公开(公告)号：US12292470B2

公开(公告)日：2025-05-06

申请号：US18172488

申请日：2023-02-22

Applicant: GlobalFoundries U.S. Inc.

Inventor： Zhuojie Wu ,  Yunyao Jiang

IPC: G01R31/28 ,  G02B6/12

Abstract: A structure provides a defect sensor for a cavity in an integrated circuit (IC). The structure includes a cavity defined in a substrate. A boundary is located where the cavity meets with a cavity-free area of the substrate. A metal line is arranged in a serpentine path in both a vertical and a horizontal direction and crosses the boundary. A controller may be provided that is configured to, in response to a change in an electrical characteristic of a signal through the metal line, generate an indication of the presence of a defect and/or change operation of at least one component of the IC. The structure may find application relative to a photonics integrated circuit (PIC) structure including an optical waveguide with a cavity under the optical waveguide.

公开(公告)号：US20240280632A1

公开(公告)日：2024-08-22

申请号：US18172488

申请日：2023-02-22

Applicant: GlobalFoundries U.S. Inc.

Inventor： Zhuojie Wu ,  Yunyao Jiang

IPC: G01R31/28 ,  G02B6/12

CPC classification number: G01R31/2884 ,  G02B6/12004

Abstract: A structure provides a defect sensor for a cavity in an integrated circuit (IC). The structure includes a cavity defined in a substrate. A boundary is located where the cavity meets with a cavity-free area of the substrate. A metal line is arranged in a serpentine path in both a vertical and a horizontal direction and crosses the boundary. A controller may be provided that is configured to, in response to a change in an electrical characteristic of a signal through the metal line, generate an indication of the presence of a defect and/or change operation of at least one component of the IC. The structure may find application relative to a photonics integrated circuit (PIC) structure including an optical waveguide with a cavity under the optical waveguide.

公开(公告)号：US20240356302A1

公开(公告)日：2024-10-24

申请号：US18136404

申请日：2023-04-19

Applicant: GlobalFoundries U.S. Inc.

Inventor： Zhuojie Wu ,  Koushik Ramachandran ,  Yunyao Jiang

IPC: H01S5/0237 ,  G02B6/12

CPC classification number: H01S5/0237 ,  G02B6/12 ,  G02B2006/12121

Abstract: Structures including a photonics chip and a cavity-mounted laser chip, and methods of forming such structures. The structure comprises a photonics chip including a substrate and a cavity in the substrate, a laser chip including a body inside the cavity, a first anchor disposed inside the cavity adjacent to a first corner of the body of the laser chip, and a second anchor disposed inside the cavity adjacent to a second corner of the body of the laser chip. The first and second anchors are configured to attach the laser chip to the photonics chip.