公开(公告)号：WO2002084587A1

公开(公告)日：2002-10-24

申请号：PCT/FR2002/001249

申请日：2002-04-10

Applicant: GEMPLUS ,  PATRICE, Philippe ,  AUDOUARD, Laurent

Inventor： PATRICE, Philippe ,  AUDOUARD, Laurent

IPC: G06K19/077

CPC classification number: G06K19/07732 ,  G06K19/077 ,  G06K19/07745 ,  H01L2924/0002 ,  H01L2924/00

Abstract: L'invention concerne un objet portable intelligent de format ISO 7816 comportant une interface 25 de communication et un corps de carte laminé dans lequel est logée la puce 28. Cette carte comporte au moins une mémoire 29 de stockage de données coopérant avec la puce 28, la mémoire 29 étant physiquement distincte de la puce 28 et logée dans le corps de carte X un emplacement situé X distance des lignes de flexion principales de la carte et dans la fibre neutre de la carte, et des entretoises assurant X proximité des composants dont la puce 28 et les mémoires 29, un contrôle local de la flexion de la carte.

Abstract translation: 本发明涉及一种ISO 7816格式的智能便携式物体，其包括通信接口（25）和容纳芯片（28）的层叠卡体。 所述卡至少包括与芯片（28）配合的数据存储单元（29），所述存储单元（29）与所述芯片（28）物理分离并且容纳在所述卡体中位于距离 从卡的主弯曲线和卡的中性纤维中提供的靠近包括芯片（28）和存储单元（29）的部件的间隔件对卡的弯曲进行局部控制。

公开(公告)号：WO2004054341A1

公开(公告)日：2004-06-24

申请号：PCT/FR2003/003533

申请日：2003-12-01

Applicant: GEMPLUS ,  CALVAS, Bernard ,  CHOMETTE, Michel ,  ELBAZ, Didier ,  PATRICE, Philippe

Inventor： CALVAS, Bernard ,  CHOMETTE, Michel ,  ELBAZ, Didier ,  PATRICE, Philippe

IPC: H05K5/02

CPC classification number: G06K7/0021 ,  G06K19/07741

Abstract: La présente invention propose un adaptateur (10) pour la connexion électrique d'une mini-carte (12) à circuit(s) intégré(s) dans un connecteur principal pour carte à mémoire électronique à circuit(s) intégré(s) à contact d'un encombrement supérieur à la mini-carte (12), la mini-carte (12) comportant des pistes de contact (14) en surface et ledit adaptateur (10) comportant un corps principal (22) apte à se connecter au connecteur principal et un logement (32) de réception de la mini-carte (12) débouchant à la surface du corps principal (22) et comportant à l'intérieur des plots de raccordement (36) aux contacts électriques (14) de la mini-carte (12), caractérisé en ce qu'il comporte un capot mobile (52) qui est susceptible d'occuper une position dans laquelle il ferme au moins partiellement le logement (32) en maintenant la mini-carte (12) en position de raccordement électrique dans le logement (32) et en rigidifiant la structure de l'adaptateur (10).

Abstract translation: 本发明涉及一种适配器（10），用于将主电子集成电路存储卡连接器中的集成电路微型卡（12）电连接到具有比微型卡（12），小型卡（12） ）包括表面接触条（14）和所述适配器（10），所述适配器（10）包括能够连接到所述主连接器的主体（22）和用于接收在所述主连接器的表面处出现的所述微型卡（12）的壳体（32） 主体（22）并且包括用于连接到微型卡（12）的电触点（14）的内部接合焊盘（36）。 本发明的特征在于它包括一个移动盖（52），该活动盖能够占据一个位置，其中至少部分地关闭壳体（32），同时保持小型卡（12）在壳体中的电连接位置（ 32）并加强适配器（10）的结构。

公开(公告)号：WO2003038746A1

公开(公告)日：2003-05-08

申请号：PCT/FR2002/003360

申请日：2002-10-02

Applicant: GEMPLUS ,  CALVAS, Bernard ,  PATRICE, Philippe ,  ELBAZ, Didier

Inventor： CALVAS, Bernard ,  PATRICE, Philippe ,  ELBAZ, Didier

IPC: G06K19/077

CPC classification number: G06K19/07747 ,  G06K19/077 ,  G06K19/07749 ,  G06K19/0775 ,  H01L2224/45144 ,  H01L2224/73204 ,  H01L2924/00

Abstract: L'invention comprend une étape 0) dans laquelle est réalisé un organe de raccordement électrique mâle (9) en saillie par rapport au module, et une étape iv) prévoit de relier électriquement cet organe de raccordement mâle (9) au plot de connexion (14) d'une puce (12) ainsi qu'à une interface de communication lorsque le module est logé dans la cavité (20) du corps de la carte.

