公开(公告)号：US20240361545A1

公开(公告)日：2024-10-31

申请号：US18307151

申请日：2023-04-26

Applicant: GlobalFoundries U.S. Inc.

Inventor： Zhuojie Wu ,  Erdem Kaltalioglu

IPC: G02B6/42

CPC classification number: G02B6/4248 ,  H01L23/5283 ,  H01L23/53295 ,  H01L23/564

Abstract: A structure includes an integrated circuit (IC) chip including a substrate. An input/output (I/O) opening extends inwardly from an exterior surface of the IC chip. A metal finger structure protrudes partly into the I/O opening, and outer surfaces of the metal finger structure are covered by a moisture barrier. The metal finger structure may provide stress-relief by removing attacking surfaces for stress in the I/O opening and/or otherwise reduces stress, such as film stresses, to reduce damage to the moisture barrier and improve reliability compared to conventional devices.