METHOD FOR TEMPERATURE MANIPULATION OF A MELT
    2.
    发明申请
    METHOD FOR TEMPERATURE MANIPULATION OF A MELT 审中-公开
    法温度的影响熔体

    公开(公告)号:WO2007085398A3

    公开(公告)日:2007-10-18

    申请号:PCT/EP2007000509

    申请日:2007-01-22

    Abstract: A method and device are disclosed for temperature manipulation of a melt even with conductivity below 10 -1 O -1 cm -1 , thus permitting refining of the melt at temperatures above 1700 °C. According to the method for temperature manipulation of a melt (16), in particular, in a refiner unit, the melt (16) is heated at least by ohmic resistance heating, at least two electrodes (4) are arranged in the melt (16) and at least a part of the melt (16) is cooled. The device (1) for temperature manipulation and/or refining and/or purification and/or homogenisation of a melt (16) comprises at least one arrangement for accommodating melt material (36, 16), defining an inner chamber and at least two electrodes (4) for ohmic resistance heating of the melt (16), wherein the electrodes (4) project into the inner chamber of the arrangement in particular of the vessel (2).

    Abstract translation: 即使在的电导率创建用于熔体的温度操控的机会小于10 -1 0 -1 厘米 -1 和做熔液的精炼 以便能够在温度高于1700℃时,本发明提供了一种方法和永远装置,其中,根据用于在Läutereinheit影响的熔体(16)的温度,特别是,该方法预期数量的熔融物(16)至少由电阻的手段 电阻加热被加热,所述至少两个在熔体(16)电极(4)被布置并熔融的(16)的至少一部分被冷却,并且其中所述装置(1)用于影响温度和/或用于精炼和/或用于清洗和 /或熔体(16)至少限定用于接收熔化(36,16),以及至少两个电极的内部结构均质化(4)熔体的欧姆电阻加热(16)包括wobe 我突出在该装置的内部中的电极(4),特别是容器(2)的。

    METHOD FOR DEPOSITING PALLADIUM LAYERS AND PALLADIUM BATH THEREFOR
    3.
    发明申请
    METHOD FOR DEPOSITING PALLADIUM LAYERS AND PALLADIUM BATH THEREFOR 审中-公开
    用于钯层的分离和目的钯浴

    公开(公告)号:WO2006074902A3

    公开(公告)日:2006-08-31

    申请号:PCT/EP2006000164

    申请日:2006-01-11

    Abstract: The copper tracks of circuit supports require, for equipping with electronic components, a coating with a good corrosion resistance as well as with the ability of being repeatedly soldered or being bonded. These properties are fulfilled by a system of layers that contains an intermediate layer made of autocatalytically deposited nickel, on which a palladium layer is deposited by charge transfer. In order to ensure a reliable adhesion, a lack of pores and a good homogeneity, the bath for depositing the palladium layer contains a copper compound. In order to passivate the palladium layer, the system of layers can be provided with a final layer made of gold that is deposited by charge transfer and/or autocatalytically.

    Abstract translation: 在电路板上的铜迹线需要具有良好的耐腐蚀性为多个可焊性和可焊性的电子部件的组装的涂层以及适用性。 这些属性由包含在其上的钯层通过电荷交换沉积无电沉积镍的中间层的层系统达到。 为了确保可靠的粘附性,缺乏孔隙和浴的钯层的沉积的良好的均匀性含有铜,铊,硒或碲的化合物。 所述钯层的钝化,以最终层的层系统可以由通过电荷交换和/或自催化沉积的金提供。

    4.
    发明专利
    未知

    公开(公告)号:DE1704417U

    公开(公告)日:1955-08-11

    申请号:DEG0011455

    申请日:1955-04-07

    Applicant: GROSS ANDREAS

    Inventor: GROSS ANDREAS

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