公开(公告)号：WO2018064806A1

公开(公告)日：2018-04-12

申请号：PCT/CN2016/101476

申请日：2016-10-08

Applicant: GOERTEK. INC

Inventor： ZOU, Quanbo ,  WENG, Denio ,  CHEN, Peixuan ,  FENG, Xiangxu

IPC: G02F1/1334 ,  G02F1/1333 ,  G02F1/13357

CPC classification number: H01L33/06 ,  H01L25/0753 ,  H01L25/167 ,  H01L27/1218 ,  H01L27/156 ,  H01L27/32 ,  H01L33/50 ,  H01L51/502 ,  H05B33/14 ,  H05B33/145

Abstract: A display device and an electronics apparatus are provided. The display device comprises: a display substrate (401)；and arrays (404, 405, 406) of light-emitting elements on the display substrate (401), wherein the light-emitting elements (404, 405, 406) include at least two types of electroluminescent quantum-dot LED, photoluminescent quantum-dot LED and micro-LED, wherein at least one type of the light-emitting elements is an electroluminescent quantum-dot LED, or at least two types of the light-emitting elements are micro-LED. According to an embodiment of this invention, the present invention can provide a display designer with more freedom of design.

Abstract translation: 提供了一种显示装置和一种电子设备。 该显示装置包括：显示基板（401）;以及在显示基板（401）上的发光元件阵列（404,405,406），其中发光元件（404,405,406）至少包括 两种电致发光量子点LED，光致发光量子点LED和微型LED，其中至少一种发光元件为电致发光量子点LED，或至少两种发光元件为 微LED。 根据本发明的一个实施例，本发明可以为显示设计者提供更多的设计自由度。

公开(公告)号：WO2019061171A1

公开(公告)日：2019-04-04

申请号：PCT/CN2017/104036

申请日：2017-09-28

Applicant: GOERTEK. INC

Inventor： ZOU, Quanbo

IPC: H01L33/00

Abstract: A micro-LED transfer method, manufacturing method and display device are disclosed. The method comprises: coating conductive photoresist(205) on a receiving substrate(201), wherein the conductive photoresist is positive-tone photoresist; bonding a carrier substrate(203) with the receiving substrate via the conductive photoresist, wherein metal electrodes(208) of micro-LEDs(206) on the carrier substrate are aligned with electrodes(204) on the receiving substrate and are bonded with the electrodes on the receiving substrate via the conductive photoresist, and the carrier substrate is a transparent substrate; selectively lifting-off micro-LEDs from the carrier substrate through laser lifting-off using a first laser; and separating the carrier substrate from the receiving substrate.

公开(公告)号：WO2018223389A1

公开(公告)日：2018-12-13

申请号：PCT/CN2017/087771

申请日：2017-06-09

Applicant: GOERTEK. INC

Inventor： ZOU, Quanbo

IPC: B81B7/02 ,  B81C1/00 ,  H04R19/04 ,  H04R31/00

CPC classification number: B81B7/0029 ,  B81B2201/0257 ,  B81B2207/012 ,  H04R19/005 ,  H04R19/04 ,  H04R31/006

Abstract: A MEMS microphone, a manufacturing method thereof and an electronic apparatus are disclosed. The MEMS microphone comprises: a MEMS microphone device including a MEMS microphone chip and a mesh membrane (402) monolithically integrated with the MEMS microphone chip; and a housing (411, 412) including an acoustic port (413), wherein the MEMS microphone device is mounted in the housing (411, 412), and the mesh membrane (402) is arranged between the MEMS microphone chip and the acoustic port (413) as a particle filter for the MEMS microphone chip. According to an embodiment, a relatively thin mesh filter can be provided to a MEMS microphone with relatively high reliability.

公开(公告)号：WO2018126480A1

公开(公告)日：2018-07-12

申请号：PCT/CN2017/070651

申请日：2017-01-09

Applicant: GOERTEK. INC

Inventor： CHEN, Peixuan ,  ZOU, Quanbo ,  FENG, Xiangxu

IPC: G03B21/20

Abstract: A projection module and an electronics apparatus are disclosed. The projection module comprises: a projection chip (301), having micro semiconductor light emitting devices thereon; and a projection lens unit (302), wherein the micro semiconductor light emitting devices produce projection light to create a projection image, and the projection lens unit receives the projection image and projects it to a projection surface. The size of a projection module can be reduced.