Abstract translation: 本发明涉及一种可变形条，其集成在用于芯电连接的模块中。 本发明包括：步骤0），其中产生阳电气连接元件（9），所述元件相对于模块突出; 以及步骤iv），其中所述阳连接元件（9）电连接到芯片（12）的焊盘（14），并且当模块容纳在主体中的空腔（20）中时，连接到通信接口 卡。

公开(公告)号：WO2002084586A1

公开(公告)日：2002-10-24

申请号：PCT/FR2002/001079

申请日：2002-03-28

Applicant: GEMPLUS ,  PATRICE, Philippe ,  FIDALGO, Jean-Christophe ,  BRUNET, Olivier ,  CUENOT, Yves-Pierre

Inventor： PATRICE, Philippe ,  FIDALGO, Jean-Christophe ,  BRUNET, Olivier ,  CUENOT, Yves-Pierre

IPC: G06K19/077

CPC classification number: G06K19/0775 ,  G06K19/07743 ,  G06K19/07749 ,  H01L23/49855 ,  H01L24/24 ,  H01L24/25 ,  H01L24/82 ,  H01L2224/05553 ,  H01L2224/24011 ,  H01L2224/24051 ,  H01L2224/24105 ,  H01L2224/24225 ,  H01L2224/24226 ,  H01L2224/24998 ,  H01L2224/25175 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/76155 ,  H01L2224/82007 ,  H01L2224/82102 ,  H01L2224/92244 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01073 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/00

Abstract: La connexion électrique par dépôt de matière visqueuse d'une puce (3) à un plot d'interface (13) de communication prévoit: - le dépôt d'une barrière (14) de délimitation en matière isolante visqueuse, et délimitant sur une zone de raccordement (15; 20) sur la face active (7) de la puce, ses flancs et le substrat (4); puis- sur cette zone (15, 20), voire en empiétant sur la barrière (14), le dépôt d'une cordon (16) de matière conductrice visqueuse, qui relie les plot de sortie (6) et d'interface (13) pour les connecter électriquement.

Abstract translation: 本发明涉及通过将芯片（3）的粘性物质沉积到通信接口焊盘（13）上的电连接，其特征在于：用粘性绝缘材料沉积限定的隔离物（14），并且在连接区域（15） ，20）在所述芯片的主动面（7），其侧面和所述基板（4）上; 那么在所述区域（15,20）上甚至侵入到屏障（14）上，沉积粘结的导电材料的珠子（16），其连接输出垫片（6）和接口（13）以将它们电连接 。

公开(公告)号：EP1192592A1

公开(公告)日：2002-04-03

申请号：EP00938859.6

申请日：2000-05-30

Applicant: Gemplus

Inventor： CALVAS, Bernard ,  FIDALGO, Jean-Christophe ,  PATRICE, Philippe

IPC: G06K19/077

CPC classification number: H01L24/83 ,  G06K19/07743 ,  H01L23/49855 ,  H01L23/5388 ,  H01L24/29 ,  H01L24/48 ,  H01L2221/68313 ,  H01L2224/29101 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01058 ,  H01L2924/01061 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/0781 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: The invention concerns a method for mounting on a support (16) at least a microcircuit in the form of a chip (2) produced on a very thin semiconductor substrate. The invention is characterised in that it comprises, for the or each chip, the following steps: a) providing at the chip at least an interconnection point in the form of a bump contact (8) in weldable material, the bump contact having a welding surface in the same plane as at least one of the chip faces (2a); b) providing at the level of the support at least an interconnection pad (14a) designed to be welded with a corresponding bump contact of the chip; c) placing the welding face of the or of each bump contact of the chip opposite the or each corresponding interconnection pad of the support; and d) welding the or each bump contact of the chip with the or each corresponding interconnection pad of the support. The invention also concerns a device, such as a chip card, produced from a chip as defined at point a).

公开(公告)号：EP1116179A1

公开(公告)日：2001-07-18

申请号：EP99943021.8

申请日：1999-09-22

Applicant: Gemplus

Inventor： FIDALGO, Jean-Christophe ,  BRUNET, Olivier ,  FREEMAN, Ray ,  PATRICE, Philippe

IPC: G06K19/077 ,  G06K19/073

CPC classification number: G06K19/07726 ,  G06K19/073 ,  G06K19/07749 ,  G06K19/0775

Abstract: The invention concerns a contactless smart card comprising inhibiting means. It comprises a card body, an antenna (25) and, connected to said antenna connecting terminals (23, 24), an integrated circuit chip. Said card is characterised in particular in that the connecting terminals to the antenna are further connected to conductive via holes (28) emerging at the card surface, and the junction (26) based on an electrically conductive substance, designed to be removed by scraping when it is first used, is flush with the card surface and connects the conductive via holes.

