公开(公告)号：US20240222356A1

公开(公告)日：2024-07-04

申请号：US18149279

申请日：2023-01-03

Applicant: GlobalFoundries U.S. Inc.

Inventor： James P. Mazza ,  Jia Zeng ,  Xuelian Zhu ,  Navneet K. Jain ,  Mahbub Rashed ,  Jacob Mazza

IPC: H01L27/02

CPC classification number: H01L27/0207

Abstract: A multi-row standard cell and an integrated circuit (IC) structure using the standard cell are provided. The IC structure includes a plurality of cell rows extending in a first direction. At least two cell rows of the plurality of cell rows have different row heights. The IC structure includes a multi-row standard cell positioned in two or more cell rows having different row heights. At least one active region is shared by portions of the multi-row cell across the at least two cell rows. The IC structure may also include one or more asymmetric shared power rails disposed in an asymmetric manner across a row boundary between the at least two cell rows of different row heights. The multi-row standard cells and IC structures allow placement of multi-row cells for mixed track height arrangements in a manner not limited to multiples of row heights.

公开(公告)号：US11061315B2

公开(公告)日：2021-07-13

申请号：US16191589

申请日：2018-11-15

Applicant: GLOBALFOUNDRIES U.S. Inc.

Inventor： Jia Zeng ,  Guillaume Bouche ,  Lei Sun ,  Geng Han

IPC: H01L21/00 ,  G03F1/24 ,  H01L21/033 ,  H01L21/311 ,  H01L21/3213 ,  H01L21/308

Abstract: Methods pattern a sacrificial material on an etch mask into mandrels using optical mask lithography, form a conformal material and a fill material on the mandrels, and planarize the fill material to the level of the conformal material. Such methods pattern the fill material into first mask features using extreme ultraviolet (EUV) lithography. These methods partially remove the conformal material to leave the conformal material on the sidewalls of the mandrels as second mask features. Spaces between the first mask features and the second mask features define an etching pattern. The spacing distance of the mandrels is larger than the spacing distance of the second mask features. Such methods transfer the etching pattern into the etch mask material, and subsequently transfer the etching pattern into an underlying layer. Openings in the underlying layer are filled with a conductor to form wiring in the etching pattern.

公开(公告)号：US12046651B2

公开(公告)日：2024-07-23

申请号：US17515914

申请日：2021-11-01

Applicant: GLOBALFOUNDRIES U.S. Inc.

Inventor： James P. Mazza ,  Elizabeth Strehlow ,  Motoi Ichihashi ,  Xuelian Zhu ,  Jia Zeng

IPC: H01L27/02 ,  H01L23/528 ,  H01L29/423

CPC classification number: H01L29/42376 ,  H01L23/5286

Abstract: The present disclosure relates to semiconductor structures and, more particularly, to a logic cell layout design for high density transistors and methods of manufacture. The structure includes a plurality of active gates in a high density transistor, and at least one dummy gate which is continuous and is adjacent to at least one active gate of the active gates in a multi-row cell of the high density transistor.

公开(公告)号：US20230132912A1

公开(公告)日：2023-05-04

申请号：US17515914

申请日：2021-11-01

Applicant: GLOBALFOUNDRIES U.S. Inc.

Inventor： James P. Mazza ,  Elizabeth Strehlow ,  Motoi Ichihashi ,  Xuelian Zhu ,  Jia Zeng

IPC: H01L29/423 ,  H01L23/528

Abstract: The present disclosure relates to semiconductor structures and, more particularly, to a logic cell layout design for high density transistors and methods of manufacture. The structure includes a plurality of active gates in a high density transistor, and at least one dummy gate which is continuous and is adjacent to at least one active gate of the active gates in a multi-row cell of the high density transistor.