公开(公告)号：WO0250901A3

公开(公告)日：2003-09-12

申请号：PCT/US0147637

申请日：2001-12-11

Applicant: HARRIS CORP

Inventor： NEWTON CHARLES M ,  PIKE RANDY T ,  GASSMAN RICHARD A

IPC: B81B1/00 ,  F25D9/00 ,  H01L23/34 ,  H01L23/44 ,  H01L23/473 ,  H01L23/427 ,  H01L23/433

CPC classification number: H01L23/34 ,  H01L23/4735 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/00

Abstract: An electronic device includes a package surrounding at least one integrated circuit, a microfluidic cooler in the package, and a controller for controlling the micro-fluidic cooler so that the cooling fluid provides evaporative cooling, such as droplet impingement cooling. The electronic device may comprise a power consumption sensor connected to teh at least one integrated circuit, and the controller may control the micro-fluidic cooler responsive to the power consumption sensor. A temperature sensor may be connected to the at least one integrated circuit, and the controller may control the micro-fluidic cooler responsive to the sensed temperature. The microfluidic cooler may comprise at least one droplet generator for generating and impinging droplets of cooling fluid onto the integrated circuit. The at least one droplet generator may comprise at least one micro-electomechanical (MEMs) pump. The electronic device may also include at least one heat exchanger crried by the package and connected in fluid communication with the micro-fluidic cooler. The package may have a parallelepiped shape with a first pair of opposing major surfaces, a second pair of opposing side surfaces and a third pair of opposing end surfaces. In these embodiments, the at least one heat exchanger may preferably comprise a pair of heat exchangers coupled to the second pair of opposing side surfaces.

Abstract translation: 电子设备包括围绕至少一个集成电路的封装，封装中的微流体冷却器，以及用于控制微流体冷却器的控制器，使得冷却流体提供蒸发冷却，例如液滴冲击冷却。 电子设备可以包括连接到至少一个集成电路的功率消耗传感器，并且控制器可以响应于功耗传感器来控制微流体冷却器。 温度传感器可以连接到至少一个集成电路，并且控制器可以响应于所感测的温度来控制微流体冷却器。 微流体冷却器可以包括至少一个液滴发生器，用于产生和撞击集成电路上的冷却流体液滴。 至少一个液滴发生器可以包括至少一个微电子机械（MEM）泵。 该电子设备还可以包括至少一个热交换器，该热交换器被封装并且与微流体冷却器流体连通地连接。 包装可以具有平行六面体形状，其具有第一对相对的主表面，第二对相对的侧表面和第三对相对的端表面。 在这些实施例中，至少一个热交换器可以优选地包括耦合到第二对相对侧表面的一对热交换器。

公开(公告)号：AU2606502A

公开(公告)日：2002-07-01

申请号：AU2606502

申请日：2001-12-11

Applicant: HARRIS CORP

Inventor： NEWTON CHARLES M ,  PIKE RANDY T ,  GASSMAN RICHARD A

IPC: B81B1/00 ,  F25D9/00 ,  H01L23/34 ,  H01L23/44 ,  H01L23/473 ,  H01L23/427 ,  H01L23/433

Abstract: An electronic device includes a package surrounding at least one integrated circuit, a micro-fluidic cooler in the package, and a controller for controlling the micro-fluidic cooler so that the cooling fluid provides evaporative cooling, such as droplet impingement cooling. The electronic device may comprise a power consumption sensor connected to the at least one integrated circuit, and the controller may control the micro-fluidic cooler responsive to the power consumption sensor. A temperature sensor may be connected to the at least one integrated circuit, and the controller may control the micro-fluidic cooler responsive to the sensed temperature. The micro-fluidic cooler may comprise at least one droplet generator for generating and impinging droplets of cooling fluid onto the integrated circuit. The at least one droplet generator may comprise at least one micro-electromechanical (MEMs) pump. The electronic device may also include at least one heat exchanger carried by the package and connected in fluid communication with the micro-fluidic cooler. The package may have a parallelepiped shape with a first pair of opposing major surfaces, a second pair of opposing side surfaces and a third pair of opposing end surfaces. In these embodiments, the at least one heat exchanger may preferably comprise a pair of heat exchangers coupled to the second pair of opposing side surfaces.