Abstract:
A method and device are disclosed for temperature manipulation of a melt even with conductivity below 10 -1 O -1 cm -1 , thus permitting refining of the melt at temperatures above 1700 °C. According to the method for temperature manipulation of a melt (16), in particular, in a refiner unit, the melt (16) is heated at least by ohmic resistance heating, at least two electrodes (4) are arranged in the melt (16) and at least a part of the melt (16) is cooled. The device (1) for temperature manipulation and/or refining and/or purification and/or homogenisation of a melt (16) comprises at least one arrangement for accommodating melt material (36, 16), defining an inner chamber and at least two electrodes (4) for ohmic resistance heating of the melt (16), wherein the electrodes (4) project into the inner chamber of the arrangement in particular of the vessel (2).
Abstract:
The copper tracks of circuit supports require, for equipping with electronic components, a coating with a good corrosion resistance as well as with the ability of being repeatedly soldered or being bonded. These properties are fulfilled by a system of layers that contains an intermediate layer made of autocatalytically deposited nickel, on which a palladium layer is deposited by charge transfer. In order to ensure a reliable adhesion, a lack of pores and a good homogeneity, the bath for depositing the palladium layer contains a copper compound. In order to passivate the palladium layer, the system of layers can be provided with a final layer made of gold that is deposited by charge transfer and/or autocatalytically.