公开(公告)号：EP1021792A1

公开(公告)日：2000-07-26

申请号：EP98947625.4

申请日：1998-10-08

Applicant: GEMPLUS S.C.A.

Inventor： AYALA, Stéphane ,  BOURNEIX, Gérard ,  BEAUSOLEIL, Christine ,  MARTIN, David ,  ODDOU, Laurent ,  PATRICE, Philippe ,  ZAFRANY, Michael

IPC: G06K19/077

CPC classification number: G06K19/07769 ,  G06K19/07749 ,  G06K19/0775 ,  G06K19/07779 ,  G06K19/07783 ,  Y10T29/49002 ,  Y10T29/49016

Abstract: The invention concerns a method for making smart cards capable of operating with or without contact called mixed cards and contactless smart cards. In order to avoid the risk of deteriorating the antenna the method consists in producing an antenna comprising at least two turns, on a support sheet, said antenna having its turns located outside the connecting pads, and in providing an insulating bridge so as to connect each of the antenna ends to a connection pad respectively.

公开(公告)号：EP1021792B1

公开(公告)日：2008-03-19

申请号：EP98947625.4

申请日：1998-10-08

Applicant: GEMPLUS

Inventor： AYALA, Stéphane ,  BOURNEIX, Gérard ,  BEAUSOLEIL, Christine ,  MARTIN, David ,  ODDOU, Laurent ,  PATRICE, Philippe ,  ZAFRANY, Michael

IPC: G06K19/077

CPC classification number: G06K19/07769 ,  G06K19/07749 ,  G06K19/0775 ,  G06K19/07779 ,  G06K19/07783 ,  Y10T29/49002 ,  Y10T29/49016

Abstract: The invention concerns a method for making smart cards capable of operating with or without contact called mixed cards and contactless smart cards. In order to avoid the risk of deteriorating the antenna the method consists in producing an antenna comprising at least two turns, on a support sheet, said antenna having its turns located outside the connecting pads, and in providing an insulating bridge so as to connect each of the antenna ends to a connection pad respectively.

公开(公告)号：EP1201007A1

公开(公告)日：2002-05-02

申请号：EP00949641.5

申请日：2000-07-05

Applicant: Gemplus

Inventor： MARTIN, David ,  ODDOU, Laurent ,  ZAFRANY, Michael

IPC: H01Q1/22 ,  G06K19/077 ,  B64F5/00

CPC classification number: H01Q1/2208 ,  G06K19/07749 ,  H01Q1/22 ,  H01Q1/2225 ,  H01Q1/38 ,  H01Q7/00 ,  H05K1/165 ,  H05K3/064 ,  H05K2203/1476 ,  H05K2203/173

Abstract: The invention concerns an antenna for integrated circuit contactless cards, integrated circuit hybrid cards and/or electronic labels, characterised in that the antenna track (10) is longitudinally divided into sub-tracks (11, 12). The invention is applicable to integrated circuit contactless cards, integrated circuit hybrid cards and electronic labels.

公开(公告)号：EP1105839B1

公开(公告)日：2006-02-22

申请号：EP99939492.7

申请日：1999-08-24

Applicant: GEMPLUS

Inventor： MARTIN, David

IPC: G06K19/077

CPC classification number: H01Q1/2225 ,  G06K19/07749 ,  G06K19/0775 ,  H01Q1/22 ,  H01Q7/00 ,  H01Q23/00

Abstract: The invention concerns a method for making a contactless chip card comprising an electronic assembly (40) embedded in the card body (100). The method consists more particularly in embedding the electronic assembly into at least a hotmelt material film (11) having a surface identical to that of the card to be produced.

公开(公告)号：EP1201007B1

公开(公告)日：2003-05-21

申请号：EP00949641.5

申请日：2000-07-05

Applicant: Gemplus

Inventor： MARTIN, David ,  ODDOU, Laurent ,  ZAFRANY, Michael

IPC: H01Q1/22 ,  G06K19/077 ,  B64F5/00

CPC classification number: H01Q1/2208 ,  G06K19/07749 ,  H01Q1/22 ,  H01Q1/2225 ,  H01Q1/38 ,  H01Q7/00 ,  H05K1/165 ,  H05K3/064 ,  H05K2203/1476 ,  H05K2203/173

Abstract: The invention concerns an antenna for integrated circuit contactless cards, integrated circuit hybrid cards and/or electronic labels, characterised in that the antenna track (10) is longitudinally divided into sub-tracks (11, 12). The invention is applicable to integrated circuit contactless cards, integrated circuit hybrid cards and electronic labels.

公开(公告)号：EP1057139A1

公开(公告)日：2000-12-06

申请号：EP99903730.2

申请日：1999-02-10

Applicant: Gemplus

Inventor： ODDOU, Laurent ,  FREEMAN, Ray ,  AYALA, Stéphane ,  ZAFRANY, Michael ,  PATRICE, Philippe ,  BOURNEIX, Gérard ,  MARTIN, David

IPC: G06K19/077

CPC classification number: G06K19/0775 ,  G06K19/07749 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/10253 ,  H01L2924/00014 ,  H01L2924/00

Abstract: The invention concerns a contactless electronic device (10) such as a card, a label, a ticket or a token, comprising at least an electronic microcircuit (20) arranged in the thickness of a rigid or semirigid support and comprising pads (26) connected to an interface antenna (24) arranged in the thickness of the support, the latter comprising at least two opposite, lower (12) and upper (14), protective sheets. The invention is characterised in that it comprises a stack: of a lower protective sheet (12) whereof the inner face (22) bears at least one electronic microcircuit and at least one interface antenna (24); of an intermediate bonding sheet (14) whereof the two opposite faces lower and upper are provided with adhesive; and of an upper protective sheet (16).

公开(公告)号：EP1116177A1

公开(公告)日：2001-07-18

申请号：EP99946220.3

申请日：1999-09-22

Applicant: Gemplus

Inventor： MARTIN, David

IPC: G06K19/073

CPC classification number: G06K19/07726 ,  B65D75/00 ,  B65D2203/10 ,  G06K19/005 ,  G06K19/07327 ,  G06K19/07749 ,  G06K2017/0064

Abstract: The invention concerns a package for an integrated circuit card comprising electromagnetic remote communication means (16), including an envelope (20) enclosing the card (10). The invention is characterised in that the package comprises at least a barrier foil (24) in conductive material which is arranged opposite one face of the card (10) and extends substantially opposite said communication means (16).

公开(公告)号：EP1105839A1

公开(公告)日：2001-06-13

申请号：EP99939492.7

申请日：1999-08-24

Applicant: GEMPLUS

Inventor： MARTIN, David

IPC: G06K19/077

CPC classification number: H01Q1/2225 ,  G06K19/07749 ,  G06K19/0775 ,  H01Q1/22 ,  H01Q7/00 ,  H01Q23/00

Abstract: The invention concerns a method for making a contactless chip card comprising an electronic assembly (40) embedded in the card body (100). The method consists more particularly in embedding the electronic assembly into at least a hotmelt material film (11) having a surface identical to that of the card to be produced.