公开(公告)号：US10023953B2

公开(公告)日：2018-07-17

申请号：US14681660

申请日：2015-04-08

Applicant: H.C. Starck Inc.

Inventor： Patrick Hogan ,  Paul Aimone ,  Joseph Flanigan ,  Marcel Hagymasi ,  Helmut Haas

IPC: C23C14/34 ,  B22F3/02 ,  B22F3/15 ,  C23C14/14 ,  C22F1/18 ,  H01J37/34 ,  B22F1/00 ,  B22F3/12 ,  C22C1/04 ,  B22F3/10

Abstract: A method for making a sputtering target including steps of encapsulating and hot isostatically pressing at least one mass of metal powder (e.g., tantalum), having a particle size ranging from about 10 to about 1000 μm, with at least about 10 percent by weight of particles having a particle size greater than about 150 μm (for example, about 29 to about 56 percent (e.g., about 35 to about 47 percent) by weight of the particles in the at least one mass of metal powder having a particle size that is larger than 150 microns, but below about 250 μm), for defining at least a portion of a sputtering target body, having an essentially theoretical random and substantially uniform crystallographic texture.

公开(公告)号：US20150292081A1

公开(公告)日：2015-10-15

申请号：US14681660

申请日：2015-04-08

Applicant: H.C. Starck Inc.

Inventor： Patrick Hogan ,  Paul Aimone ,  Joseph Flanigan ,  Marcel Hagymasi ,  Helmut Haas

IPC: C23C14/34 ,  C23C14/14 ,  B22F3/15 ,  B22F9/16 ,  B22F1/00 ,  B22F3/02

CPC classification number: C23C14/3414 ,  B22F1/0014 ,  B22F3/02 ,  B22F3/1208 ,  B22F3/15 ,  B22F2003/1014 ,  C22C1/045 ,  C22F1/18 ,  C23C14/14 ,  H01J37/3426

Abstract: A method for making a sputtering target including steps of encapsulating and hot isostatically pressing at least one mass of metal powder (e.g., tantalum), having a particle size ranging from about 10 to about 1000 μm, with at least about 10 percent by weight of particles having a particle size greater than about 150 μm (for example, about 29 to about 56 percent (e.g., about 35 to about 47 percent) by weight of the particles in the at least one mass of metal powder having a particle size that is larger than 150 microns, but below about 250 μm), for defining at least a portion of a sputtering target body, having an essentially theoretical random and substantially uniform crystallographic texture.

Abstract translation: 一种用于制造溅射靶的方法，包括以下步骤：将至少一种具有约10至约1000μm的粒度的至少一种金属粉末（例如钽）与至少约10重量％的金属粉末 粒径大于约150μm的颗粒（例如，在至少一种质量的金属粉末中的颗粒的重量比例为约29至约56％（例如约35至约47％），其粒径为 大于150微米，但低于约250μm），用于限定溅射靶体的至少一部分，具有基本上理论上的随机和基本上均匀的晶体织构。

公开(公告)号：US10668566B2

公开(公告)日：2020-06-02

申请号：US15416253

申请日：2017-01-26

Applicant: H.C. STARCK INC.

Inventor： David B. Smathers ,  Patrick Hogan ,  Michael Thomas Stawovy ,  Maria B. Winnicka ,  Gary A. Rozak

IPC: B23K26/342 ,  B22F3/105 ,  B23K9/04 ,  B22F1/00 ,  B33Y70/00 ,  B22F3/02 ,  B22F7/06 ,  B23K15/00 ,  B23K26/00 ,  B23K35/02 ,  B23K35/32 ,  B23K35/40 ,  C22C30/00 ,  B21C1/02 ,  C22C27/02 ,  B21C23/00 ,  B22F5/12 ,  B33Y10/00 ,  B21C1/00 ,  C23F1/00

Abstract: In various embodiments, metallic wires are fabricated by combining one or more powders of substantially spherical metal particles with one or more powders of non-spherical particles within one or more optional metallic tubes. The metal elements within the powders (and the one or more tubes, if present) collectively define a high entropy alloy of five or more metallic elements or a multi-principal element alloy of four or more metallic elements.

公开(公告)号：US11198197B2

公开(公告)日：2021-12-14

申请号：US16857614

申请日：2020-04-24

Applicant: H.C. Starck Inc.

Inventor： David B. Smathers ,  Patrick Hogan ,  Michael Thomas Stawovy ,  Maria B. Winnicka ,  Gary A. Rozak

IPC: B23K26/342 ,  B23K9/04 ,  B22F1/00 ,  B22F10/20 ,  B33Y70/00 ,  B22F3/02 ,  B22F7/06 ,  B23K15/00 ,  B23K26/00 ,  B23K35/02 ,  B23K35/32 ,  B23K35/40 ,  C22C30/00 ,  B21C1/02 ,  C22C27/02 ,  B21C23/00 ,  B22F5/12 ,  B33Y10/00 ,  B21C1/00 ,  C23F1/00

Abstract: In various embodiments, metallic wires are fabricated by combining one or more powders of substantially spherical metal particles with one or more powders of non-spherical particles within one or more optional metallic tubes. The metal elements within the powders (and the one or more tubes, if present) collectively define a high entropy alloy of five or more metallic elements or a multi-principal element alloy of four or more metallic elements.

公开(公告)号：US11077524B2

公开(公告)日：2021-08-03

申请号：US15416254

申请日：2017-01-26

Applicant: H.C. STARCK INC.

Inventor： David B. Smathers ,  Patrick Hogan ,  Michael Thomas Stawovy ,  Maria B. Winnicka ,  Gary A. Rozak

IPC: B23K28/02 ,  B23K26/342 ,  G05B19/4097 ,  B23K9/04 ,  B23K15/00 ,  B23K26/00 ,  B23K35/02 ,  B22F1/00 ,  B22F10/20 ,  B33Y70/00 ,  B22F3/02 ,  B22F7/06 ,  B23K35/32 ,  B23K35/40 ,  C22C30/00 ,  B21C1/02 ,  C22C27/02 ,  B21C23/00 ,  B22F5/12 ,  B33Y10/00 ,  B21C1/00 ,  C23F1/00

Abstract: In various embodiments, additive manufacturing is utilized to fabricate three-dimensional metallic parts using metallic alloy wire as a feedstock material.

公开(公告)号：US20190032196A1

公开(公告)日：2019-01-31

申请号：US16012092

申请日：2018-06-19

Applicant: H.C. Starck Inc.

Inventor： Patrick Hogan ,  Paul Aimone ,  Joseph Flanigan ,  Marcel Hagymasi ,  Helmut Haas

IPC: C23C14/34 ,  C23C14/14 ,  B22F3/12 ,  C22F1/18 ,  B22F3/15 ,  C22C1/04 ,  H01J37/34 ,  B22F1/00 ,  B22F3/02

Abstract: A method for making a sputtering target including steps of encapsulating and hot isostatically pressing at least one mass of metal powder (e.g., tantalum), having a particle size ranging from about 10 to about 1000 μm, with at least about 10 percent by weight of particles having a particle size greater than about 150 μm (for example, about 29 to about 56 percent (e.g., about 35 to about 47 percent) by weight of the particles in the at least one mass of metal powder having a particle size that is larger than 150 microns, but below about 250 μm), for defining at least a portion of a sputtering target body, having an essentially theoretical random and substantially uniform crystallographic texture.