06 ,  H05K3/02 ,  H05K3/38

    Abstract: An improvement in providing a mechanically strippable copper plate on an aluminum carrier is achieved by pretreating the aluminum carrier with an alkaline, aqueous, alkali metal zincate composition containing a small amount of one or more water soluble iron, cobalt or nickel salts, and removing substantially all of the deposited zincate coating with acid prior to copper plating.

    9.
    发明专利
    未知

    公开(公告)号：SE7813171L

    公开(公告)日：1979-06-23

    申请号：SE7813171

    申请日：1978-12-21

    Applicant: GOULD INC

    Inventor： BERDAN B L ,  LUCE B M

    IPC: B32B15/04 ,  B32B15/08 ,  B32B15/092 ,  C23F1/00 ,  C25D3/12 ,  H05K1/09 ,  H05K3/06 ,  H05K3/38

    Abstract: A readily etchable printed circuit board is provided which comprises a resinous substrate having bonded to at least one surface thereof a composite metal structure. This metal structure includes a layer of copper foil having opposed first and second surfaces and a thin layer of nickel having opposed first and second surfaces with one of the surfaces of the copper foil being bonded to one of the surfaces of the nickel layer and the opposite opposed surface of the nickel layer being bonded to the resinous substrate with the nickel layer containing an effective amount of sulfur to render the copper foil and the nickel barrier layer mutually etchable, i.e., etchable by the same etchant. The preferred amount of sulfur ranges from about 0.05 to about 10.0 weight percent.

    CONDUCTING ELEMENT FOR PRINTED CIRCUIT AND METHOD OF MAKING SAME
    10.
    发明专利
    CONDUCTING ELEMENT FOR PRINTED CIRCUIT AND METHOD OF MAKING SAME 未知

    公开(公告)号：CA921174A

    公开(公告)日：1973-02-13

    申请号：CA60969

    申请日：1969-09-02

    Applicant: GOULD INC

    Inventor： LUCE B M ,  BERDAN B L

    IPC: B32B15/08 ,  H01B1/00 ,  H05K3/38

    Abstract: 1293802 Printed circuits CLEVITE CORP 30 Sept 1969 [3 Oct 1968] 28686/72 Divided out of 1293801 Heading H1R [Also in Division C7] The subject-matter disclosed is the same as that of Specification 1293801, but the claims are directed to the composite metal structure to serve as the conductor element of a printed circuit, and methods of making same.

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