公开(公告)号：WO2018082100A1

公开(公告)日：2018-05-11

申请号：PCT/CN2016/104926

申请日：2016-11-07

Applicant: GOERTEK. INC

Inventor： ZOU, Quanbo

IPC: H01L33/36

Abstract: A micro-LED transfer method and manufacturing method. The micro-LED (303) transfer method comprises: bringing pickup units (305) of a transfer head in contact with micro-LEDs (303) on a carrier substrate (301), wherein the pickup units (305) are able to apply current to the micro-LEDs (303); applying current to the micro-LEDs (303) via the pickup units (305) to heat up bonding layers (302) between the micro-LEDs (303) and the carrier substrate (301) to be melted; picking up the micro-LEDs (303) from the carrier substrate (301) with the transfer head; bonding the micro-LEDs (303) onto a receiving substrate (307); and removing the transfer head from the micro-LEDs.

Abstract translation: 微型LED传输方法和制造方法。 微LED（303）传输方法包括：使传输头的拾取单元（305）与载体衬底（301）上的微型LED（303）接触，其中拾取单元（305）能够施加电流 到微型LED（303）; 通过拾取单元（305）向微型LED（303）施加电流以加热微型LED（303）和载体基板（301）之间的接合层（302）以被熔化; 用转移头从载体衬底（301）上拾取微型LED（303） 将所述微型LED（303）接合到接收基板（307）上; 并从微型LED中移除传输头。

公开(公告)号：WO2018064804A1

公开(公告)日：2018-04-12

申请号：PCT/CN2016/101474

申请日：2016-10-08

Applicant: GOERTEK. INC

Inventor： ZOU, Quanbo ,  WANG, Zhe ,  WANG, You ,  WANG, Xianbin

IPC: H04R1/08

Abstract: The present invention discloses a MEMS device and an electronics apparatus. The MEMS device comprises: a substrate; a MEMS element placed on the substrate; a cover encapsulating the MEMS element together with the substrate; and a port for the MEMS element to access outside, wherein the port is provided with a filter which has mesh holes and includes electrets to prevent particles from entering into the MEMS element.

Abstract translation: 本发明公开了一种MEMS器件和电子设备。 该MEMS器件包括：衬底; 放置在衬底上的MEMS元件; 将所述MEMS元件与所述衬底一起封装的盖; 以及用于MEMS元件进入外部的端口，其中该端口设置有过滤器，该过滤器具有网孔并且包括驻极体以防止微粒进入MEMS元件。

公开(公告)号：WO2017075766A1

公开(公告)日：2017-05-11

申请号：PCT/CN2015/093733

申请日：2015-11-03

Applicant: GOERTEK. INC

Inventor： ZOU, Quanbo ,  WANG, Zhe ,  LOKE, Yan

IPC: H04R29/00

CPC classification number: H04R31/00 ,  H04R2201/003

Abstract: The present invention discloses a MEMS microphone chip trimming method, apparatus, manufacturing method and microphone. The method for trimming MEMS microphone chips comprises: detecting a pull-in voltage distribution of MEMS microphone chips on a wafer; providing a mask based on the pull-in voltage distribution; and trimming the MEMS microphone chips on the wafer by using the mask.

Abstract translation: 本发明公开了一种MEMS麦克风芯片修整方法，装置，制造方法和麦克风。 微调MEMS麦克风芯片的方法包括：检测晶圆上的MEMS麦克风芯片的拉入电压分布; 基于拉入电压分布提供掩模; 并使用掩模修整晶圆上的MEMS麦克风芯片。

公开(公告)号：WO2017041253A1

公开(公告)日：2017-03-16

申请号：PCT/CN2015/089276

申请日：2015-09-09

Applicant: GOERTEK. INC

Inventor： ZOU, Quanbo ,  WANG, Zhe

IPC: H01L21/677 ,  H01L33/62

CPC classification number: H01L33/0095 ,  H01L24/03 ,  H01L25/0753 ,  H01L25/13 ,  H01L33/483 ,  H01L33/62 ,  H01L2224/83 ,  H01L2224/98 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2933/0066

