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    Multi-functional structural circuit
    1.
    发明专利
    Multi-functional structural circuit 有权
    多功能结构电路

    公开(公告)号：JP2011176318A

    公开(公告)日：2011-09-08

    申请号：JP2011044569

    申请日：2011-03-02

    Applicant: Harris Corp ,  ハリス コーポレイションHarris Corporation

    Inventor： SMITH C W SINJIN ,  JAYNES PAUL B ,  NEWTON CHARLES M

    IPC: H05K3/00 ,  B29C51/00 ,  H05K3/28

    CPC classification number: H05K3/0014 ,  H05K1/0366 ,  H05K2201/0141 ,  H05K2201/0323 ,  H05K2201/09018 ,  H05K2201/091 ,  H05K2203/1105 ,  H05K2203/302 ,  Y10S156/924 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49147 ,  Y10T29/49158 ,  Y10T156/1189 ,  Y10T428/10 ,  Y10T428/1005

    Abstract: PROBLEM TO BE SOLVED: To provide a multi-functional structural circuit, referred to as a structural circuit, and to provide a manufacturing method. SOLUTION: The manufacturing method include the steps of: forming an electronic circuit on a liquid crystal polymer (LCP) substrate 100; forming a structural element 120 functioning as at least a part of a load-resisting frame member of a structure; forming a stack of two layers including the structural element 120 and LCP substrate 100; arranging the stack on a surface of a metal mold having a three-dimensional shape; forming a single united composite structural circuit including the load-resisting frame member and electronic circuit by executing a single thermoforming step so that a shape of the structural element 120 and LCP substrate 100 may conform to the three-dimensional shape; and attaching at least one component to a surface of the electronic circuit of the composite structural circuit. COPYRIGHT: (C)2011,JPO&INPIT

    Abstract translation: 要解决的问题：提供一种称为结构电路的多功能结构电路，并提供制造方法。 解决方案：制造方法包括以下步骤：在液晶聚合物（LCP）基板100上形成电子电路; 形成用作结构的耐负荷框架构件的至少一部分的结构元件120; 形成包括结构元件120和LCP基板100的两层的堆叠; 将所述堆叠布置在具有三维形状的金属模具的表面上; 通过执行单个热成形步骤形成包括耐负荷框架构件和电子电路的单一组合复合结构电路，使得结构元件120和LCP衬底100的形状可以符合三维形状; 以及将至少一个部件附接到复合结构电路的电子电路的表面。 版权所有（C）2011，JPO＆INPIT

    ELECTRONIC DEVICE USING EVAPORATIVE MICRO-COOLING AND ASSOCIATED METHODS
    2.
    发明申请
    ELECTRONIC DEVICE USING EVAPORATIVE MICRO-COOLING AND ASSOCIATED METHODS 审中-公开
    使用蒸发微冷却的电子设备及相关方法

    公开(公告)号：WO0250901A3

    公开(公告)日：2003-09-12

    申请号：PCT/US0147637

    申请日：2001-12-11

    Applicant: HARRIS CORP

    Inventor： NEWTON CHARLES M ,  PIKE RANDY T ,  GASSMAN RICHARD A

    IPC: B81B1/00 ,  F25D9/00 ,  H01L23/34 ,  H01L23/44 ,  H01L23/473 ,  H01L23/427 ,  H01L23/433

    CPC classification number: H01L23/34 ,  H01L23/4735 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/00

    Abstract: An electronic device includes a package surrounding at least one integrated circuit, a microfluidic cooler in the package, and a controller for controlling the micro-fluidic cooler so that the cooling fluid provides evaporative cooling, such as droplet impingement cooling. The electronic device may comprise a power consumption sensor connected to teh at least one integrated circuit, and the controller may control the micro-fluidic cooler responsive to the power consumption sensor. A temperature sensor may be connected to the at least one integrated circuit, and the controller may control the micro-fluidic cooler responsive to the sensed temperature. The microfluidic cooler may comprise at least one droplet generator for generating and impinging droplets of cooling fluid onto the integrated circuit. The at least one droplet generator may comprise at least one micro-electomechanical (MEMs) pump. The electronic device may also include at least one heat exchanger crried by the package and connected in fluid communication with the micro-fluidic cooler. The package may have a parallelepiped shape with a first pair of opposing major surfaces, a second pair of opposing side surfaces and a third pair of opposing end surfaces. In these embodiments, the at least one heat exchanger may preferably comprise a pair of heat exchangers coupled to the second pair of opposing side surfaces.

