公开(公告)号：EP4290285A1

公开(公告)日：2023-12-13

申请号：EP22204103.0

申请日：2022-10-27

Applicant: GlobalFoundries U.S. Inc.

Inventor： Sporer, Ryan ,  Nummy, Karen ,  Donegan, Keith ,  Houghton, Thomas ,  Bian, Yusheng ,  Hirokawa, Takako ,  Giewont, Kenneth

IPC: G02B6/12

Abstract: An integrated circuit chip comprising: a substrate; an optical component above the substrate;
a first connection level above the substrate, the first connection level includes the optical component and a first cladding structure, wherein the optical component is covered by the first cladding structure; a second connection level on the first connection level; and a second cladding structure directly above the optical component, the second cladding structure having at least a section within the second connection level, the second cladding structure is on the first cladding structure.

公开(公告)号：EP4235242A1

公开(公告)日：2023-08-30

申请号：EP22199632.5

申请日：2022-10-04

Applicant: GlobalFoundries U.S. Inc.

Inventor： Bian, Yusheng ,  Polomoff, Nicholas ,  Donegan, Keith ,  Liu, Qizhi ,  Shank, Steven M.

IPC: G02B6/42 ,  G02B6/122

Abstract: Structures including an edge coupler, and methods of fabricating a structure that includes an edge coupler. The structure (10) includes an edge coupler having a waveguide core (12) with an end surface (14) and a longitudinal axis (18). The end surface (14) defines a plane tilted in a first direction at a first acute angle relative to the longitudinal axis (18) and tilted in a second direction at a second acute angle relative to the longitudinal axis (18). The second direction differs from the first direction.