公开(公告)号：EP1151471A1

公开(公告)日：2001-11-07

申请号：EP99963627.7

申请日：1999-12-23

Applicant: Gemplus

Inventor： BRUNET, Olivier ,  ELBAZ, Didier ,  CALVAS, Bernard ,  PATRICE, Philippe

IPC: H01L21/78

CPC classification number: H01L24/97 ,  H01L21/56 ,  H01L21/561 ,  H01L23/3171 ,  H01L23/3185 ,  H01L2224/83191 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01058 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14

Abstract: The invention concerns a method for protecting integrated circuit chips (100) of a silicon wafer (10) comprising the following steps: cutting out the silicon wafer (10) so as to disengage the chips from the integrated circuit; applying a fluid insulating material (150) on the rear surface (104) of the wafer so as to coat the flanks (106) of each chip (100) of the integrated circuit with a thin insulating layer. The insulating material may be applied by spraying, screen printing, dip coating, casting or any other means. The invention further concerns integrated circuit chips whereof the flanks are protected by an insulating material to prevent electrical malfunction caused by contact of a conductive material on the flanks of the chips.

公开(公告)号：EP1084482A1

公开(公告)日：2001-03-21

申请号：EP99923643.3

申请日：1999-05-31

Applicant: Gemplus

Inventor： FIDALGO, Jean, Christophe ,  ELBAZ, Didier ,  ZAFRANY, Micha[l ,  PATRICE, Philippe

IPC: G06K19/077

CPC classification number: G06K19/07747 ,  G06K19/07743 ,  G06K19/07745 ,  H01L21/56 ,  H01L23/3121 ,  H01L23/3135 ,  H01L23/49855 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/24226 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/14 ,  H01L2924/15151 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2224/85399

Abstract: The invention relates to a method for producing an integrated circuit, including a step whereby a module (12) is created and fixed on the body of a card (20) and provided with an integrated circuit (14) and contact pads (16). The invention is characterised in that the step in which the module (12) is created comprises a stage that consists in forming slots in a plate element (26) that is made from a conducting material, whereby said slots define at least partially the areas of the plate element (20) that will form the contact pads. The invention is also characterised by a subsequent step that consists in coating a lower face (32) of the plate element at least partially with adhesive matter (30) to enable the module (12) to be fixed to the body of the card (20) at a later stage.

公开(公告)号：EP1021792A1

公开(公告)日：2000-07-26

申请号：EP98947625.4

申请日：1998-10-08

Applicant: GEMPLUS S.C.A.

Inventor： AYALA, Stéphane ,  BOURNEIX, Gérard ,  BEAUSOLEIL, Christine ,  MARTIN, David ,  ODDOU, Laurent ,  PATRICE, Philippe ,  ZAFRANY, Michael

IPC: G06K19/077

CPC classification number: G06K19/07769 ,  G06K19/07749 ,  G06K19/0775 ,  G06K19/07779 ,  G06K19/07783 ,  Y10T29/49002 ,  Y10T29/49016

Abstract: The invention concerns a method for making smart cards capable of operating with or without contact called mixed cards and contactless smart cards. In order to avoid the risk of deteriorating the antenna the method consists in producing an antenna comprising at least two turns, on a support sheet, said antenna having its turns located outside the connecting pads, and in providing an insulating bridge so as to connect each of the antenna ends to a connection pad respectively.

公开(公告)号：EP0970437A1

公开(公告)日：2000-01-12

申请号：EP98914903.4

申请日：1998-03-09

Applicant: GEMPLUS S.C.A.

Inventor： ZAFRANY, Michael ,  PATRICE, Philippe

IPC: G06K19/077

CPC classification number: H01L24/25 ,  G06K19/07743 ,  H01L23/49855 ,  H01L24/24 ,  H01L24/45 ,  H01L24/48 ,  H01L24/82 ,  H01L2224/24011 ,  H01L2224/24051 ,  H01L2224/24105 ,  H01L2224/24146 ,  H01L2224/24225 ,  H01L2224/24226 ,  H01L2224/25175 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/484 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/73267 ,  H01L2224/76152 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01058 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/85399 ,  H01L2224/05599

Abstract: The invention concerns an electronic module, in particular designed to be fixed in an electronic device in the form of a card, comprising a medium (40) including at least a surface (44) provided with contact pads (46; 48; 50) and a microcircuit (56) which is fixed on said medium (40) and which comprises exit hubs (60, 62) each connected to a medium contact pad. The invention is characterised in that the connections (66, 68) between the exit hubs and the contact pads consist of a cord made of an adhesive conductive substance matching the relief of the medium. Advantageously, the conductive substance is a conductive isotropic adhesive.

Abstract translation: 电子模块具有在其下侧上形成有接触轨道（46,48,50）的支撑件（40）。 微电路模块（56）固定到支撑件的顶侧，并且具有各自连接到支撑件下侧的轨道之一的输出连接器（60,62）。 微电路模块上的连接器和接触轨道之间的连接由导电粘合剂材料条形成，导电粘合剂材料从连接器延伸到接触轨道。 理想情况下，粘合剂是一种各向同性的胶，它是导电的。