    Abstract translation: 电子设备包括围绕至少一个集成电路的封装，封装中的微流体冷却器，以及用于控制微流体冷却器的控制器，使得冷却流体提供蒸发冷却，例如液滴冲击冷却。 电子设备可以包括连接到至少一个集成电路的功率消耗传感器，并且控制器可以响应于功耗传感器来控制微流体冷却器。 温度传感器可以连接到至少一个集成电路，并且控制器可以响应于所感测的温度来控制微流体冷却器。 微流体冷却器可以包括至少一个液滴发生器，用于产生和撞击集成电路上的冷却流体液滴。 至少一个液滴发生器可以包括至少一个微电子机械（MEM）泵。 该电子设备还可以包括至少一个热交换器，该热交换器被封装并且与微流体冷却器流体连通地连接。 包装可以具有平行六面体形状，其具有第一对相对的主表面，第二对相对的侧表面和第三对相对的端表面。 在这些实施例中，至少一个热交换器可以优选地包括耦合到第二对相对侧表面的一对热交换器。

    A SYSTEM AND METHOD FOR NON-DESTRUCTIVE DECONTAMINATION OF SENSITIVE ELECTRONICS USING SOFT X-RAY RADIATION
    5.
    发明申请
    A SYSTEM AND METHOD FOR NON-DESTRUCTIVE DECONTAMINATION OF SENSITIVE ELECTRONICS USING SOFT X-RAY RADIATION 审中-公开
    利用软X射线辐射对敏感电子进行非破坏性去噪的系统和方法

    公开(公告)号：WO2008134099A3

    公开(公告)日：2008-12-24

    申请号：PCT/US2008051893

    申请日：2008-01-24

    Applicant: HARRIS CORP

    Inventor： DESALVO JOHN R ,  NEWTON CHARLES M ,  SILFVAST WILLIAM T ,  SHIMKAVEG GREGORY M

    IPC: A61L2/08

    CPC classification number: A61L2/08 ,  A61L2/082

    Abstract: A method is provided for decontaminating biological pathogens residing in an enclosure of an electronic device. The method includes: identifying materials used to encase the enclosure of the electronic device; tailoring x-ray radiation to penetrate the materials encasing the enclosure; and directing x-ray radiation having a diffused radiation angle towards the electronic device.

    Abstract translation: 提供了一种净化存在于电子设备外壳中的生物病原体的方法。 该方法包括：识别用于包裹电子设备的外壳的材料; 调整X射线辐射以穿透包围外壳的材料; 以及将具有漫射辐射角的X射线辐射导向电子设备。

    SOFT X-RAY RADIATION FOR BIOLOGICAL PATHOGEN DECONTAMINATION AND MEDICAL STERILIZATION APPLICATIONS
    6.
    发明申请
    SOFT X-RAY RADIATION FOR BIOLOGICAL PATHOGEN DECONTAMINATION AND MEDICAL STERILIZATION APPLICATIONS 审中-公开
    用于生物病原体去污染和医学灭菌应用的软X射线辐射

    公开(公告)号：WO2008027819A3

    公开(公告)日：2008-06-19

    申请号：PCT/US2007076860

    申请日：2007-08-27

    Applicant: HARRIS CORP

    Inventor： DESALVO JOHN RICHARD ,  NEWTON CHARLES M ,  GAMLEN CAROL ANN ,  SILFVAST WILLIAM THONAS ,  SHIMKAVEG GREGORY MICHAEL

    IPC: A61L2/08

    CPC classification number: A61L2/082 ,  A61L2/0011

    Abstract: A method is provided for decontaminating biological pathogens in a contaminated environment. The method includes: tailoring x-ray radiation to match the absorption characteristics of a contaminated environment; generating x-ray radiation having a diffused radiation angle in accordance with the absorption characteristics of the contaminated environment; and directing the x-ray radiation towards the contaminated environment.

    Abstract translation: 提供了一种用于净化污染环境中的生物病原体的方法。 该方法包括：调整X射线辐射以匹配污染环境的吸收特性; 根据污染环境的吸收特性产生具有扩散辐射角的X射线辐射; 并将X射线辐射引向受污染的环境。

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