Co-located NFC reader
    1.
    发明授权

    公开(公告)号:US09774085B2

    公开(公告)日:2017-09-26

    申请号:US14717172

    申请日:2015-05-20

    Applicant: Google Inc.

    Abstract: Systems and techniques are provided for a co-located NFC reader. A top conductive layer may include an inner PCB section, including a circuit for an electronic device, and an outer PCB section, including a near-field communications (NFC) chipset, separated by a gap in which an NFC antenna connected to the NFC chipset may be located. A substrate layer may include an inner PCB section and an outer PCB section separated by the gap. A bridge including a trace may cross the gap. A lower conductive layer may include an inner PCB section, including a circuit for the electronic device electrically connected to the circuit for the electronic device located on the inner PCB section of the top conductive layer, and an outer PCB section, including a circuit for the electronic device, separated by the gap.

    CO-LOCATED NFC READER
    3.
    发明申请
    CO-LOCATED NFC READER 有权
    协同NFC读取器

    公开(公告)号:US20160344102A1

    公开(公告)日:2016-11-24

    申请号:US14717172

    申请日:2015-05-20

    Applicant: Google Inc.

    Abstract: Systems and techniques are provided for a co-located NFC reader. A top conductive layer may include an inner PCB section, including a circuit for an electronic device, and an outer PCB section, including a near-field communications (NFC) chipset, separated by a gap in which an NFC antenna connected to the NFC chipset may be located. A substrate layer may include an inner PCB section and an outer PCB section separated by the gap. A bridge including a trace may cross the gap. A lower conductive layer may include an inner PCB section, including a circuit for the electronic device electrically connected to the circuit for the electronic device located on the inner PCB section of the top conductive layer, and an outer PCB section, including a circuit for the electronic device, separated by the gap.

    Abstract translation: 为同位置的NFC读取器提供了系统和技术。 顶部导电层可以包括内部PCB部分,其包括用于电子设备的电路,以及外部PCB部分,其包括近场通信(NFC)芯片组,所述近场通信(NFC)芯片组由连接到NFC芯片组的NFC天线间隔开 可能位于。 衬底层可以包括由间隙分开的内部PCB部分和外部PCB部分。 包括痕迹的桥梁可能会跨越这个空白。 下部导电层可以包括内部PCB部分,其包括用于电连接到位于顶部导电层的内部PCB部分上的电子设备的电路的电子设备的电路,以及外部PCB部分,其包括用于 电子设备,隔开间隔。

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