公开(公告)号：US20240027745A1

公开(公告)日：2024-01-25

申请号：US18224093

申请日：2023-07-20

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Tomoyuki IDE ,  Yuki MORINAGA ,  Mikito TAKAHASHI

IPC: G02B26/08

CPC classification number: G02B26/0816

Abstract: An optical module includes: a mirror unit including a mirror device including a movable mirror portion provided with a coil; and a magnet unit including a first magnet, a second magnet, and a third magnet arranged along a first direction, and generating a magnetic field acting on the movable mirror portion. The mirror unit is disposed on the magnet unit in a second direction perpendicular to the first direction, and has a bottom surface facing the magnet unit. A protrusion portion protruding to a magnet unit side is formed on the bottom surface. A width of the protrusion portion in the first direction is equal to or less than a width of the first magnet in the first direction. The mirror unit is fixed to an upper surface of the first magnet at the protrusion portion.

公开(公告)号：US20240059555A1

公开(公告)日：2024-02-22

申请号：US17766780

申请日：2020-08-24

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Daiki SUZUKI ,  Takahiro MATSUMOTO ,  Tomoyuki IDE ,  Mikito TAKAHASHI

IPC: B81C1/00 ,  G02B26/08

CPC classification number: B81C1/00825 ,  G02B26/0833 ,  B81C2201/0146 ,  B81C2201/0132

Abstract: A method for manufacturing a mirror device, the method includes a first step of preparing a wafer having a support layer and a device layer; a second step of forming a slit in the wafer such that the movable portion becomes movable with respect to the base portion by removing a part of each of the support layer and the device layer from the wafer by etching and forming a plurality of parts each corresponding to the structure in the wafer, after the first step; a third step of performing wet cleaning for cleaning the wafer using a cleaning liquid after the second step; and a fourth step of cutting out each of the plurality of parts from the wafer after the third step. In the second step, a circulation hole penetrating the wafer is formed at a part other than the slit in the wafer by the etching.

公开(公告)号：US20220363535A1

公开(公告)日：2022-11-17

申请号：US17765633

申请日：2020-08-27

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Daiki SUZUKI ,  Tomoyuki IDE ,  Mikito TAKAHASHI

IPC: B81C1/00 ,  G02B26/08

Abstract: A mirror device manufacturing method includes a forming step of forming a structure by forming a base portion, a movable portion, and a coupling portion coupling the base portion and the movable portion to each other such that the movable portion is able to swing with respect to the base portion through processing of a wafer, and forming a mirror layer in the movable portion; and a collecting step of performing collection of foreign substances from the structure using a collection member after the forming step. A mirror unit manufacturing method includes a sealing step of sealing the mirror device after the collecting step.

公开(公告)号：US20240092634A1

公开(公告)日：2024-03-21

申请号：US17766770

申请日：2020-08-24

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Daiki SUZUKI ,  Takahiro MATSUMOTO ,  Tomoyuki IDE ,  Mikito TAKAHASHI

IPC: B81C1/00 ,  G02B26/08

CPC classification number: B81C1/00142 ,  B81C1/00952 ,  G02B26/0833 ,  B81C2201/0112 ,  B81C2201/0132 ,  B81C2201/0133

Abstract: A method for manufacturing a mirror device, the method includes a first step of preparing a wafer having a support layer, a device layer, and an intermediate layer; a second step of forming a slit in the wafer such that the movable portion becomes movable with respect to the base portion by removing a part of each of the support layer, the device layer, and the intermediate layer from the wafer and forming a plurality of parts each corresponding to the structure in the wafer, after the first step; a third step of performing wet cleaning using a cleaning liquid after the second step; and a fourth step of cutting out each of the plurality of parts from the wafer after the third step. In the second step, a part of the intermediate layer is removed from the wafer by anisotropic etching.

公开(公告)号：US20240027747A1

公开(公告)日：2024-01-25

申请号：US18224090

申请日：2023-07-20

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Tomoyuki IDE ,  Yuki MORINAGA ,  Mikito TAKAHASHI

IPC: G02B26/08

CPC classification number: G02B26/085

Abstract: An optical module includes: a mirror unit; and a magnet unit including first, second, and third magnets arranged along a first direction. The mirror unit is disposed on the magnet unit in a second direction perpendicular to the first direction. A width of the first magnet is equal to or more than widths of the second and third magnets. An upper surface of the first magnet is located on a mirror unit side with respect to upper surfaces of the second and third magnets in the second direction, or is located at the same position as one of the upper surfaces of the second and third magnets and on the mirror unit side with respect to the other of the upper surfaces of the second and third magnets in the second direction. The mirror unit is fixed to at least the upper surface of the first magnet.

公开(公告)号：US20240002219A1

公开(公告)日：2024-01-04

申请号：US18037142

申请日：2021-09-15

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Tomoyuki IDE ,  Daiki SUZUKI ,  Mikito TAKAHASHI

IPC: B81C1/00 ,  G02B26/08 ,  B81C99/00

CPC classification number: B81C1/00666 ,  G02B26/0833 ,  B81C1/00888 ,  B81C99/004

Abstract: A method for manufacturing a mirror device is a method for manufacturing a mirror device including a structural body that includes a support portion, a movable portion, and a coupling portion, and a mirror layer provided on the movable portion. The method for manufacturing a mirror device includes: a first forming step of forming a plurality of parts on a wafer, each of the plurality of parts corresponding to the structural body; a second forming step of forming the mirror layer on a part of each of the plurality of parts, the part corresponding to the movable portion; a heating step of heating the part of each of the plurality of parts, corresponding to the movable portion, after the first forming step and the second forming step; and a cutting step of cutting the wafer to separate the plurality of parts from one another, after the heating step.