Abstract: A repairing method, manufacturing method, device and electronics apparatus of micro-LED. The method for repairing a micro-LED comprises: bringing a known-good micro-LED (204) on a conductive pick-up head (205) into contact with a first pad on a defective position of a receiving substrate (209), wherein the conductive pick-up head (205) and the known-good micro-LED (204) are bonded via a conductive adhesive (206); locally joule heating a first bonding layer (214) through the conductive pick-up head (205), to melt the first bonding layer (214), wherein the first bonding layer (214) is provided between the known-good micro-LED (204) and the first pad; and lifting up the conductive pick-up head (205) after the first bonding layer (214) is cooled, leaving the known-good micro-LED (204) on the receiving substrate.

Abstract translation: 微型LED的修理方法，制造方法，装置和电子装置。 修复微型LED的方法包括：将导电拾取头（205）上的已知良好的微型LED（204）与接收衬底（209）的缺陷位置上的第一焊盘接触，其中 导电拾取头（205）和已知良好的微型LED（204）经由导电粘合剂（206）结合; 局部焦耳加热通过导电拾取头（205）的第一粘合层（214），以熔化第一粘合层（214），其中第一粘结层（214）设置在已知良好的微型LED（ 204）和第一垫; 以及在所述第一接合层（214）被冷却之后提起所述导电拾取头（205），将所述已知良好的微型LED（204）留在所述接收衬底上。

公开(公告)号：WO2018064805A1

公开(公告)日：2018-04-12

申请号：PCT/CN2016/101475

申请日：2016-10-08

Applicant: GOERTEK. INC

Inventor： ZOU, Quanbo ,  WANG, Zhe ,  CHEN, Peixuan ,  FENG, Xiangxu

IPC: H01L27/15 ,  H01L33/54 ,  G09F9/33

CPC classification number: H01L33/08 ,  G09F9/33 ,  H01L25/0753 ,  H01L33/38 ,  H01L33/42 ,  H01L33/54

Abstract: A display device and an electronics apparatus, the display device comprises: a display substrate (201, 301); and at least two stacked layers (202, 204, 206; 302, 304, 306) on the display substrate (201, 301), wherein each stacked layer (202, 204, 206; 302, 304, 306) includes one micro-LED array (208, 209, 210; 308, 309, 310). It may simplify the manufacture of a display device, compared to a prior art display device with similar display resolution.

Abstract translation: 显示装置和电子设备，所述显示装置包括：显示基板（201,301）;显示基板 和在所述显示基板（201,301）上的至少两个堆叠层（202,204,206; 302,304,306），其中每个堆叠层（202,204,206; 302,304,306） LED阵列（208,209,210; 308,309,310）。 与具有类似显示分辨率的现有技术显示设备相比，它可以简化显示设备的制造。

公开(公告)号：WO2018035669A1

公开(公告)日：2018-03-01

申请号：PCT/CN2016/096198

申请日：2016-08-22

Applicant: GOERTEK. INC

Inventor： ZOU, Quanbo

IPC: H04R19/04

Abstract: A capacitive MEMS microphone (20,30,43) and an electronic apparatus are provided. The capacitive MEMS microphone (20,30,43) comprises: a diaphragm (21,31); and a substrate (24,34), wherein a cavity (23,33) is formed between the diaphragm (21,31) and the substrate (24,34), and the cavity (23,33) is filed with an elastic body. The elastic body is adopted in the capacitive MEMS microphone to replace the air gap such that the SNR of the microphone is increased.

Abstract translation: 提供了一种电容式MEMS麦克风（20,30,43）和电子设备。 电容式MEMS麦克风（20,30,43）包括：隔膜（21,31）; 和衬底（24,34），其中在所述隔膜（21,31）和所述衬底（24,34）之间形成空腔（23,33），并且所述空腔（23,33）填充有弹性体 。 电容式MEMS麦克风采用弹性体来代替气隙，从而提高麦克风的信噪比。